JP2012227530A5 - - Google Patents

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Publication number
JP2012227530A5
JP2012227530A5 JP2012122742A JP2012122742A JP2012227530A5 JP 2012227530 A5 JP2012227530 A5 JP 2012227530A5 JP 2012122742 A JP2012122742 A JP 2012122742A JP 2012122742 A JP2012122742 A JP 2012122742A JP 2012227530 A5 JP2012227530 A5 JP 2012227530A5
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JP
Japan
Prior art keywords
metal
transistor
circuit
opening
insulating film
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JP2012122742A
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English (en)
Japanese (ja)
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JP2012227530A (ja
JP5509259B2 (ja
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Priority to JP2012122742A priority Critical patent/JP5509259B2/ja
Priority claimed from JP2012122742A external-priority patent/JP5509259B2/ja
Publication of JP2012227530A publication Critical patent/JP2012227530A/ja
Publication of JP2012227530A5 publication Critical patent/JP2012227530A5/ja
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Publication of JP5509259B2 publication Critical patent/JP5509259B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012122742A 2005-02-25 2012-05-30 電子機器 Expired - Fee Related JP5509259B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012122742A JP5509259B2 (ja) 2005-02-25 2012-05-30 電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005051867 2005-02-25
JP2005051867 2005-02-25
JP2012122742A JP5509259B2 (ja) 2005-02-25 2012-05-30 電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006045181A Division JP5046529B2 (ja) 2005-02-25 2006-02-22 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2013238724A Division JP5732514B2 (ja) 2005-02-25 2013-11-19 半導体装置
JP2013239445A Division JP5703362B2 (ja) 2005-02-25 2013-11-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2012227530A JP2012227530A (ja) 2012-11-15
JP2012227530A5 true JP2012227530A5 (enExample) 2014-01-09
JP5509259B2 JP5509259B2 (ja) 2014-06-04

Family

ID=36969892

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2012122742A Expired - Fee Related JP5509259B2 (ja) 2005-02-25 2012-05-30 電子機器
JP2013238724A Active JP5732514B2 (ja) 2005-02-25 2013-11-19 半導体装置
JP2013239445A Expired - Fee Related JP5703362B2 (ja) 2005-02-25 2013-11-20 半導体装置
JP2014243057A Expired - Fee Related JP5918837B2 (ja) 2005-02-25 2014-12-01 半導体装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2013238724A Active JP5732514B2 (ja) 2005-02-25 2013-11-19 半導体装置
JP2013239445A Expired - Fee Related JP5703362B2 (ja) 2005-02-25 2013-11-20 半導体装置
JP2014243057A Expired - Fee Related JP5918837B2 (ja) 2005-02-25 2014-12-01 半導体装置

Country Status (3)

Country Link
US (2) US7566633B2 (enExample)
JP (4) JP5509259B2 (enExample)
CN (1) CN100573881C (enExample)

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