JP2012089874A - プリント基板の製造方法 - Google Patents
プリント基板の製造方法 Download PDFInfo
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Abstract
【解決手段】基板に金属パネルをレーザ投影パターニングすることと、金属パネル上に誘電体層をラミネートすることと、基板の複数のビアを形成すべく基板をレーザ照射することと、基板のシードコートをレーザ活性化することと、基板のパターニングされていない部分からシードコートを洗浄することと、基板に、パターニングされたビルドアップ層を形成することと、複数の金属突起を形成すべく金属めっきをエッチングで除去することによりプリント回路を形成する。
【選択図】図8
Description
Claims (20)
- 基板の金属パネルをレーザ投影パターニングすることと、
前記金属パネル上に誘電体層をラミネートすることと、
前記基板に複数のビアを形成すべく前記基板をレーザ照射することと、
前記基板のシードコートをレーザ活性化することと、
前記基板のパターニングされていない部分から前記シードコートを洗浄することと、
前記基板に、パターニングされたビルドアップ層を形成することと、
複数の金属突起を形成すべく金属めっきをエッチングで除去することと、を含む方法。 - 前記シードコートを形成すべく、前記基板をシード溶液内で浸漬被覆することをさらに含む、請求項1に記載の方法。
- 配線形成すべく、所定の配線パターンにより、前記パターニングされたビルドアップ層の複数の配線および前記複数のビアに対して選択的に金属を電解めっきすることをさらに含み、犠牲銅めっきを利用して前記電解めっきに電気接続が提供される、請求項1に記載の方法。
- 前記シードコートを洗浄することの前に、レーザ支援メタライゼーションを行うことと、
前記パターニングされたビルドアップ層‐基板の組み合わせを無電解めっきして無電解めっき基板を生成することで、前記所定の配線パターンにより、前記パターニングされたビルドアップ層‐基板の組み合わせ上にパターニングされた導電層を形成することと、をさらに含む請求項1に記載の方法。 - パターニングされたビルドアップ層を形成することは、前記シードコートの複数の非活性部を除去することを含む、請求項1に記載の方法。
- 前記複数の配線を電解金属めっきすることをさらに含む、請求項3に記載の方法。
- パラジウムドライフィルムレジストラミネートすることと、
前記基板をドライフィルムレジストストリップすることと、をさらに含む、請求項3に記載の方法。 - 前記シードコートは酢酸パラジウムを含む、請求項1に記載の方法。
- 前記ビルドアップ層は、パラジウムシード有機ビルドアップ層を含む、請求項1に記載の方法。
- レーザ投影パターニングすることは、複数のマイクロビアを掘削することをさらに含む、請求項1に記載の方法。
- 金属パネルを含む基板と、
前記基板に連結されたシードコートと、
前記金属パネルに連結されたラミネート誘電体層と、
前記基板に設けられた複数のビアと、
前記基板に連結されたパターニングされたビルドアップ層と、
前記基板に連結された複数の金属突起と、を含むプリント回路基板。 - 前記シードコートは前記基板に浸漬被覆される、請求項11に記載のプリント回路基板。
- 配線形成すべく、所定の配線パターンにより、前記パターニングされたビルドアップ層の複数の配線および前記複数のビアに対して選択的に連結される金属層をさらに含み、犠牲銅めっきにより前記金属層の電気接続が提供される、請求項11に記載のプリント回路基板。
- 前記パターニングされたビルドアップ層‐基板の組み合わせを無電解めっきして無電解めっき基板を生成することで、所定の配線パターンにより、前記パターニングされたビルドアップ層‐基板の組み合わせに連結されるパターニングされた導電層をさらに含む、請求項11に記載のプリント回路基板。
- 前記シードコートは酢酸パラジウムを含む、請求項11に記載のプリント回路基板。
- プリント回路基板と、
前記プリント回路基板に連結されたメモリデバイスと、を含むシステムであって、
前記プリント回路基板は、
金属パネルを含む基板と、
前記基板に連結されたシードコートと、
前記金属パネルに連結されたラミネート誘電体層と、
前記基板に設けられた複数のビアと、
前記基板に連結されたパターニングされたビルドアップ層と、
前記基板に連結された複数の金属突起と、を含むシステム。 - 前記パターニングされたビルドアップ層の複数の配線および前記複数のビアに選択的に連結される金属層をさらに含み、犠牲銅めっきにより前記金属層の電気接続が提供される、請求項16に記載のシステム。
- 前記パターニングされたビルドアップ層‐基板の組み合わせに連結され無電解めっきされた、パターニングされた導電層をさらに含む、請求項16に記載のシステム。
- 前記シードコートは酢酸パラジウムを含む、請求項16に記載のシステム。
- 前記シードコートは前記基板に浸漬被覆される、請求項16に記載のシステム。
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WO2007078865A2 (en) | 2007-07-12 |
US7765691B2 (en) | 2010-08-03 |
KR101025435B1 (ko) | 2011-03-28 |
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TWI327881B (en) | 2010-07-21 |
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CN101347053B (zh) | 2011-04-27 |
CN101347053A (zh) | 2009-01-14 |
DE112006003613B4 (de) | 2017-11-23 |
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