JP2014093526A - エピタキシャルウエハ - Google Patents

エピタキシャルウエハ Download PDF

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Publication number
JP2014093526A
JP2014093526A JP2013225125A JP2013225125A JP2014093526A JP 2014093526 A JP2014093526 A JP 2014093526A JP 2013225125 A JP2013225125 A JP 2013225125A JP 2013225125 A JP2013225125 A JP 2013225125A JP 2014093526 A JP2014093526 A JP 2014093526A
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JP
Japan
Prior art keywords
epitaxial
substrate
gas
growth
doping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013225125A
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English (en)
Japanese (ja)
Other versions
JP2014093526A5 (enExample
Inventor
Seok Min Kang
ソク ミン カン
Ji Hye Kim
ジ ヘ キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120122005A external-priority patent/KR20140055336A/ko
Priority claimed from KR1020120137988A external-priority patent/KR20140070015A/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2014093526A publication Critical patent/JP2014093526A/ja
Publication of JP2014093526A5 publication Critical patent/JP2014093526A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02378—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/02447—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02529—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2013225125A 2012-10-31 2013-10-30 エピタキシャルウエハ Pending JP2014093526A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020120122005A KR20140055336A (ko) 2012-10-31 2012-10-31 에피택셜 웨이퍼 및 그 제조 방법
KR10-2012-0122005 2012-10-31
KR10-2012-0137988 2012-11-30
KR1020120137988A KR20140070015A (ko) 2012-11-30 2012-11-30 에피택셜 웨이퍼 및 그 제조 방법

Publications (2)

Publication Number Publication Date
JP2014093526A true JP2014093526A (ja) 2014-05-19
JP2014093526A5 JP2014093526A5 (enExample) 2016-12-15

Family

ID=49488507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013225125A Pending JP2014093526A (ja) 2012-10-31 2013-10-30 エピタキシャルウエハ

Country Status (5)

Country Link
US (1) US20140117381A1 (enExample)
EP (1) EP2728609B1 (enExample)
JP (1) JP2014093526A (enExample)
CN (1) CN103789822A (enExample)
TW (1) TW201417149A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015005064A1 (ja) * 2013-07-09 2015-01-15 富士電機株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置
WO2016017502A1 (ja) * 2014-08-01 2016-02-04 住友電気工業株式会社 エピタキシャルウエハおよびその製造方法
WO2016051975A1 (ja) * 2014-10-01 2016-04-07 住友電気工業株式会社 炭化珪素エピタキシャル基板
WO2016133089A1 (ja) * 2015-02-18 2016-08-25 新日鐵住金株式会社 エピタキシャル炭化珪素単結晶ウエハの製造方法及びエピタキシャル炭化珪素単結晶ウエハ
WO2017043165A1 (ja) * 2015-09-11 2017-03-16 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
WO2017043164A1 (ja) * 2015-09-11 2017-03-16 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2020090436A (ja) * 2019-12-24 2020-06-11 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2021020853A (ja) * 2019-12-24 2021-02-18 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2021143081A (ja) * 2020-03-10 2021-09-24 住友金属鉱山株式会社 炭化ケイ素単結晶基板の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201417150A (zh) * 2012-10-31 2014-05-01 Lg Innotek Co Ltd 磊晶晶圓
US9576894B2 (en) * 2015-06-03 2017-02-21 GlobalFoundries, Inc. Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same
CN105914272B (zh) * 2016-05-19 2018-10-02 芜湖德豪润达光电科技有限公司 一种发光二极管外延片及其制备方法
US10192980B2 (en) 2016-06-24 2019-01-29 Cree, Inc. Gallium nitride high-electron mobility transistors with deep implanted p-type layers in silicon carbide substrates for power switching and radio frequency applications and process for making the same
US11430882B2 (en) 2016-06-24 2022-08-30 Wolfspeed, Inc. Gallium nitride high-electron mobility transistors with p-type layers and process for making the same
US12484244B2 (en) 2016-06-24 2025-11-25 Wolfspeed, Inc. Group III-nitride high-electron mobility transistors with gate connected buried p-type layers and process for making the same
US10892356B2 (en) 2016-06-24 2021-01-12 Cree, Inc. Group III-nitride high-electron mobility transistors with buried p-type layers and process for making the same
US10840334B2 (en) 2016-06-24 2020-11-17 Cree, Inc. Gallium nitride high-electron mobility transistors with deep implanted p-type layers in silicon carbide substrates for power switching and radio frequency applications and process for making the same
US11929428B2 (en) 2021-05-17 2024-03-12 Wolfspeed, Inc. Circuits and group III-nitride high-electron mobility transistors with buried p-type layers improving overload recovery and process for implementing the same
US12402346B2 (en) 2021-05-17 2025-08-26 Wolfspeed, Inc. Circuits and group III-nitride transistors with buried p-layers and controlled gate voltages and methods thereof
CN119028807B (zh) * 2024-08-16 2025-10-24 浙江芯科半导体有限公司 双掺杂提高碳化硅外延片掺杂浓度均匀性的方法

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JP2000319099A (ja) * 1999-05-07 2000-11-21 Hiroyuki Matsunami ＳｉＣウエハ、ＳｉＣ半導体デバイス、および、ＳｉＣウエハの製造方法
JP2005506695A (ja) * 2001-10-16 2005-03-03 アリゾナ ボード オブ リージェンツ ア ボディー コーポレート アクティング オン ビハーフ オブ アリゾナ ステート ユニバーシティ 四元ワイドバンドギャップ半導体の低温エピタキシャル成長
JP2005093478A (ja) * 2003-09-12 2005-04-07 Shikusuon:Kk Ｃｖｄエピタキシャル成長方法
JP2006028016A (ja) * 2004-07-19 2006-02-02 Norstel Ab 低オフアクシスＳｉＣウエハ上のＳｉＣのホモエピタキシャル成長
JP2006261612A (ja) * 2005-03-18 2006-09-28 Shikusuon:Kk 炭化珪素半導体およびその製造方法と製造装置
JP2009088223A (ja) * 2007-09-28 2009-04-23 Hitachi Cable Ltd 炭化珪素半導体基板およびそれを用いた炭化珪素半導体装置
JP2009158726A (ja) * 2007-12-27 2009-07-16 Fuji Electric Device Technology Co Ltd 半導体装置の製造装置および半導体装置の製造方法
JP2011121847A (ja) * 2009-12-14 2011-06-23 Showa Denko Kk ＳｉＣエピタキシャルウェハ及びその製造方法
JP2011236085A (ja) * 2010-05-11 2011-11-24 Nippon Steel Corp エピタキシャル炭化珪素単結晶基板及びその製造方法

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JP3230650B2 (ja) * 1996-03-27 2001-11-19 富士電機株式会社 炭化けい素半導体基板とその製造方法およびその基板を用いた炭化けい素半導体素子
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US6911084B2 (en) * 2001-09-26 2005-06-28 Arizona Board Of Regents Low temperature epitaxial growth of quaternary wide bandgap semiconductors
JP2008311541A (ja) * 2007-06-18 2008-12-25 Fuji Electric Device Technology Co Ltd 炭化珪素半導体基板の製造方法
KR20110099029A (ko) * 2008-12-08 2011-09-05 알타 디바이씨즈, 인크. 에피택셜 리프트 오프를 위한 다중 스택 증착
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JP2000319099A (ja) * 1999-05-07 2000-11-21 Hiroyuki Matsunami ＳｉＣウエハ、ＳｉＣ半導体デバイス、および、ＳｉＣウエハの製造方法
JP2005506695A (ja) * 2001-10-16 2005-03-03 アリゾナ ボード オブ リージェンツ ア ボディー コーポレート アクティング オン ビハーフ オブ アリゾナ ステート ユニバーシティ 四元ワイドバンドギャップ半導体の低温エピタキシャル成長
JP2005093478A (ja) * 2003-09-12 2005-04-07 Shikusuon:Kk Ｃｖｄエピタキシャル成長方法
JP2006028016A (ja) * 2004-07-19 2006-02-02 Norstel Ab 低オフアクシスＳｉＣウエハ上のＳｉＣのホモエピタキシャル成長
JP2006261612A (ja) * 2005-03-18 2006-09-28 Shikusuon:Kk 炭化珪素半導体およびその製造方法と製造装置
JP2009088223A (ja) * 2007-09-28 2009-04-23 Hitachi Cable Ltd 炭化珪素半導体基板およびそれを用いた炭化珪素半導体装置
JP2009158726A (ja) * 2007-12-27 2009-07-16 Fuji Electric Device Technology Co Ltd 半導体装置の製造装置および半導体装置の製造方法
JP2011121847A (ja) * 2009-12-14 2011-06-23 Showa Denko Kk ＳｉＣエピタキシャルウェハ及びその製造方法
JP2011236085A (ja) * 2010-05-11 2011-11-24 Nippon Steel Corp エピタキシャル炭化珪素単結晶基板及びその製造方法

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9418840B2 (en) 2013-07-09 2016-08-16 Fuji Electric Co., Ltd. Silicon carbide semiconductor device manufacturing method and silicon carbide semiconductor device
WO2015005064A1 (ja) * 2013-07-09 2015-01-15 富士電機株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置
US9957641B2 (en) 2014-08-01 2018-05-01 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same
WO2016017502A1 (ja) * 2014-08-01 2016-02-04 住友電気工業株式会社 エピタキシャルウエハおよびその製造方法
JP5910801B1 (ja) * 2014-08-01 2016-04-27 住友電気工業株式会社 エピタキシャルウエハおよびその製造方法
JP2016138040A (ja) * 2014-08-01 2016-08-04 住友電気工業株式会社 エピタキシャルウエハおよびその製造方法
US10612160B2 (en) 2014-08-01 2020-04-07 Sumitomo Electric Industries, Ltd. Epitaxial wafer and method for manufacturing same
JP2019073440A (ja) * 2014-08-01 2019-05-16 住友電気工業株式会社 エピタキシャルウエハ
WO2016051975A1 (ja) * 2014-10-01 2016-04-07 住友電気工業株式会社 炭化珪素エピタキシャル基板
JP2019189522A (ja) * 2015-02-18 2019-10-31 昭和電工株式会社 エピタキシャル炭化珪素単結晶ウエハの製造方法及びエピタキシャル炭化珪素単結晶ウエハ
WO2016133089A1 (ja) * 2015-02-18 2016-08-25 新日鐵住金株式会社 エピタキシャル炭化珪素単結晶ウエハの製造方法及びエピタキシャル炭化珪素単結晶ウエハ
JPWO2016133089A1 (ja) * 2015-02-18 2017-10-12 新日鐵住金株式会社 エピタキシャル炭化珪素単結晶ウエハの製造方法及びエピタキシャル炭化珪素単結晶ウエハ
US11114295B2 (en) 2015-02-18 2021-09-07 Showa Denko K.K. Epitaxial silicon carbide single crystal wafer and process for producing the same
US10727047B2 (en) 2015-02-18 2020-07-28 Showa Denko K.K. Epitaxial silicon carbide single crystal wafer and process for producing the same
US10121865B2 (en) 2015-09-11 2018-11-06 Sumitomo Electric Industries, Ltd. Silicon carbide epitaxial substrate and method of manufacturing silicon carbide semiconductor device
WO2017043165A1 (ja) * 2015-09-11 2017-03-16 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
WO2017043164A1 (ja) * 2015-09-11 2017-03-16 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JPWO2017043165A1 (ja) * 2015-09-11 2017-09-07 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2017052674A (ja) * 2015-09-11 2017-03-16 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2020090436A (ja) * 2019-12-24 2020-06-11 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2021020853A (ja) * 2019-12-24 2021-02-18 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2021143081A (ja) * 2020-03-10 2021-09-24 住友金属鉱山株式会社 炭化ケイ素単結晶基板の製造方法
JP7392526B2 (ja) 2020-03-10 2023-12-06 住友金属鉱山株式会社 炭化ケイ素単結晶基板の製造方法

Also Published As

Publication number Publication date
EP2728609B1 (en) 2020-03-18
US20140117381A1 (en) 2014-05-01
TW201417149A (zh) 2014-05-01
EP2728609A1 (en) 2014-05-07
CN103789822A (zh) 2014-05-14

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