JP2014090167A5 - - Google Patents

Download PDF

Info

Publication number
JP2014090167A5
JP2014090167A5 JP2013212490A JP2013212490A JP2014090167A5 JP 2014090167 A5 JP2014090167 A5 JP 2014090167A5 JP 2013212490 A JP2013212490 A JP 2013212490A JP 2013212490 A JP2013212490 A JP 2013212490A JP 2014090167 A5 JP2014090167 A5 JP 2014090167A5
Authority
JP
Japan
Prior art keywords
substrate
chuck
dry chemical
chamber
chemical agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013212490A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014090167A (ja
JP6321937B2 (ja
Filing date
Publication date
Priority claimed from US13/650,044 external-priority patent/US8898928B2/en
Application filed filed Critical
Publication of JP2014090167A publication Critical patent/JP2014090167A/ja
Publication of JP2014090167A5 publication Critical patent/JP2014090167A5/ja
Application granted granted Critical
Publication of JP6321937B2 publication Critical patent/JP6321937B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013212490A 2012-10-11 2013-10-10 剥離乾燥装置及び方法 Expired - Fee Related JP6321937B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/650,044 2012-10-11
US13/650,044 US8898928B2 (en) 2012-10-11 2012-10-11 Delamination drying apparatus and method

Publications (3)

Publication Number Publication Date
JP2014090167A JP2014090167A (ja) 2014-05-15
JP2014090167A5 true JP2014090167A5 (enExample) 2016-11-17
JP6321937B2 JP6321937B2 (ja) 2018-05-09

Family

ID=50454356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013212490A Expired - Fee Related JP6321937B2 (ja) 2012-10-11 2013-10-10 剥離乾燥装置及び方法

Country Status (6)

Country Link
US (1) US8898928B2 (enExample)
JP (1) JP6321937B2 (enExample)
KR (1) KR20140047009A (enExample)
CN (1) CN103730332B (enExample)
SG (1) SG2013075718A (enExample)
TW (1) TWI602234B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1397930B1 (it) * 2009-12-23 2013-02-04 Telstar Technologies S L Metodo per monitorare l'essiccamento primario di un processo di liofilizzazione.
US8898928B2 (en) * 2012-10-11 2014-12-02 Lam Research Corporation Delamination drying apparatus and method
CN103234328B (zh) * 2013-03-28 2015-04-08 京东方科技集团股份有限公司 一种基板减压干燥方法及装置
US10008396B2 (en) 2014-10-06 2018-06-26 Lam Research Corporation Method for collapse-free drying of high aspect ratio structures
US10068781B2 (en) 2014-10-06 2018-09-04 Lam Research Corporation Systems and methods for drying high aspect ratio structures without collapse using sacrificial bracing material that is removed using hydrogen-rich plasma
US10186444B2 (en) * 2015-03-20 2019-01-22 Applied Materials, Inc. Gas flow for condensation reduction with a substrate processing chuck
JP6141479B1 (ja) * 2016-03-18 2017-06-07 エスペック株式会社 乾燥装置
JP6557625B2 (ja) 2016-03-23 2019-08-07 東芝メモリ株式会社 基板の生産方法、および基板の生産システム
KR102008566B1 (ko) * 2016-05-24 2019-08-07 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
TWI645030B (zh) * 2016-05-24 2018-12-21 斯庫林集團股份有限公司 Substrate processing apparatus and substrate processing method
JP6849368B2 (ja) * 2016-09-30 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置
JP6951229B2 (ja) * 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2018128093A1 (ja) 2017-01-05 2018-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP6966899B2 (ja) * 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
JP6954793B2 (ja) * 2017-09-25 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理液及び基板処理装置
JP7018792B2 (ja) * 2018-03-22 2022-02-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP7037402B2 (ja) * 2018-03-26 2022-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102728304B1 (ko) * 2018-11-14 2024-11-11 삼성전자주식회사 기판 건조 방법, 포토레지스트 현상 방법, 그들을 포함하는 포토리소그래피 방법, 및 기판 건조 장치
KR102775038B1 (ko) * 2019-03-28 2025-03-05 삼성디스플레이 주식회사 감압 건조 장치
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly
KR20220037632A (ko) * 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법
KR102622985B1 (ko) * 2020-12-31 2024-01-11 세메스 주식회사 기판 처리 장치
US20220403509A1 (en) * 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
CN115355668A (zh) * 2022-06-24 2022-11-18 嘉兴智正医药科技有限公司 一种微针制备用冷冻干燥机
CN115611232A (zh) * 2022-12-15 2023-01-17 清华大学 纳米悬臂梁及其制备工艺
CN117433254B (zh) * 2023-12-21 2024-02-23 山西普恒制药有限公司 一种冻干粉生产装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1424263A (en) * 1973-02-20 1976-02-11 Procter & Gamble Process for producing a stable concentrated flavourful aromatic product
US4186032A (en) * 1976-09-23 1980-01-29 Rca Corp. Method for cleaning and drying semiconductors
JPS62169420A (ja) * 1986-01-22 1987-07-25 Hitachi Tokyo Electron Co Ltd 表面処理方法および装置
JPS6372877A (ja) * 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置
JPS6393642U (enExample) * 1986-12-05 1988-06-17
US5013693A (en) * 1989-02-16 1991-05-07 Wisconsin Alumni Research Foundation Formation of microstructures with removal of liquid by freezing and sublimation
US5264246A (en) * 1989-05-02 1993-11-23 Mitsubishi Denki Kabushiki Kaisha Spin coating method
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
TW250618B (enExample) * 1993-01-27 1995-07-01 Mitsui Toatsu Chemicals
JPH0754795B2 (ja) * 1993-01-28 1995-06-07 日本電気株式会社 レジスト現像方法
JP2947694B2 (ja) * 1993-07-02 1999-09-13 株式会社日立製作所 レジストパターン形成方法
JPH0756323A (ja) * 1993-08-11 1995-03-03 Nikon Corp 基板洗浄装置
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6328096B1 (en) * 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
JP3695971B2 (ja) * 1998-12-22 2005-09-14 シャープ株式会社 成膜装置および成膜方法
JP3751246B2 (ja) * 2001-11-13 2006-03-01 大日本スクリーン製造株式会社 薄膜形成装置および搬送方法
JP2004119715A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 付着物剥離方法および付着物剥離装置
US8029893B2 (en) * 2004-04-02 2011-10-04 Curwood, Inc. Myoglobin blooming agent, films, packages and methods for packaging
JP4719508B2 (ja) * 2004-09-22 2011-07-06 富士フイルム株式会社 セルロースアシレートフィルムおよびその製造方法並びに、該セルロースアシレートフィルムを用いた光学フィルム及び画像表示装置
FR2880105B1 (fr) * 2004-12-23 2007-04-20 Cie Financiere Alcatel Sa Dispositif et procede de pilotage de l'operation de deshydratation durant un traitement de lyophilisation
KR100666352B1 (ko) * 2005-05-26 2007-01-11 세메스 주식회사 기판 세정 건조 장치 및 방법
WO2007043755A1 (en) * 2005-10-13 2007-04-19 Sunsook Hwang Rapid freezing/vacuum drying method and apparatus of a semiconductor wafer
JP2007298858A (ja) * 2006-05-02 2007-11-15 Hoya Corp マスクブランク用基板の製造方法、マスクブランクの製造方法、及び露光用マスクの製造方法、並びに、マスクブランク、及び露光用マスク
TW200632440A (en) * 2006-06-05 2006-09-16 Mikuni Denshi Kk Vacuum combining alignment apparatus and liquid crystal display device manufactured by using the same
WO2008063135A1 (en) * 2006-11-24 2008-05-29 Agency For Science, Technology And Research Apparatus for processing a sample in a liquid droplet and method of using the same
MX2009011551A (es) * 2007-04-26 2009-12-03 Coca Cola Co Proceso y aparato para secar y curar un recubrimiento de recipiente y recipientes producidos a traves de ellos.
US8194384B2 (en) * 2008-07-23 2012-06-05 Tokyo Electron Limited High temperature electrostatic chuck and method of using
KR101191691B1 (ko) * 2008-11-14 2012-10-16 가부시키가이샤 알박 유기 박막 증착 장치, 유기 ｅｌ 소자 제조 장치 및 유기 박막 증착 방법
TWI534938B (zh) * 2010-02-25 2016-05-21 尼康股份有限公司 Substrate separation device, manufacturing method of semiconductor device, load lock device, substrate bonding device and substrate separation method
US20120247504A1 (en) * 2010-10-01 2012-10-04 Waleed Nasr System and Method for Sub-micron Level Cleaning of Surfaces
CN102148133B (zh) * 2010-12-06 2012-09-05 北京七星华创电子股份有限公司 单晶圆干燥装置及方法
US9673037B2 (en) * 2011-05-31 2017-06-06 Law Research Corporation Substrate freeze dry apparatus and method
US10112258B2 (en) * 2012-03-30 2018-10-30 View, Inc. Coaxial distance measurement via folding of triangulation sensor optics path
US8898928B2 (en) * 2012-10-11 2014-12-02 Lam Research Corporation Delamination drying apparatus and method

Similar Documents

Publication Publication Date Title
JP2014090167A5 (enExample)
JP2014523636A5 (enExample)
WO2012056343A3 (en) Method and apparatus for drying a semiconductor wafer
KR102062873B1 (ko) 작은 열 질량의 가압 챔버
WO2012125275A3 (en) Apparatus for monitoring and controlling substrate temperature
CL2015002578A1 (es) Aparato y método para precalentar agua con una unidad de aire acondicionado o una bomba de calor.
WO2012166727A3 (en) Substrate freeze dry apparatus and method
JP2017512379A5 (enExample)
WO2015017144A3 (en) Heat dissipation systems with hygroscopic working fluid
JP2012518901A5 (enExample)
JP2013541964A5 (enExample)
WO2017161657A1 (zh) 一种槽式烘干结构
WO2015068038A3 (en) Device and method for heating a fluid chamber
WO2018016972A3 (en) System for storing and retrieving thermal energy
CN102212824A (zh) 一种单侧硅片湿法腐蚀设备
CN204360230U (zh) 温度控制系统
CN105271792A (zh) 固化装置及固化方法
TW201541551A (zh) 用於大溫度範圍夾具之多流體冷卻系統
MX357452B (es) Metodo para modificar la superficie de un soporte de óxido de aluminio.
CN105529282B (zh) 一种半导体预湿润装置及方法
WO2013022937A3 (en) System and method for cooling photovoltaic cells
JP2015078719A5 (enExample)
CN103184567B (zh) 一种可在线煅烧的纺丝箱体
JP2013145916A5 (ja) 熱処理装置
JP2008227264A5 (enExample)