SG2013075718A - Delamination drying apparatus and method - Google Patents

Delamination drying apparatus and method

Info

Publication number
SG2013075718A
SG2013075718A SG2013075718A SG2013075718A SG2013075718A SG 2013075718 A SG2013075718 A SG 2013075718A SG 2013075718 A SG2013075718 A SG 2013075718A SG 2013075718 A SG2013075718 A SG 2013075718A SG 2013075718 A SG2013075718 A SG 2013075718A
Authority
SG
Singapore
Prior art keywords
delamination
drying apparatus
drying
delamination drying
Prior art date
Application number
SG2013075718A
Other languages
English (en)
Inventor
Stephen M Sirard
Diane Hymes
Alan M Schoepp
Ratchana Limary
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG2013075718A publication Critical patent/SG2013075718A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG2013075718A 2012-10-11 2013-10-07 Delamination drying apparatus and method SG2013075718A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/650,044 US8898928B2 (en) 2012-10-11 2012-10-11 Delamination drying apparatus and method

Publications (1)

Publication Number Publication Date
SG2013075718A true SG2013075718A (en) 2014-05-29

Family

ID=50454356

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013075718A SG2013075718A (en) 2012-10-11 2013-10-07 Delamination drying apparatus and method

Country Status (6)

Country Link
US (1) US8898928B2 (enExample)
JP (1) JP6321937B2 (enExample)
KR (1) KR20140047009A (enExample)
CN (1) CN103730332B (enExample)
SG (1) SG2013075718A (enExample)
TW (1) TWI602234B (enExample)

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JP7018792B2 (ja) * 2018-03-22 2022-02-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP7037402B2 (ja) * 2018-03-26 2022-03-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102728304B1 (ko) * 2018-11-14 2024-11-11 삼성전자주식회사 기판 건조 방법, 포토레지스트 현상 방법, 그들을 포함하는 포토리소그래피 방법, 및 기판 건조 장치
KR102775038B1 (ko) * 2019-03-28 2025-03-05 삼성디스플레이 주식회사 감압 건조 장치
EP3832391A1 (en) * 2019-12-03 2021-06-09 ASML Netherlands B.V. Clamp assembly
KR20220037632A (ko) * 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 방법
KR102622985B1 (ko) * 2020-12-31 2024-01-11 세메스 주식회사 기판 처리 장치
US20220403509A1 (en) * 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method
CN115355668A (zh) * 2022-06-24 2022-11-18 嘉兴智正医药科技有限公司 一种微针制备用冷冻干燥机
CN115611232A (zh) * 2022-12-15 2023-01-17 清华大学 纳米悬臂梁及其制备工艺
CN117433254B (zh) * 2023-12-21 2024-02-23 山西普恒制药有限公司 一种冻干粉生产装置

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Also Published As

Publication number Publication date
KR20140047009A (ko) 2014-04-21
US8898928B2 (en) 2014-12-02
TWI602234B (zh) 2017-10-11
CN103730332B (zh) 2017-05-10
CN103730332A (zh) 2014-04-16
JP2014090167A (ja) 2014-05-15
US20140101964A1 (en) 2014-04-17
TW201430938A (zh) 2014-08-01
JP6321937B2 (ja) 2018-05-09

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