JP2012129568A - 異なるサイズの光散乱粒子を用いた発光デバイスのパッケージ - Google Patents
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- H01L33/56—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2933/0091—
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- H01L33/504—
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- H01L33/54—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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Abstract
【解決手段】発光体を少なくとも部分的に取り囲む、異なるサイズの光散乱粒子を備え、デバイスの空間的色混合度と色均一性を改良する輻射発光デバイスを提供する。複数のサイズの光散乱粒子が、単一の、または複数チップの多色の発光体パッケージを少なくとも部分的に取り囲むための媒質中に分散されている。異なるサイズの光散乱粒子は、発光する輻射の中のそれぞれ対応する波長範囲と相互作用する。このようにして、複数の波長範囲または副範囲に渡って発光する輻射は効率よく散乱されて、出力ビームにおける空間的に不均一な色パターンを除去する(または意図的に作る)ことが出来る。
【選択図】図2
Description
シリカゲル;
酸化亜鉛(ZnO);
酸化イットリウム(Y203);
二酸化チタン(Ti02);
硫化バリウム(BaS04);
アルミナ(Al203);
溶融石英(Si02);
ヒュームドシリカ(Si02);
窒化アルミニウム;
ガラス玉;
二酸化ジルコニウム(Zr02);
炭化珪素(SiC);
酸化タンタル(Ta05);
窒化珪素(Si3N4);
酸化ニオブ(Nb205);
窒化ホウ素(BN);または
蛍光剤粒子(例えば、YAG:Ce、BOSE)
列挙しなかった他の材料を用いてもよい。特定の散乱効果を実現するために、材料の色々な組み合わせ、または同じ材料の異なる形状の組み合わせを用いてもよい。例えば、1つの実施形態では、第1の複数のLSPがアルミナを含み、第2の複数のLSPが二酸化チタンを含んでもよい。別の例示的な実施形態では、第1の複数のLSPはルチル型二酸化チタンを含み、一方、第2の複数のLSPはアナタース型二酸化チタンを含んでもよい。発光デバイス200は2つの異なるサイズのLSPだけを含むことを特徴としているが、所望の出力を実現するために、より多くのサイズを用いることも出来る。
Claims (10)
- あるスペクトルの輻射を発光する少なくとも1つの発光体と、
前記少なくとも1つの発光体を少なくとも部分的に取り囲んでいる、第1のサイズを有する第1の複数の散乱粒子と、
前記少なくとも1つの発光体を少なくとも部分的に取り囲んでいる、第2のサイズを有する第2の複数の散乱粒子と
を備え、
前記発光体から発光する輻射の各部分が、前記第1および第2の複数の散乱粒子と相互作用することを特徴とする発光デバイス。 - 前記発光デバイスが少なくとも3つの異なるサイズの散乱粒子を備えるように、追加の複数の散乱粒子を更に備えることを特徴とする請求項1に記載の発光デバイス。
- 前記第1の複数の散乱粒子は、第1の波長範囲内に放出される輻射と相互作用し、
前記第2の複数の散乱粒子は、第2の波長範囲内に放出される輻射と相互作用することを特徴とする請求項1に記載の発光デバイス。 - 複数の発光体を更に備え、
前記発光体のそれぞれは、それぞれのスペクトルの輻射を放出することを特徴とする請求項1に記載の発光デバイス。 - 前記第1および第2の複数の散乱粒子は、放出された輻射の実質的にすべてが通過するように構成された封止体内に配置されていることを特徴とする請求項1に記載の発光デバイス。
- 前記第1および第2の複数の散乱粒子は、前記少なくとも1つの発光体を少なくとも部分的に取り囲む波長変換層内に配置されていることを特徴とする請求項1に記載の発光デバイス。
- 前記第1の複数の散乱粒子は、アルミナ粒子を含み、
前記アルミナ粒子は、約1−2μmの範囲の直径を有し、前記少なくとも1つの発光体を取り囲んでいる媒質内に体積濃度が約0.08%で分散していることを特徴とする請求項1に記載の発光デバイス。 - 前記第2の複数の散乱粒子は、サブミクロン・アルミナ粒子を含み、
前記サブミクロン・アルミナ粒子は、約1μm未満の直径を有し、前記媒質内に体積濃度が約0.14%で分散していることを特徴とする請求項7に記載の発光デバイス。 - 封止体であって、
第1の屈折率を有し、前記封止体の形状を画定する第1の材料と、
第2の屈折率を有し、前記第1の材料内に分散した、微粒子特性を有する第2の材料と、
第3の屈折率を有し、前記第1の材料内に分散した、微粒子特性を有する第3の材料と
を備えることを特徴とする封止体。 - 前記第2および前記第3の材料は、前記第1の材料の中で不均一に混ざっていることを特徴とする請求項9に記載の封止体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/895,573 | 2007-08-24 | ||
US11/895,573 US11114594B2 (en) | 2007-08-24 | 2007-08-24 | Light emitting device packages using light scattering particles of different size |
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JP2008163311A Division JP5091023B2 (ja) | 2007-08-24 | 2008-06-23 | 異なるサイズの光散乱粒子を用いた発光デバイスのパッケージ |
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JP2012129568A true JP2012129568A (ja) | 2012-07-05 |
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JP2008163311A Active JP5091023B2 (ja) | 2007-08-24 | 2008-06-23 | 異なるサイズの光散乱粒子を用いた発光デバイスのパッケージ |
JP2012083671A Pending JP2012129568A (ja) | 2007-08-24 | 2012-04-02 | 異なるサイズの光散乱粒子を用いた発光デバイスのパッケージ |
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US (1) | US11114594B2 (ja) |
JP (2) | JP5091023B2 (ja) |
DE (1) | DE102008029318A1 (ja) |
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US10784419B2 (en) | 2015-05-21 | 2020-09-22 | Nichia Corporation | Light emitting device |
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Also Published As
Publication number | Publication date |
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JP2009054995A (ja) | 2009-03-12 |
JP5091023B2 (ja) | 2012-12-05 |
US20090050911A1 (en) | 2009-02-26 |
DE102008029318A1 (de) | 2009-02-26 |
US11114594B2 (en) | 2021-09-07 |
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