CN101771025A - 发光二极管 - Google Patents

发光二极管 Download PDF

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Publication number
CN101771025A
CN101771025A CN200810306564A CN200810306564A CN101771025A CN 101771025 A CN101771025 A CN 101771025A CN 200810306564 A CN200810306564 A CN 200810306564A CN 200810306564 A CN200810306564 A CN 200810306564A CN 101771025 A CN101771025 A CN 101771025A
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light
emitting diode
chip
fluorescent material
another
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古金龙
阮青海
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CN200810306564A priority Critical patent/CN101771025A/zh
Priority to US12/465,589 priority patent/US8247825B2/en
Publication of CN101771025A publication Critical patent/CN101771025A/zh
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Abstract

一种发光二极管，其包括一发光二极管芯片、一承载芯片的基座、与芯片配合的荧光粉及一包封芯片及荧光粉的封罩，该发光二极管还包括另一芯片及与该另一芯片配合的另一荧光粉，该另一荧光粉的量多于该荧光粉。本发明的发光二极管可同时发出不同色温的光线，从而满足各种天气条件的需求。

Description

发光二极管
技术领域
本发明涉及一种发光二极管，特别是指一种可输出不同色温的发光二极管。
背景技术
作为一种新型的光源，发光二极管凭借其节能、环保、高效等特点，已被应用到越来越多的领域当中，大有取代传统光源的趋势。
发光二极管芯片是发光二极管内最为重要的元件，它决定了发光二极管的发光亮度及出光颜色。在通用照明领域，为了获取照明所必需的白光，目前最为普遍的方法是将一蓝光芯片与黄色荧光粉组合使用，通过混光效应而产生白光，即，芯片受电流所驱动而发出蓝光之后，一部分蓝光激发荧光粉使之发出黄光，这部分黄光与剩余的蓝光混合而形成所需的白光。
众所周知，不同色温的光线的穿透能力各有不同，其中高色温(＞8000k)的蓝光波长最短，其穿透能力最弱，而低色温(＜3500K)的橙光波长最长，其穿透能力最强。因此，对于户外灯而言，在较为晴朗的天气，一般会需要偏蓝的白光，以获取较好的照明效果；而当天气非常潮湿(如下雨或起雾)时，则一般会需要偏黄的白光，以使光线能够穿透水滴或雾气而传播较远的距离，以增强光线的可见性。但是，由于上述发光二极管仅能发出同一色温的光线，导致安装这些发光二极管的灯具的照明效果非常单一化，无法同时适应多种不同天气的需求。
发明内容
有鉴于此，实有必要提供一种可输出不同色温的发光二极管。
一种发光二极管，其包括一发光二极管芯片、一承载芯片的基座、与芯片配合的荧光粉及一包封芯片及荧光粉的封罩，其特征在于：该发光二极管还包括另一芯片及与该另一芯片配合的另一荧光粉，该另一荧光粉的量多于该荧光粉。
与现有技术相比，由于本发明的发光二极管内设有二芯片，且每一芯片均配备有不同量的荧光粉，因此，每一芯片所发出的光线被荧光粉吸收的程度不同，从而使经由荧光粉受激发所产生的光线与芯片发出的剩余光线所混合产生的混光具备不同的色温。故而，本发明的发光二极管可同时发出不同色温的光线，以适应各种天气状况的需求。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明第一实施例的发光二极管的截面图。
图2是本发明第二实施例的发光二极管的截面图。
图3是本发明第三实施例的发光二极管的截面图。
图4是本发明第四实施例的发光二极管的截面图。
图5是本发明第五实施例的发光二极管的截面图。
具体实施方式
请参阅图1，示出了本发明第一实施例的发光二极管。该发光二极管包括一基座110、一粘结在基座110上的发光二极管芯片120、将芯片120电性连接至基座110的二金线140及一密封芯片120及金线140的封罩130。
基座110包括一碗状的底座(图未标)及插设于底座内的三金属柱160。该底座由热导性良好且电绝缘的材料制成，如陶瓷。底座的上部开设一碗状的凹部112，以容置芯片120。该凹部112的底部为一平坦的表面，以稳定地支撑芯片120。该三金属柱160的顶部均与凹部112的底部齐平，以充分暴露于凹部112内。位于左右两侧的二金属柱160作用相当于连通发光二极管芯片120与外部电路(图未示)间的引脚，其顶面用于供金线140黏接，以在发光二极管内部形成一导电通路；其底面用于与电路板(图未示)上的导电轨迹相接触，以将电流输入进芯片120内。位于中部的金属柱160仅起一热导体的作用，其顶面用于供芯片120贴设，以将芯片120所产生的热量传导至发光二极管外部。该中部的金属柱160与两侧的二金属柱160通过底座隔开，以避免电性导通。该中部的金属柱160的直径大于两侧的金属柱160的直径，以最大限度地对芯片120进行散热。另外，应当指出，该中部的金属柱160并非发光二极管中的必备元件，当芯片120的功率较小以至于发热量有限时，中部的金属柱160可省去以节约成本。
芯片120通过银胶170黏接至中部金属柱160的顶面，其顶部的左右两侧分别形成二错落分布的电极122、124。芯片120的周围涂敷有一层荧光粉150，以对芯片120发出的光线进行修正，使输出至封罩130外部的光线可获得一较为理想的光色。
二金线140分别将芯片120的二电极122、124连接至两侧的二金属柱160的顶面。每一金线140均被设置为螺旋状，以形成一微型的电感。凭借电感“阻交流，通直流”的特性，该二金线140可有效遏制由于电路的瞬间闭合而产生的电流脉冲，从而保护芯片120。此外，在电路闭合之后，由于电流趋于稳定而变成直流，其可不受金线140所阻碍而输入进芯片120内，从而驱动芯片120持续发光。另外，相比于传统的弧线式的金线，由于采用了螺旋式的构造，本发明的发光二极管中的金线140可以更加有效地抵御封罩130的挤压而不至于断裂，以确保发光二极管的正常运作。当然，对于某些类型的覆晶型芯片(图未示)，由于其芯片的二电极为直接固定至基座110的二对应的金属柱160上，因此无须金线140即可将芯片与基座110电性导通。另外，必须指出，上述螺旋状的金线140仅是一种较佳的选择，普通的弧形的金线(图未示)亦同样可适用于本发明的发光二极管中。
封罩130通过透明的环氧树脂射入成型而与基座110固结成一体，其填满整个凹部112并向上凸伸出一弧状的部分，从而在基座110上形成一凸透镜。由此，封罩130不仅可以起到密封芯片120及金线140的作用，还可同时对芯片120的光线进行调整，以获得良好的出光效果。对于某些类型的发光二极管而言，其封罩130与基座110是一体成型的，因此该种发光二极管的基座110亦相当于封罩130的一部分。
如图2所示，其为本发明第二实施例的发光二极管。在图2中，仅有芯片120、基座110、封罩130及荧光粉150c被示出，其他元件，如金线140及金属柱160均被省去以方便观察。该第二实施例的各元件与第一实施例的各元件均相同，仅量有所变化。该发光二极管在基座110上设置有二相同的芯片120及二分别涂敷于芯片120上的荧光粉150c。本发明中该二芯片120均为发射蓝光的GaN或InGaN半导体发光芯片，荧光粉150c则均为黄色的钇铝石榴石荧光粉(YAG)或硅酸盐基底(silicated-based)荧光粉，可以理解地，其他可发出蓝光的半导体发光芯片及可受蓝光激发而发出黄光的荧光粉亦同样适用于本发明的发光二极管中。该二芯片120的周围所涂敷的荧光粉150c量不同，其中左侧荧光粉150c的浓度与右侧荧光粉150c的浓度相同，但厚度小于右侧荧光粉150c的厚度。经由此种差异化的设计，左侧芯片120所发出的蓝光仅有小部分被荧光粉150c吸收而激发成黄光，继而与剩余的大部分蓝光混合形成高色温的偏蓝的白光；右侧芯片120则刚好相反，其所发出的大部分蓝光均被荧光粉150c转化成黄光，从而导致混合的白光偏向于低色温的黄色。该二芯片120分别通过不同的电路(图未示)被独立地控制，以根据不同的天气条件将发光二极管切换至不同的色温，比如，当天气比较晴朗时，导通左侧的发光二极管芯片120使发光二极管发出偏蓝的白光；当天气由于起雾或下雨而非常潮湿时，导通右侧的发光二极管芯片120使发光二极管发出偏黄的白光。
上述二荧光粉150c是直接涂敷于芯片120表面，由于芯片120尺寸太小，导致荧光粉150c不易涂抹均匀，进而影响二芯片120间不同色温的调配关系。因此，为克服该问题，本发明还提供了另一种不同结构的发光二极管。参阅图3，示出了本发明第三实施例的发光二极管，其与第二实施例的区别在于二荧光粉150c分别被首先封入不同尺寸大小的二分离的另一封罩190d内，然后再通过一更大的封罩130d密封起来。由于封罩190d材料(环氧树脂)的热塑性，荧光粉可在另一封罩190d射入到基座110上之前掺入到还处于熔化状态的另一封罩190d中，然后通过搅拌均匀地分布在另一封罩190d内，从而克服上述涂抹不均的问题。在该第三实施例中，该二另一封罩190d内的荧光粉150c浓度相同，但由于二另一封罩190d大小不同，导致左右两侧荧光粉150c的量亦有区别。封罩130d须待另一封罩190d硬化之后再射入至基座110上，以防止对另一封罩190d的成型造成干扰。封罩130d可以采用与另一封罩190d相同的材料制成，也可采用较另一封罩190d折射率更低的材料制成，从而增强发光二极管的整体出光效果。
当然，由于另一封罩190d的尺寸远大于芯片120的尺寸，其可以为荧光粉150c提供充分的涂敷区域，从而使上述荧光粉150c可均匀地涂敷于其表面。如图4所示，其为本发明的第四实施例的发光二极管。在该实施例中，二浓度相同的荧光粉150c被以相同的厚度直接涂抹于二另一封罩190d外表面，然后再通过封罩130d密封起来，此时另一封罩190d内部未包含有任何的荧光粉150c。由于二另一封罩190d的大小不同，即使二荧光粉150c的浓度及厚度一致，其量亦仍会有所差别，从而确保发光二极管能够产生不同的色温。
可以理解地，上述不同量的荧光粉150c还可通过其他不同的方式实现，如图5所示的第五实施例，其与第二实施例的结构基本类似，但其二荧光粉150f被设置为以厚度相同但浓度不同的方式环绕于各自芯片120的周围。

Claims (10)

1.一种发光二极管，其包括一发光二极管芯片、一承载芯片的基座、与芯片配合的荧光粉及一包封芯片及荧光粉的封罩，其特征在于：该发光二极管还包括另一芯片及与该另一芯片配合的另一荧光粉，该另一荧光粉的量多于该荧光粉。
2.如权利要求1所述的发光二极管，其特征在于：该荧光粉及另一荧光粉分别涂抹于该芯片及另一芯片的表面。
3.如权利要求1所述的发光二极管，其特征在于：其还包括二次级封罩，该二次级封罩分别包封该芯片及另一芯片并被该封罩所包覆。
4.如权利要求3所述的发光二极管，其特征在于：该荧光粉及另一荧光粉分别掺入至二次级封罩内。
5.如权利要求3所述的发光二极管，其特征在于：该荧光粉及另一荧光粉分别涂敷于二次级封罩的外表面。
6.如权利要求3所述的发光二极管，其特征在于：每一次级封罩的折射率大于该封罩的折射率。
7.如权利要求3所述的发光二极管，其特征在于：该二次级封罩的尺寸不同。
8.如权利要求1至7任一项所述的发光二极管，其特征在于：该荧光粉及另一荧光粉的浓度相同。
9.如权利要求1所述的发光二极管，其特征在于：该荧光粉及另一荧光粉的浓度不同。
10.如权利要求1至7任一项所述的发光二极管，还包括分别将该芯片及另一芯片电性连接至基座的螺旋状的金线。
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