TWI602234B - 剝離乾燥設備及方法 - Google Patents

剝離乾燥設備及方法 Download PDF

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Publication number
TWI602234B
TWI602234B TW102136808A TW102136808A TWI602234B TW I602234 B TWI602234 B TW I602234B TW 102136808 A TW102136808 A TW 102136808A TW 102136808 A TW102136808 A TW 102136808A TW I602234 B TWI602234 B TW I602234B
Authority
TW
Taiwan
Prior art keywords
substrate
drying
chuck
chamber
chemical
Prior art date
Application number
TW102136808A
Other languages
English (en)
Chinese (zh)
Other versions
TW201430938A (zh
Inventor
史帝芬Ｍ 席拉德
黛安 海門斯
亞倫Ｍ 休普
雷查納 李莫里
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201430938A publication Critical patent/TW201430938A/zh
Application granted granted Critical
Publication of TWI602234B publication Critical patent/TWI602234B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102136808A 2012-10-11 2013-10-11 剝離乾燥設備及方法 TWI602234B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/650,044 US8898928B2 (en) 2012-10-11 2012-10-11 Delamination drying apparatus and method

Publications (2)

Publication Number Publication Date
TW201430938A TW201430938A (zh) 2014-08-01
TWI602234B true TWI602234B (zh) 2017-10-11

Family

ID=50454356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102136808A TWI602234B (zh) 2012-10-11 2013-10-11 剝離乾燥設備及方法

Country Status (6)

Country Link
US (1) US8898928B2 (enExample)
JP (1) JP6321937B2 (enExample)
KR (1) KR20140047009A (enExample)
CN (1) CN103730332B (enExample)
SG (1) SG2013075718A (enExample)
TW (1) TWI602234B (enExample)

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CN103234328B (zh) * 2013-03-28 2015-04-08 京东方科技集团股份有限公司 一种基板减压干燥方法及装置
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US10186444B2 (en) * 2015-03-20 2019-01-22 Applied Materials, Inc. Gas flow for condensation reduction with a substrate processing chuck
JP6141479B1 (ja) * 2016-03-18 2017-06-07 エスペック株式会社 乾燥装置
JP6557625B2 (ja) 2016-03-23 2019-08-07 東芝メモリ株式会社 基板の生産方法、および基板の生産システム
KR102008566B1 (ko) * 2016-05-24 2019-08-07 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
TWI645030B (zh) * 2016-05-24 2018-12-21 斯庫林集團股份有限公司 Substrate processing apparatus and substrate processing method
JP6849368B2 (ja) * 2016-09-30 2021-03-24 芝浦メカトロニクス株式会社 基板処理装置
JP6951229B2 (ja) * 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2018128093A1 (ja) 2017-01-05 2018-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP6966899B2 (ja) * 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
JP6954793B2 (ja) * 2017-09-25 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理液及び基板処理装置
JP7018792B2 (ja) * 2018-03-22 2022-02-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP7037402B2 (ja) * 2018-03-26 2022-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102728304B1 (ko) * 2018-11-14 2024-11-11 삼성전자주식회사 기판 건조 방법, 포토레지스트 현상 방법, 그들을 포함하는 포토리소그래피 방법, 및 기판 건조 장치
KR102775038B1 (ko) * 2019-03-28 2025-03-05 삼성디스플레이 주식회사 감압 건조 장치
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly
KR20220037632A (ko) * 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법
KR102622985B1 (ko) * 2020-12-31 2024-01-11 세메스 주식회사 기판 처리 장치
US20220403509A1 (en) * 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
CN115355668A (zh) * 2022-06-24 2022-11-18 嘉兴智正医药科技有限公司 一种微针制备用冷冻干燥机
CN115611232A (zh) * 2022-12-15 2023-01-17 清华大学 纳米悬臂梁及其制备工艺
CN117433254B (zh) * 2023-12-21 2024-02-23 山西普恒制药有限公司 一种冻干粉生产装置

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TW200640584A (en) * 2005-05-26 2006-12-01 Semes Co Ltd Method and apparatus for cleaning and drying substrates
WO2007043755A1 (en) * 2005-10-13 2007-04-19 Sunsook Hwang Rapid freezing/vacuum drying method and apparatus of a semiconductor wafer
TW201005868A (en) * 2008-07-23 2010-02-01 Tokyo Electron Ltd High temperature electrostatic chuck and method of using
TW201135866A (en) * 2010-02-25 2011-10-16 Nikon Corp Substrate separation device, load lock device, substrate adhesion device and substrate separation method

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Also Published As

Publication number Publication date
KR20140047009A (ko) 2014-04-21
US8898928B2 (en) 2014-12-02
SG2013075718A (en) 2014-05-29
CN103730332B (zh) 2017-05-10
CN103730332A (zh) 2014-04-16
JP2014090167A (ja) 2014-05-15
US20140101964A1 (en) 2014-04-17
TW201430938A (zh) 2014-08-01
JP6321937B2 (ja) 2018-05-09

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MM4A Annulment or lapse of patent due to non-payment of fees