WO2016158348A1 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- WO2016158348A1 WO2016158348A1 PCT/JP2016/057981 JP2016057981W WO2016158348A1 WO 2016158348 A1 WO2016158348 A1 WO 2016158348A1 JP 2016057981 W JP2016057981 W JP 2016057981W WO 2016158348 A1 WO2016158348 A1 WO 2016158348A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- phase
- polishing pad
- foamed polyurethane
- diisocyanate
- nmr measurement
- Prior art date
Links
- 239000004814 polyurethane Substances 0.000 claims abstract description 30
- 229920002635 polyurethane Polymers 0.000 claims abstract description 30
- 230000018199 S phase Effects 0.000 claims abstract description 24
- 238000005498 polishing Methods 0.000 claims description 24
- 238000005481 NMR spectroscopy Methods 0.000 claims description 22
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 8
- 239000011496 polyurethane foam Substances 0.000 claims description 8
- 229920005862 polyol Polymers 0.000 description 20
- 150000003077 polyols Chemical class 0.000 description 17
- -1 polymethylene Polymers 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 13
- 239000000047 product Substances 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 5
- 239000004088 foaming agent Substances 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 150000002894 organic compounds Chemical class 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 241001112258 Moca Species 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000005415 magnetization Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- CQSQUYVFNGIECQ-UHFFFAOYSA-N 1-n,4-n-dimethyl-1-n,4-n-dinitrosobenzene-1,4-dicarboxamide Chemical compound O=NN(C)C(=O)C1=CC=C(C(=O)N(C)N=O)C=C1 CQSQUYVFNGIECQ-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- HRTIPDVGYHDWBP-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;nonane-1,9-diol Chemical compound OCC(C)(C)CO.OCCCCCCCCCO HRTIPDVGYHDWBP-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- HQCHAOKWWKLXQH-UHFFFAOYSA-N 2,6-Dichloro-para-phenylenediamine Chemical compound NC1=CC(Cl)=C(N)C(Cl)=C1 HQCHAOKWWKLXQH-UHFFFAOYSA-N 0.000 description 1
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- BSYVFGQQLJNJJG-UHFFFAOYSA-N 2-[2-(2-aminophenyl)sulfanylethylsulfanyl]aniline Chemical compound NC1=CC=CC=C1SCCSC1=CC=CC=C1N BSYVFGQQLJNJJG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- TXDBDYPHJXUHEO-UHFFFAOYSA-N 2-methyl-4,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(SC)=C(N)C(C)=C1N TXDBDYPHJXUHEO-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 1
- PPUHQXZSLCCTAN-UHFFFAOYSA-N 4-[(4-amino-2,3-dichlorophenyl)methyl]-2,3-dichloroaniline Chemical compound ClC1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1Cl PPUHQXZSLCCTAN-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 1
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- JKJWYKGYGWOAHT-UHFFFAOYSA-N bis(prop-2-enyl) carbonate Chemical compound C=CCOC(=O)OCC=C JKJWYKGYGWOAHT-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000005676 cyclic carbonates Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- NPANDVNCRMZSFT-UHFFFAOYSA-N propane-1,2-diol;propane-1,3-diol Chemical compound CC(O)CO.OCCCO NPANDVNCRMZSFT-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009774 resonance method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/14—Manufacture of cellular products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3212—Polyhydroxy compounds containing cycloaliphatic groups
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- C—CHEMISTRY; METALLURGY
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- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/7806—Nitrogen containing -N-C=0 groups
- C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
- C08G18/7837—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing allophanate groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/797—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing carbodiimide and/or uretone-imine groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2101/00—Manufacture of cellular products
Definitions
- the present invention relates to a polishing pad.
- a polishing pad formed of foamed polyurethane is widely used to polish an object to be polished such as a silicon wafer used as a semiconductor substrate (for example, Patent Document 1).
- the conventional polishing pad generates frictional heat when an object to be polished is polished with the polishing pad, and as a result, the hardness changes due to this frictional heat. Therefore, the conventional polishing pad has a problem that the object to be polished cannot be sufficiently polished or the object to be polished may be damaged, and the object to be polished cannot be stably polished.
- an object of the present invention is to provide a polishing pad having a small change in hardness due to a temperature change.
- the present invention is formed of foamed polyurethane, It is a polishing pad in which the content ratio of the S phase in the polyurethane foam exceeds 70%, which is determined by pulse NMR measurement at 25 ° C.
- the ratio of the S phase content in is 80% or more.
- the polishing pad of this embodiment is formed of foamed polyurethane.
- the content ratio of the S phase in the polyurethane foam obtained by pulse NMR measurement at 25 ° C. exceeds 70%, preferably 80 to 100%, more preferably 90 to 100%.
- the polyurethane foam is divided into a (M phase) and a phase (long phase) (L phase) having a spin-spin relaxation time of 0.2 ms or more, and the content of each phase is determined.
- the spin-spin relaxation time can be obtained, for example, by performing measurement by the Solid Echo method using “JNM-MU25” manufactured by JEOL.
- the spin-spin relaxation time (T 2 ) Is obtained based on the following equation.
- W represents a Weibull coefficient.
- the Weibull coefficient of the i component is W i.
- a crystal phase is mainly observed as S phase in pulse NMR measurement, and an amorphous phase is mainly observed as L phase.
- the hard segment portion is mainly observed as the S phase in the pulse NMR measurement, and the soft segment portion is mainly observed as the L phase.
- various foamed polyurethanes with various "crystal phase ratios" and "hard segment part ratios” are known. The “ratio of hard segment portion” can be increased by increasing the number of urethane bonds and urea bonds. The foamed polyurethane material will be described later.
- the amount of short-chain diol for example, diethylene glycol (DEG), low molecular weight polyethylene glycol (PEG), etc.
- DEG diethylene glycol
- PEG low molecular weight polyethylene glycol
- MOCA 4,4′-methylenebis (2-chloroaniline)
- the amount of MOCA used is increased or the heating temperature for the reaction is lowered. By doing so, the urea bond can be increased.
- the hard segments can easily approach each other, and the “ratio of crystallization phase” can be increased. Therefore, the content ratio of the S phase can be increased by increasing the ratio of the crystal phase or increasing the ratio of the hard segment portion.
- the ratio of the S phase content in the foamed polyurethane, determined by pulse NMR measurement at 60 ° C., to the S phase content in the foamed polyurethane as determined by pulsed NMR measurement at 25 ° C. is preferably 80%. Above, more preferably 90 to 100%.
- the foamed polyurethane can be obtained by mixing and heating an isocyanate group-containing compound containing an isocyanate group, an active hydrogen-containing organic compound containing active hydrogen, and a foaming agent.
- isocyanate group-containing compound for example, aromatic diisocyanate, aliphatic diisocyanate, alicyclic diisocyanate and the like can be used.
- isocyanate group containing compounds the thing which combined the single thing or multiple things can be used.
- aromatic diisocyanate examples include crude diphenylmethane diisocyanate (crude MDI) obtained by, for example, reacting an amine mixture obtained by condensing aniline and formaldehyde with phosgene in an inert solvent, and purifying the crude MDI.
- Crude MDI crude diphenylmethane diisocyanate
- polymethylene polyphenylene polyisocyanate polymeric MDI
- modified products thereof can be used
- tolylene diisocyanate (TDI) 1,5-naphthalene diisocyanate
- xylylene diisocyanate 1,3-phenylene diisocyanate
- 1,4-phenylene diisocyanate and the like can be used.
- these aromatic diisocyanates can be used alone or in combination.
- modified product of diphenylmethane diisocyanate examples include a carbodiimide modified product, a urethane modified product, an allophanate modified product, a urea modified product, a burette modified product, an isocyanurate modified product, and an oxazolidone modified product.
- modified products include carbodiimide-modified diphenylmethane diisocyanate (carbodiimide-modified MDI).
- aliphatic diisocyanate examples include ethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 1,6-hexamethylene diisocyanate.
- diphenylmethane diisocyanate diphenylmethane diisocyanate (pure MDI), polymeric MDI, or a modified product thereof is preferable because it has a lower vapor pressure and is less likely to volatilize, and is easy to control the working environment.
- carbodiimide-modified MDI, polymeric MDI, or a mixture of these with MDI is preferable in that the viscosity is lower and the handling is easier.
- the active hydrogen-containing organic compound is an organic compound having in its molecule an active hydrogen group that can react with an isocyanate group.
- Specific examples of the active hydrogen group include functional groups such as a hydroxy group, a primary amino group, a secondary amino group, and a thiol group.
- the active hydrogen-containing organic compound includes the functional group in the molecule. You may have only 1 type of group and you may have multiple types of this functional group in a molecule
- the active hydrogen-containing organic compound for example, a polyol compound having a plurality of hydroxy groups in the molecule, a polyamine compound having a plurality of primary amino groups or secondary amino groups in the molecule, and the like can be used.
- polyol compound examples include polyhydric alcohols having a molecular weight of 400 or less, polyol prepolymers having a molecular weight exceeding 400, and the like.
- polyhydric alcohol having a molecular weight of 400 or less examples include ethylene glycol, propylene glycol 1,3-propanediol, 1,3-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, Linear fat such as 1,6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol having a molecular weight of 400 or less, 1,8-octanediol, 1,9-nonanediol Neopentyl glycol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, 2-methyl -1,8-octanedio Branched aliphatic glycols such as 1,4-
- polystyrene resin examples include polyether polyol, polyester polyol, polyester polycarbonate polyol, and polycarbonate polyol.
- polyether polyol examples include polyether polyol, polyester polyol, polyester polycarbonate polyol, and polycarbonate polyol.
- polyfunctional polyol prepolymer which has 3 or more of hydroxyl groups in a molecule
- examples of the polyether polyol include polytetramethylene glycol (PTMG), polypropylene glycol (PPG), polyethylene glycol (PEG), and ethylene oxide-added polypropylene polyol.
- PTMG polytetramethylene glycol
- PPG polypropylene glycol
- PEG polyethylene glycol
- ethylene oxide-added polypropylene polyol examples include polytetramethylene glycol (PTMG), polypropylene glycol (PPG), polyethylene glycol (PEG), and ethylene oxide-added polypropylene polyol.
- polyester polyol examples include polybutylene adipate, polyhexamethylene adipate, and polycaprolactone polyol.
- polyester polycarbonate polyol examples include a reaction product of a polyester glycol such as polycaprolactone polyol and an alkylene carbonate, and a reaction mixture obtained by reacting ethylene carbonate with a polyhydric alcohol and further reacting with an organic dicarboxylic acid. Product etc. are mentioned.
- polycarbonate polyol examples include diols such as 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, polyethylene glycol, polypropylene glycol, or polytetramethylene glycol, phosgene, diallyl carbonate ( For example, a reaction product with diphenyl carbonate) or cyclic carbonate (for example, propylene carbonate) can be used.
- diols such as 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, polyethylene glycol, polypropylene glycol, or polytetramethylene glycol, phosgene, diallyl carbonate ( For example, a reaction product with diphenyl carbonate) or cyclic carbonate (for example, propylene carbonate) can be used.
- the polyol compound may be used alone or in combination of two or more.
- the polyhydric alcohol is preferably ethylene glycol or diethylene glycol in that the strength at the time of reaction is likely to be higher, the rigidity of the manufactured polishing pad containing foamed polyurethane is likely to be higher, and it is relatively inexpensive.
- polystyrene resin those having a number average molecular weight of 800 to 8000 are preferable in that an elastic foamed polyurethane can be easily obtained.
- polytetramethylene glycol (PTMG), ethylene oxide Addition polypropylene polyol is preferred.
- polyamine compound examples include 4,4′-methylenebis (o-chloroaniline) (MOCA), 2,6-dichloro-p-phenylenediamine, 4,4′-methylenebis (2,3-dichloroaniline), 3, 5-bis (methylthio) -2,4-toluenediamine, 3,5-bis (methylthio) -2,6-toluenediamine, 3,5-diethyltoluene-2,4-diamine, 3,5-diethyltoluene- 2,6-diamine, trimethylene glycol-di-p-aminobenzoate, 1,2-bis (2-aminophenylthio) ethane and 4,4′-diamino-3,3′-diethyl-5,5′- Examples thereof include dimethyldiphenylmethane.
- MOCA 4,4′-methylenebis (o-chloroaniline)
- 2,6-dichloro-p-phenylenediamine 4,4′-methylene
- the foaming agent is not particularly limited as long as the foamed polyurethane is molded so as to generate gas to form bubbles, and bubbles are formed in the foamed polyurethane.
- the foaming agent is decomposed by heating.
- an organic chemical foaming agent that generates gas a low-boiling hydrocarbon having a boiling point of ⁇ 5 to 70 ° C., a halogenated hydrocarbon, water, liquefied carbon dioxide, or the like can be used alone or in combination.
- organic chemical foaming agent examples include azo compounds (azodicarbonamide, azobisisobutyronitrile, diazoaminobenzene, barium azodicarboxylate, etc.), nitroso compounds (N, N′-dinitrosopentamethylenetetramine, N, N′-dinitroso-N, N′-dimethylterephthalamide and the like), sulfonyl hydrazide compounds [p, p′-oxybis (benzenesulfonyl hydrazide), p-toluenesulfonyl hydrazide and the like] and the like.
- the low boiling point hydrocarbon examples include butane, pentane, cyclopentane, and mixtures thereof.
- halogenated hydrocarbon examples include methylene chloride and HFC (hydrofluorocarbons).
- polishing pad of this embodiment is configured as described above, it has the following advantages.
- the polishing pad which is formed of foamed polyurethane and obtained by pulsed NMR measurement at 25 ° C., has a S phase content in the foamed polyurethane within a predetermined range.
- the present inventors have found that the change in hardness due to is reduced, and came to contemplate this embodiment. That is, the polishing pad of the present embodiment is a polishing pad that is formed of foamed polyurethane, and the content ratio of the S phase in the foamed polyurethane obtained by pulse NMR measurement at 25 ° C. exceeds 70%.
- the polishing pad of the present embodiment is a polishing pad with a small change in hardness due to a temperature change.
- the polishing pad of this embodiment is obtained by pulsed NMR measurement at 25 ° C.
- S-phase content in the polyurethane foam exceeds 70%
- the change in hardness due to temperature change is small as follows. This is probably due to the reason.
- the content of the S phase exceeds 70%. Therefore, it is considered that the foamed polyurethane has many portions where the hard segments are crystallized, and the portions where the hard segments are crystallized are densely present.
- the soft segment exists between the portions where the hard segment is crystallized, or is connected to the end of the portion where the hard segment is crystallized.
- the portions where the hard segments are crystallized are dense, the intermolecular force between the hard segments is increased, and even when heated, the hard segments are difficult to be separated from each other. It is thought that it is difficult to decrease. Further, even if there is a portion where the density of the hard segment crystallized is small, the hard segment is easily separated from the portion where the density is small as compared with the portion where the density is high. Although it may have properties, it is considered that the movement is suppressed by the surrounding high-concentration portions, and as a result, the hardness is difficult to decrease.
- the polyurethane foam has a short soft segment even if a small amount of soft segment is present, so even if the soft segment moves when heated, the movement is suppressed by the crystallized portion of the hard segment. Seems to be difficult to decrease.
- the polishing pad of this embodiment is obtained by pulsed NMR measurement at 60 ° C. with respect to the content ratio of S phase in the foamed polyurethane obtained by pulsed NMR measurement at 25 ° C.
- the content ratio is preferably 80% or more.
- the polishing pad according to the present invention is not limited to the above embodiment. Further, the polishing pad according to the present invention is not limited to the above-described effects. The polishing pad according to the present invention can be variously modified without departing from the gist of the present invention.
- the foamed polyurethanes of Test Examples 1 to 6 were prepared. Each foamed polyurethane was measured by pulse NMR. The conditions for pulsed NMR measurement are as follows. Moreover, the storage elastic modulus of each foamed polyurethane was measured. The storage elastic modulus was measured according to JIS K7244-4: 1999 “Plastics—Testing method of dynamic mechanical properties—Part 4: Tensile vibration—Non-resonance method”. The measurement conditions of the storage elastic modulus are as follows.
- Measuring device SII nanotechnology, dynamic viscoelasticity measuring device DMS6100 Frequency: 1Hz Initial load: 300mN Measurement mode: Tensile / sine wave control mode Temperature: 10 to 130 ° C Temperature rise: 5 ° C / min
- Table 1 shows the S phase content at each temperature and the ratio of the S phase content at each temperature to the S phase content at 25 ° C. (in Table 1, “each temperature / RT”). Indicates.
- Table 2 also shows the storage elastic modulus (E ′) at each temperature and the ratio of E ′ at each temperature to “E ′ at 25 ° C. (“ each temperature / RT ”in Table 2). .
- the foamed polyurethanes of Test Examples 3 to 6 in which the content of the S phase obtained by pulse NMR measurement at 25 ° C. exceeds 70% are 25 ° C. compared to the foamed polyurethane of Test Example 1.
- the ratio of E ′ at each temperature to E ′ at a high value was high. That is, according to the present invention, it can be seen that a polishing pad having a small change in hardness due to a temperature change can be provided.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
よって、従来の研磨パッドは、被研磨物を十分に研磨できない場合や被研磨物が傷ついてしまう場合があり、安定的に被研磨物を研磨することができないという問題を有している。
25℃でのパルスNMR測定で求められる、前記発泡ポリウレタンにおけるS相の含有割合が70%を超える、研磨パッドである。
スピン-スピン緩和時間は、例えば、JEOL製の「JNM-MU25」を用い、Solid Echo法による測定を実施することなどで求めることができる。
なお、下記式中の「W」はワイブル係数を表す。
例えば、ワイブル係数Wiは、WS=2、WM=1、WL=1を用いることができる。
このような緩和時間の求め方については、S.Yamasakiet al Polymer 48 4793(2007)などに開示されている。
また、発泡ポリウレタンとしては、「結晶相の割合」や、「ハードセグメント部分の割合」が様々なものが知られている。なお、ウレタン結合やウレア結合を増やすことにより、「ハードセグメント部分の割合」を高めることができる。発泡ポリウレタンの材料については後述するが、例えば、イソシアネートとポリオールとを結合させる際に、短鎖ジオール(例えば、ジエチレングリコール(DEG)、分子量の小さいポリエチレングリコール(PEG)等)の使用量を増やすことでウレタン結合を増やすことができる。さらに、例えば、イソシアネート末端プレポリマーと、4,4’-メチレンビス(2-クロロアニリン)(MOCA)とを結合させる際に、MOCAの使用量を増やしたり、或いは、反応のための加熱温度を低くすることで、ウレア結合を増やすことができる。また、例えば、化学架橋を抑制することにより、ハードセグメント同士が接近しやすくなり、「結晶化相の割合」を高めることができる。
よって、結晶相の割合を高めたり、ハードセグメント部分の割合を高めることにより、S相の含有割合を高めることができる。
前記低沸点炭化水素としては、例えば、ブタン、ペンタン、シクロペンタン、及びこれらの混合物などが挙げられる。
前記ハロゲン化炭化水素としては、塩化メチレン、HFC(ハイドロフルオロカーボン類)等が挙げられる。
即ち、本実施形態の研磨パッドは、発泡ポリウレタンで形成されており、25℃でのパルスNMR測定で求められる、前記発泡ポリウレタンにおけるS相の含有割合が70%を超える、研磨パッドである。
本実施形態の研磨パッドは、斯かる構成を有することにより、温度変化による硬さの変化が小さい研磨パッドとなる。
前記発泡ポリウレタンは、前記S相の含有割合が70%を超えている。よって、前記発泡ポリウレタンは、ハードセグメントが結晶化した部分が多くなっており、ハードセグメントが結晶化した部分が密集して存在していると考えられる。一方で、ソフトセグメントは、ハードセグメントが結晶化した部分の間に存在し、又は、ハードセグメントが結晶化した部分の端に連なって存在すると考えられる。
そうすると、前記発泡ポリウレタンは、ハードセグメントが結晶化した部分が密集しているので、ハードセグメント間の分子間力が高くなり、温められても、ハードセグメント同士が離れ難くなり、その結果、硬度が低下し難くなっていると考えられる。
また、ハードセグメントが結晶化した部分の密集度が小さい箇所がある場合であっても、この密集度が小さい箇所は、密集度が高い箇所に比べて、温められると、ハードセグメント同士が離れやすい性質を有し得るが、周囲の密集度の高い箇所によって動きが抑制され、その結果、硬度が低下し難くなっていると考えられる。
さらに、前記発泡ポリウレタンは、ソフトセグメントが少量存在しても、ソフトセグメントは短いので、温められてソフトセグメントが動こうとしても、ハードセグメントが結晶化した部分によって動きが抑制され、その結果、硬度が低下し難くなっていると考えられる。
そして、それぞれの発泡ポリウレタンをパルスNMRで測定した。パルスNMR測定の条件は下記の通りである。
また、それぞれの発泡ポリウレタンの貯蔵弾性率を測定した。貯蔵弾性率は、JIS K7244-4:1999「プラスチック-動的機械特性の試験方法-第4部:引張振動-非共振法」に従って測定した。貯蔵弾性率の測定条件は下記の通りである。
測定装置:JEOL製、JNM-MU25
測定手法:Solid Echo法
パルス幅:90°pulse、2.0μs
繰り返し時間:4 sec
積算回数:8回
測定温度:室温(RT)(25℃)、60℃、80℃、100℃
測定装置:SIIナノテクノロジー製、動的粘弾性測定装置DMS6100
周波数:1Hz
初期荷重:300mN
測定モード:引張り・正弦波制御モード
温度:10~130℃
昇温:5℃/min
また、表2には、各温度での貯蔵弾性率(E’)と、25℃でのE’に対する、各温度でのE’の比(表2では「各温度/RT」)とを示す。
すなわち、本願発明によれば、温度変化による硬さの変化が小さい研磨パッドを提供することができることがわかる。
Claims (2)
- 発泡ポリウレタンで形成されており、
25℃でのパルスNMR測定で求められる、前記発泡ポリウレタンにおけるS相の含有割合が70%を超える、研磨パッド。 - 25℃でのパルスNMR測定で求められる、前記発泡ポリウレタンにおけるS相の含有割合に対する、60℃でのパルスNMR測定で求められる、前記発泡ポリウレタンにおけるS相の含有割合の比が、80%以上である、請求項1に記載の研磨パッド。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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JP2017509504A JP6623215B2 (ja) | 2015-03-30 | 2016-03-14 | 研磨パッド |
MYPI2017703574A MY189264A (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
SG11201707842PA SG11201707842PA (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
US15/561,543 US10625392B2 (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
DE112016001517.8T DE112016001517T5 (de) | 2015-03-30 | 2016-03-14 | Polierkissen |
CN201680006010.3A CN107107307B (zh) | 2015-03-30 | 2016-03-14 | 研磨垫 |
KR1020177016630A KR102543949B1 (ko) | 2015-03-30 | 2016-03-14 | 연마 패드 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2016/057981 WO2016158348A1 (ja) | 2015-03-30 | 2016-03-14 | 研磨パッド |
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US (1) | US10625392B2 (ja) |
JP (1) | JP6623215B2 (ja) |
KR (1) | KR102543949B1 (ja) |
CN (1) | CN107107307B (ja) |
DE (1) | DE112016001517T5 (ja) |
MY (1) | MY189264A (ja) |
SG (2) | SG10201908591TA (ja) |
TW (1) | TWI714563B (ja) |
WO (1) | WO2016158348A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021068904A (ja) * | 2019-10-23 | 2021-04-30 | エスケイシー・カンパニー・リミテッドSkc Co., Ltd. | 研磨パッド用組成物、研磨パッド |
WO2022210676A1 (ja) * | 2021-03-30 | 2022-10-06 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD854902S1 (en) * | 2016-09-23 | 2019-07-30 | Husqvarna Construction Products North America, Inc. | Polishing or grinding pad |
USD958626S1 (en) * | 2017-08-30 | 2022-07-26 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad |
USD927952S1 (en) * | 2017-08-30 | 2021-08-17 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad |
JP7302168B2 (ja) * | 2018-12-20 | 2023-07-04 | Dic株式会社 | ウレタン樹脂組成物、及び、研磨パッド |
US20200384601A1 (en) * | 2019-06-10 | 2020-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Thin film fluoropolymer composite cmp polishing pad |
CN114346894B (zh) * | 2020-09-29 | 2024-05-14 | Sk恩普士有限公司 | 抛光垫和使用该抛光垫的半导体器件的制造方法 |
US20230390970A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
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US20070117393A1 (en) * | 2005-11-21 | 2007-05-24 | Alexander Tregub | Hardened porous polymer chemical mechanical polishing (CMP) pad |
JP2007246805A (ja) * | 2006-03-17 | 2007-09-27 | Kuraray Co Ltd | 研磨パッドおよびその製造方法 |
JP2007313641A (ja) * | 2006-05-25 | 2007-12-06 | Rohm & Haas Electronic Materials Cmp Holdings Inc | ケミカルメカニカル研磨パッド |
JP2010082719A (ja) * | 2008-09-30 | 2010-04-15 | Fujibo Holdings Inc | 研磨パッドおよびその製造方法 |
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JP5873910B2 (ja) | 2014-09-01 | 2016-03-01 | 富士紡ホールディングス株式会社 | 研磨パッド |
-
2016
- 2016-03-14 US US15/561,543 patent/US10625392B2/en active Active
- 2016-03-14 WO PCT/JP2016/057981 patent/WO2016158348A1/ja active Application Filing
- 2016-03-14 JP JP2017509504A patent/JP6623215B2/ja active Active
- 2016-03-14 CN CN201680006010.3A patent/CN107107307B/zh active Active
- 2016-03-14 SG SG10201908591T patent/SG10201908591TA/en unknown
- 2016-03-14 SG SG11201707842PA patent/SG11201707842PA/en unknown
- 2016-03-14 MY MYPI2017703574A patent/MY189264A/en unknown
- 2016-03-14 KR KR1020177016630A patent/KR102543949B1/ko active IP Right Grant
- 2016-03-14 DE DE112016001517.8T patent/DE112016001517T5/de active Pending
- 2016-03-22 TW TW105108869A patent/TWI714563B/zh active
Patent Citations (7)
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JP2005015643A (ja) * | 2003-06-26 | 2005-01-20 | Dic Bayer Polymer Ltd | 熱可塑性ポリウレタン樹脂組成物及び成形物 |
US20070117393A1 (en) * | 2005-11-21 | 2007-05-24 | Alexander Tregub | Hardened porous polymer chemical mechanical polishing (CMP) pad |
JP2007246805A (ja) * | 2006-03-17 | 2007-09-27 | Kuraray Co Ltd | 研磨パッドおよびその製造方法 |
JP2007313641A (ja) * | 2006-05-25 | 2007-12-06 | Rohm & Haas Electronic Materials Cmp Holdings Inc | ケミカルメカニカル研磨パッド |
JP2010082719A (ja) * | 2008-09-30 | 2010-04-15 | Fujibo Holdings Inc | 研磨パッドおよびその製造方法 |
JP2010240777A (ja) * | 2009-04-06 | 2010-10-28 | Nitta Haas Inc | 研磨パッド |
JP2013089767A (ja) * | 2011-10-18 | 2013-05-13 | Fujibo Holdings Inc | 研磨パッド及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2021068904A (ja) * | 2019-10-23 | 2021-04-30 | エスケイシー・カンパニー・リミテッドSkc Co., Ltd. | 研磨パッド用組成物、研磨パッド |
JP7252185B2 (ja) | 2019-10-23 | 2023-04-04 | エスケーシー ソルミックス カンパニー,リミテッド | 研磨パッド用組成物、研磨パッド |
WO2022210676A1 (ja) * | 2021-03-30 | 2022-10-06 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107107307A (zh) | 2017-08-29 |
JP6623215B2 (ja) | 2019-12-18 |
TWI714563B (zh) | 2021-01-01 |
KR20170132710A (ko) | 2017-12-04 |
JPWO2016158348A1 (ja) | 2018-01-25 |
SG11201707842PA (en) | 2017-10-30 |
CN107107307B (zh) | 2020-06-26 |
MY189264A (en) | 2022-01-31 |
SG10201908591TA (en) | 2019-11-28 |
US10625392B2 (en) | 2020-04-21 |
DE112016001517T5 (de) | 2018-01-04 |
TW201641545A (zh) | 2016-12-01 |
KR102543949B1 (ko) | 2023-06-14 |
US20180079050A1 (en) | 2018-03-22 |
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