SG10201908591TA - Polishing pad - Google Patents
Polishing padInfo
- Publication number
- SG10201908591TA SG10201908591TA SG10201908591TA SG10201908591TA SG 10201908591T A SG10201908591T A SG 10201908591TA SG 10201908591T A SG10201908591T A SG 10201908591TA SG 10201908591T A SG10201908591T A SG 10201908591TA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing pad
- foamed polyurethane
- none
- exceeding
- phase
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 3
- 229920002635 polyurethane Polymers 0.000 abstract 2
- 239000004814 polyurethane Substances 0.000 abstract 2
- 238000005481 NMR spectroscopy Methods 0.000 abstract 1
- 230000018199 S phase Effects 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/7806—Nitrogen containing -N-C=0 groups
- C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
- C08G18/7825—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing ureum groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/7806—Nitrogen containing -N-C=0 groups
- C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
- C08G18/7831—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing biuret groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
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- C08G18/7818—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups
- C08G18/7837—Nitrogen containing -N-C=0 groups containing ureum or ureum derivative groups containing allophanate groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
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- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2101/00—Manufacture of cellular products
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
POLISHING PAD The present invention is a polishing pad formed by foamed polyurethane, with a content of S phase in the foamed polyurethane, as determined by pulsed NMR measurement at 25°C, exceeding 70%. Fig: None
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015068387 | 2015-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201908591TA true SG10201908591TA (en) | 2019-11-28 |
Family
ID=57007004
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201908591T SG10201908591TA (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
SG11201707842PA SG11201707842PA (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201707842PA SG11201707842PA (en) | 2015-03-30 | 2016-03-14 | Polishing pad |
Country Status (9)
Country | Link |
---|---|
US (1) | US10625392B2 (en) |
JP (1) | JP6623215B2 (en) |
KR (1) | KR102543949B1 (en) |
CN (1) | CN107107307B (en) |
DE (1) | DE112016001517T5 (en) |
MY (1) | MY189264A (en) |
SG (2) | SG10201908591TA (en) |
TW (1) | TWI714563B (en) |
WO (1) | WO2016158348A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD854902S1 (en) * | 2016-09-23 | 2019-07-30 | Husqvarna Construction Products North America, Inc. | Polishing or grinding pad |
USD927952S1 (en) * | 2017-08-30 | 2021-08-17 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad |
USD958626S1 (en) * | 2017-08-30 | 2022-07-26 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad |
JP7302168B2 (en) * | 2018-12-20 | 2023-07-04 | Dic株式会社 | Urethane resin composition and polishing pad |
US20200384601A1 (en) * | 2019-06-10 | 2020-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Thin film fluoropolymer composite cmp polishing pad |
US20210122007A1 (en) * | 2019-10-23 | 2021-04-29 | Skc Co., Ltd. | Composition for polishing pad and polishing pad |
CN114346894B (en) * | 2020-09-29 | 2024-05-14 | Sk恩普士有限公司 | Polishing pad and method for manufacturing semiconductor device using the same |
JP2022153966A (en) * | 2021-03-30 | 2022-10-13 | 富士紡ホールディングス株式会社 | Abrasive pad and method for producing abrasive pad |
US20230390970A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005015643A (en) * | 2003-06-26 | 2005-01-20 | Dic Bayer Polymer Ltd | Thermoplastic polyurethane resin composition and molded product |
US20070117393A1 (en) * | 2005-11-21 | 2007-05-24 | Alexander Tregub | Hardened porous polymer chemical mechanical polishing (CMP) pad |
JP2007246805A (en) * | 2006-03-17 | 2007-09-27 | Kuraray Co Ltd | Polishing pad and method for producing the same |
US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
JP5242322B2 (en) | 2008-09-30 | 2013-07-24 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
JP5846714B2 (en) * | 2009-04-06 | 2016-01-20 | ニッタ・ハース株式会社 | Polishing pad |
JP5945874B2 (en) | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
JP5873910B2 (en) | 2014-09-01 | 2016-03-01 | 富士紡ホールディングス株式会社 | Polishing pad |
-
2016
- 2016-03-14 CN CN201680006010.3A patent/CN107107307B/en active Active
- 2016-03-14 SG SG10201908591T patent/SG10201908591TA/en unknown
- 2016-03-14 JP JP2017509504A patent/JP6623215B2/en active Active
- 2016-03-14 SG SG11201707842PA patent/SG11201707842PA/en unknown
- 2016-03-14 KR KR1020177016630A patent/KR102543949B1/en active IP Right Grant
- 2016-03-14 WO PCT/JP2016/057981 patent/WO2016158348A1/en active Application Filing
- 2016-03-14 MY MYPI2017703574A patent/MY189264A/en unknown
- 2016-03-14 DE DE112016001517.8T patent/DE112016001517T5/en active Pending
- 2016-03-14 US US15/561,543 patent/US10625392B2/en active Active
- 2016-03-22 TW TW105108869A patent/TWI714563B/en active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016158348A1 (en) | 2018-01-25 |
SG11201707842PA (en) | 2017-10-30 |
US10625392B2 (en) | 2020-04-21 |
JP6623215B2 (en) | 2019-12-18 |
CN107107307A (en) | 2017-08-29 |
CN107107307B (en) | 2020-06-26 |
WO2016158348A1 (en) | 2016-10-06 |
MY189264A (en) | 2022-01-31 |
DE112016001517T5 (en) | 2018-01-04 |
US20180079050A1 (en) | 2018-03-22 |
TW201641545A (en) | 2016-12-01 |
TWI714563B (en) | 2021-01-01 |
KR20170132710A (en) | 2017-12-04 |
KR102543949B1 (en) | 2023-06-14 |
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