JP2012227530A5 - - Google Patents
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- Publication number
- JP2012227530A5 JP2012227530A5 JP2012122742A JP2012122742A JP2012227530A5 JP 2012227530 A5 JP2012227530 A5 JP 2012227530A5 JP 2012122742 A JP2012122742 A JP 2012122742A JP 2012122742 A JP2012122742 A JP 2012122742A JP 2012227530 A5 JP2012227530 A5 JP 2012227530A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- transistor
- circuit
- opening
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 6
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012122742A JP5509259B2 (ja) | 2005-02-25 | 2012-05-30 | 電子機器 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005051867 | 2005-02-25 | ||
| JP2005051867 | 2005-02-25 | ||
| JP2012122742A JP5509259B2 (ja) | 2005-02-25 | 2012-05-30 | 電子機器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006045181A Division JP5046529B2 (ja) | 2005-02-25 | 2006-02-22 | 半導体装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013238724A Division JP5732514B2 (ja) | 2005-02-25 | 2013-11-19 | 半導体装置 |
| JP2013239445A Division JP5703362B2 (ja) | 2005-02-25 | 2013-11-20 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012227530A JP2012227530A (ja) | 2012-11-15 |
| JP2012227530A5 true JP2012227530A5 (enExample) | 2014-01-09 |
| JP5509259B2 JP5509259B2 (ja) | 2014-06-04 |
Family
ID=36969892
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012122742A Expired - Fee Related JP5509259B2 (ja) | 2005-02-25 | 2012-05-30 | 電子機器 |
| JP2013238724A Active JP5732514B2 (ja) | 2005-02-25 | 2013-11-19 | 半導体装置 |
| JP2013239445A Expired - Fee Related JP5703362B2 (ja) | 2005-02-25 | 2013-11-20 | 半導体装置 |
| JP2014243057A Expired - Fee Related JP5918837B2 (ja) | 2005-02-25 | 2014-12-01 | 半導体装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013238724A Active JP5732514B2 (ja) | 2005-02-25 | 2013-11-19 | 半導体装置 |
| JP2013239445A Expired - Fee Related JP5703362B2 (ja) | 2005-02-25 | 2013-11-20 | 半導体装置 |
| JP2014243057A Expired - Fee Related JP5918837B2 (ja) | 2005-02-25 | 2014-12-01 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7566633B2 (enExample) |
| JP (4) | JP5509259B2 (enExample) |
| CN (1) | CN100573881C (enExample) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1993829B (zh) * | 2004-06-02 | 2010-06-02 | 株式会社半导体能源研究所 | 层压系统 |
| US7651932B2 (en) * | 2005-05-31 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing antenna and method for manufacturing semiconductor device |
| EP1886355A4 (en) * | 2005-05-31 | 2015-04-01 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
| US7727859B2 (en) * | 2005-06-30 | 2010-06-01 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
| US7652214B2 (en) * | 2005-11-02 | 2010-01-26 | Panasonic Corporation | Electronic component package |
| JP2007256914A (ja) * | 2006-02-21 | 2007-10-04 | Seiko Epson Corp | アクティブマトリクス基板、電気光学装置、電子機器 |
| JP2008066567A (ja) * | 2006-09-08 | 2008-03-21 | Ricoh Co Ltd | 配線パターンとこれを用いた電子素子、有機半導体素子、積層配線パターンおよび積層配線基板 |
| US8137417B2 (en) * | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| TWI570900B (zh) * | 2006-09-29 | 2017-02-11 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| US7941919B2 (en) * | 2007-01-29 | 2011-05-17 | Board Of Regents, The University Of Texas System | Method of assembling an electronic textile |
| EP1970952A3 (en) * | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US7973316B2 (en) | 2007-03-26 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US7851804B2 (en) * | 2007-05-17 | 2010-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| TWI423519B (zh) * | 2007-09-04 | 2014-01-11 | Mitsubishi Electric Corp | Radio frequency identification tag |
| WO2010035627A1 (en) | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2011003522A (ja) * | 2008-10-16 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法 |
| TW202537432A (zh) * | 2008-11-07 | 2025-09-16 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
| CN104597651B (zh) * | 2009-05-02 | 2017-12-05 | 株式会社半导体能源研究所 | 显示设备 |
| KR102185861B1 (ko) | 2009-05-02 | 2020-12-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| US8766269B2 (en) | 2009-07-02 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, lighting device, and electronic device |
| KR101927922B1 (ko) * | 2009-09-16 | 2018-12-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 이의 제조 방법 |
| TWI589042B (zh) * | 2010-01-20 | 2017-06-21 | 半導體能源研究所股份有限公司 | 發光裝置,撓性發光裝置,電子裝置,照明設備,以及發光裝置和撓性發光裝置的製造方法 |
| KR101174834B1 (ko) | 2012-04-05 | 2012-08-17 | 주식회사 다보씨앤엠 | 공정필름을 이용한 필름형 디스플레이 기판의 제조방법 및 이에 사용되는 필름형 디스플레이 기판 제조용 공정필름 |
| WO2014024900A1 (en) | 2012-08-10 | 2014-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting device |
| TWI613709B (zh) * | 2013-02-20 | 2018-02-01 | 財團法人工業技術研究院 | 半導體元件結構及其製造方法與應用其之畫素結構 |
| JP2014182306A (ja) * | 2013-03-19 | 2014-09-29 | Japan Display Inc | 表示装置、電子機器及び表示装置の製造方法 |
| US9209207B2 (en) * | 2013-04-09 | 2015-12-08 | Apple Inc. | Flexible display with bent edge regions |
| KR20180130021A (ko) | 2013-04-15 | 2018-12-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
| US11145838B2 (en) | 2013-05-21 | 2021-10-12 | Samsung Display Co., Ltd. | Organic light emitting diode display and method of manufacturing the same |
| US9203050B2 (en) * | 2013-05-21 | 2015-12-01 | Samsung Display Co., Ltd. | Organic light emitting diode display and method of manufacturing the same |
| US9472507B2 (en) | 2013-06-17 | 2016-10-18 | Samsung Display Co., Ltd. | Array substrate and organic light-emitting display including the same |
| US9269914B2 (en) | 2013-08-01 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, and lighting device |
| TWI685026B (zh) | 2013-08-06 | 2020-02-11 | 日商半導體能源研究所股份有限公司 | 剝離方法 |
| TW201943069A (zh) | 2013-09-06 | 2019-11-01 | 日商半導體能源研究所股份有限公司 | 發光裝置以及發光裝置的製造方法 |
| US9937698B2 (en) | 2013-11-06 | 2018-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method and light-emitting device |
| CN103545321B (zh) * | 2013-11-11 | 2017-03-15 | 京东方科技集团股份有限公司 | 显示基板和含有该显示基板的柔性显示装置 |
| US9427949B2 (en) | 2013-12-03 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and stack manufacturing apparatus |
| KR102107456B1 (ko) * | 2013-12-10 | 2020-05-08 | 삼성디스플레이 주식회사 | 플렉시블 표시 장치 및 이의 제조 방법 |
| CN104752365A (zh) * | 2013-12-27 | 2015-07-01 | 昆山国显光电有限公司 | 一种柔性显示器及其制备方法 |
| CA2935372C (en) * | 2014-01-06 | 2023-08-08 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| KR102368997B1 (ko) | 2014-06-27 | 2022-02-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치, 모듈, 전자 기기, 발광 장치의 제작 방법 |
| TWI695525B (zh) | 2014-07-25 | 2020-06-01 | 日商半導體能源研究所股份有限公司 | 剝離方法、發光裝置、模組以及電子裝置 |
| CN111710794B (zh) | 2014-10-17 | 2024-06-28 | 株式会社半导体能源研究所 | 发光装置、模块、电子设备以及发光装置的制造方法 |
| DE112015005339T5 (de) * | 2014-11-28 | 2017-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung, Modul und elektronisches Gerät |
| KR102343656B1 (ko) | 2015-01-15 | 2021-12-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| WO2016204121A1 (ja) * | 2015-06-18 | 2016-12-22 | シャープ株式会社 | フレキシブル電子デバイス及びフレキシブル電子デバイスの製造方法 |
| WO2017017553A1 (en) * | 2015-07-30 | 2017-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of light-emitting device, light-emitting device, module, and electronic device |
| US10259207B2 (en) | 2016-01-26 | 2019-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming separation starting point and separation method |
| JP2017147044A (ja) | 2016-02-15 | 2017-08-24 | 株式会社ジャパンディスプレイ | 表示装置、および表示装置の作製方法 |
| JP6715708B2 (ja) * | 2016-07-08 | 2020-07-01 | 株式会社ジャパンディスプレイ | 表示装置 |
| WO2018070027A1 (ja) | 2016-10-13 | 2018-04-19 | シャープ株式会社 | 有機el表示装置および有機el表示装置の製造方法 |
| CN106585069A (zh) * | 2016-12-23 | 2017-04-26 | 武汉华星光电技术有限公司 | 柔性基板、面板及丝网印刷机制作柔性基板、面板的方法 |
| US11152580B2 (en) | 2017-03-30 | 2021-10-19 | Sharp Kabushiki Kaisha | Flexible display device |
| TWI645389B (zh) * | 2017-11-15 | 2018-12-21 | 友達光電股份有限公司 | 可撓性電子裝置 |
| US12300752B2 (en) * | 2018-03-06 | 2025-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN108847134B (zh) * | 2018-06-13 | 2021-05-14 | 云谷(固安)科技有限公司 | 一种可拉伸显示屏装置及其制造方法 |
| CN109378327B (zh) * | 2018-09-26 | 2021-02-12 | 云谷(固安)科技有限公司 | 显示面板及显示装置 |
| CN110028908A (zh) * | 2018-12-25 | 2019-07-19 | 瑞声科技(新加坡)有限公司 | 玻璃软膜结构及其制作方法 |
| CN110028909A (zh) * | 2018-12-25 | 2019-07-19 | 瑞声科技(新加坡)有限公司 | 玻璃软膜结构及其制作方法 |
| CN109686251B (zh) * | 2018-12-25 | 2021-12-31 | 厦门天马微电子有限公司 | 一种柔性显示面板及显示装置 |
| JP7628956B2 (ja) | 2019-11-01 | 2025-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12363880B2 (en) | 2019-11-08 | 2025-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN114137754B (zh) * | 2021-11-30 | 2022-10-21 | 绵阳惠科光电科技有限公司 | 曲面屏及显示装置 |
| CN119644625B (zh) * | 2024-12-02 | 2025-09-12 | 东南大学 | 基于tft变容管和tft驱动阵列的玻璃基电磁调控阵列 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3360919B2 (ja) * | 1993-06-11 | 2003-01-07 | 三菱電機株式会社 | 薄膜太陽電池の製造方法,及び薄膜太陽電池 |
| WO1998009333A1 (fr) * | 1996-08-27 | 1998-03-05 | Seiko Epson Corporation | Methode de separation, procede de transfert d'un dispositif a film mince, dispositif a film mince, dispositif a circuit integre a film mince et dispositif d'affichage a cristaux liquides obtenu par application du procede de transfert |
| US6199533B1 (en) * | 1999-02-01 | 2001-03-13 | Cummins Engine Company, Inc. | Pilot valve controlled three-way fuel injection control valve assembly |
| WO2000051181A1 (fr) | 1999-02-24 | 2000-08-31 | Hitachi Maxell, Ltd. | Dispositif a circuit integre et son procede de production, et support d'information pourvu de ce dispositif a circuit integre et son procede de production |
| JP4748859B2 (ja) | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| US7060153B2 (en) * | 2000-01-17 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
| US20010053559A1 (en) * | 2000-01-25 | 2001-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating display device |
| JP4495295B2 (ja) | 2000-03-15 | 2010-06-30 | 株式会社日立製作所 | 有価証券類の不正利用防止方法および有価証券類の不正利用防止システム |
| JP2002083866A (ja) * | 2000-09-07 | 2002-03-22 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| EP1362375B1 (en) * | 2001-02-16 | 2009-04-29 | Ignis Innovation Inc. | Flexible display device |
| GB0108309D0 (en) * | 2001-04-03 | 2001-05-23 | Koninkl Philips Electronics Nv | Matrix array devices with flexible substrates |
| DE10122324A1 (de) * | 2001-05-08 | 2002-11-14 | Philips Corp Intellectual Pty | Flexible integrierte monolithische Schaltung |
| TW564471B (en) * | 2001-07-16 | 2003-12-01 | Semiconductor Energy Lab | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| US6887650B2 (en) * | 2001-07-24 | 2005-05-03 | Seiko Epson Corporation | Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, ic card, and electronic appliance |
| JP2003109773A (ja) * | 2001-07-27 | 2003-04-11 | Semiconductor Energy Lab Co Ltd | 発光装置、半導体装置およびそれらの作製方法 |
| JP3956697B2 (ja) | 2001-12-28 | 2007-08-08 | セイコーエプソン株式会社 | 半導体集積回路の製造方法 |
| TWI272641B (en) * | 2002-07-16 | 2007-02-01 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| JP4566578B2 (ja) * | 2003-02-24 | 2010-10-20 | 株式会社半導体エネルギー研究所 | 薄膜集積回路の作製方法 |
| TWI328837B (en) * | 2003-02-28 | 2010-08-11 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
| JP4748943B2 (ja) * | 2003-02-28 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2005032979A (ja) * | 2003-07-14 | 2005-02-03 | Canon Inc | 有機薄膜トランジスタおよびその製造方法 |
| KR101137797B1 (ko) | 2003-12-15 | 2012-04-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 집적회로장치의 제조방법, 비접촉형 박막집적회로장치 및 그 제조 방법, 비접촉형 박막 집적회로장치를 가지는 아이디 태그 및 동전 |
| US7271076B2 (en) * | 2003-12-19 | 2007-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| JP4060289B2 (ja) * | 2004-05-26 | 2008-03-12 | 株式会社半導体エネルギー研究所 | 携帯型コンピュータ |
-
2006
- 2006-02-16 US US11/354,810 patent/US7566633B2/en not_active Expired - Fee Related
- 2006-02-24 CN CNB2006100514208A patent/CN100573881C/zh active Active
-
2009
- 2009-04-10 US US12/421,840 patent/US7906784B2/en not_active Expired - Fee Related
-
2012
- 2012-05-30 JP JP2012122742A patent/JP5509259B2/ja not_active Expired - Fee Related
-
2013
- 2013-11-19 JP JP2013238724A patent/JP5732514B2/ja active Active
- 2013-11-20 JP JP2013239445A patent/JP5703362B2/ja not_active Expired - Fee Related
-
2014
- 2014-12-01 JP JP2014243057A patent/JP5918837B2/ja not_active Expired - Fee Related
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