TWI394506B - 多層立體線路的結構及其製作方法 - Google Patents

多層立體線路的結構及其製作方法 Download PDF

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TWI394506B
TWI394506B TW097139189A TW97139189A TWI394506B TW I394506 B TWI394506 B TW I394506B TW 097139189 A TW097139189 A TW 097139189A TW 97139189 A TW97139189 A TW 97139189A TW I394506 B TWI394506 B TW I394506B
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dimensional
insulating
insulating layer
dimensional line
line structure
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TW201016093A (en
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Han Pei Huang
Cheng Hung Yu
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Unimicron Technology Corp
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Priority to TW097139189A priority Critical patent/TWI394506B/zh
Priority to US12/333,014 priority patent/US7987589B2/en
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Priority to US13/166,133 priority patent/US20110253435A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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Description

多層立體線路的結構及其製作方法
本發明是有關於一種立體線路的結構及其製作方法，且特別是有關於一種多層立體線路的結構及其製作方法。
近年來，隨著電子技術的日新月異，以及高科技電子產業的相繼問世，使得更人性化、功能更佳的電子產品不斷地推陳出新，並朝向輕、薄、短、小的趨勢邁進。於習知技術中，主要是藉由線路板承載多個電子元件以及使這些電子元件彼此電性連接，並將線路板配置於一殼體中以保護線路板及電子元件。然而，電子產品的外型受限於線路板的形狀以及大小，而使電子產品的外型多近似平板狀而少有其他的立體形狀。
因而，為了直接形成如線路板上的訊號線於立體結構上，以取代習知的線路板，立體模塑互連裝置(Molded Interconnect Device，MID)的概念孕育而生，其整合電子與機械的功能於一立體結構上，改變了長期以來對於「平面」印刷電路板的印象。MID技術能在立體結構的表面上形成立體線路結構，以節省機殼內部的空間，並使電子產品更微型化。
圖1繪示習知之立體線路的剖面示意圖。請參照圖1，習知的立體線路100具有一立體結構110與一立體線路結構120，且立體線路結構120配置於立體結構110的一表 面112上。然而，習知的立體線路100僅具有單層的立體線路結構120，因此，立體結構110需具有足夠的表面積以承載所有的立體線路結構120。由前述可知，當立體結構110的表面積較小時，立體結構110將無法承載所有的立體線路結構120。
本發明提出一種多層立體線路的製作方法，可製作具有多層的立體線路結構的一立體線路。
本發明另提出一種多層立體線路的結構，其具有多層的立體線路結構。
本發明提出一種多層立體線路的製作方法如下所述。首先，提供一立體絕緣結構。接著，於立體絕緣結構的一表面上形成一第一立體線路結構。然後，形成一絕緣層，絕緣層覆蓋第一立體線路結構。之後，於絕緣層上形成一第二立體線路結構。然後，形成至少一貫穿絕緣層的導電孔道，以使第二立體線路結構與第一立體線路結構電性連接。
在本發明之一實施例中，形成立體絕緣結構與第一立體線路結構的方法如下所述。首先，射出成型或噴墨快速成型具有一立體化表面的立體絕緣結構。之後，於立體化表面上熱壓印(hot embossing)或電鑄(electroforming)一第一金屬化圖案，以形成第一立體線路結構。
在本發明之一實施例中，形成絕緣層以及第二立體線路結構的方法如下所述。首先，以二次成型法(two-shot molding)或插入模塑法(insert molding)或噴墨快速成型法形成絕緣層，絕緣層包覆立體絕緣結構與第一立體線路結構。之後，於絕緣層上熱壓印或電鑄一第二金屬化圖案，以形成第二立體線路結構。
在本發明之一實施例中，形成立體絕緣結構與第一立體線路結構的方法如下所述。首先，射出成型或噴墨快速成型具有一第一立體化表面的立體絕緣結構，其材質包括具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化。之後，以雷射法活化第一立體化表面之預定形成第一立體線路結構的區域。然後，進行一表面金屬化製程，以於第一立體化表面之預定形成第一立體線路結構的區域上形成第一立體線路結構。
在本發明之一實施例中，表面金屬化製程包括化學沉積法。
在本發明之一實施例中，在完成立體絕緣結構、第一立體線路結構後，更包括於第一立體化表面上形成一黏著層，其覆蓋第一立體線路結構。
在本發明之一實施例中，在完成絕緣層以及第二立體線路結構後，更包括壓合絕緣層至黏著層上，其中第二立體化表面大致上與第一立體化表面的形狀相同。
在本發明之一實施例中，形成絕緣層以及第二立體線路結構的方法如下所述。首先，射出成型或噴墨快速成型具有一第二立體化表面與一第三立體化表面的絕緣層，且第二立體化表面相對於第三立體化表面，絕緣層的材質包 括具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化。然後，以雷射法活化第三立體化表面之預定形成第二立體線路結構的部分。之後，進行一表面金屬化製程，以於第三立體化表面之預定形成第二立體線路結構的部分上形成第二立體線路結構。
在本發明之一實施例中，表面金屬化製程包括化學沉積法。
在本發明之一實施例中，形成立體絕緣結構與第一立體線路結構的方法如下所述。首先，射出成型或噴墨快速成型具有一立體化表面的立體絕緣結構。接著，形成一第一導電層於立體化表面上。然後，蝕刻部分第一導電層，以形成第一立體線路結構。
在本發明之一實施例中，形成絕緣層以及第二立體線路結構的方法如下所述。首先，塗佈一絕緣材料於立體化表面上，以形成絕緣層。接著，形成一第二導電層於絕緣層上。然後，蝕刻部分第二導電層，以形成第二立體線路結構。
在本發明之一實施例中，立體絕緣結構於絕緣層的材質是一塑性材料，塑性材料包括工程塑膠、陶瓷或玻璃。
在本發明之一實施例中，工程塑膠的材質可以選自於由聚碳酸酯樹脂(po1ycarbonate,PC)、丙烯－丁二烯－苯乙烯共聚合物(acrylonitrile－butadiene－styrene copolymer,ABS copolymer)、聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)樹脂、聚對苯二甲酸丁二酯(polybutylene terephthalate,PBT)樹脂、液晶高分子(liquid crystal polymers,LCP)、聚醯胺6(polyamide 6,PA 6)、尼龍(Nylon)、共聚聚甲醛(polyoxymethylene,POM)、聚苯硫醚(polyphenylene sulfide,PPS)及環狀烯烴共聚高分子(cyclic olefin copolymer,COC)所組成的群組。
在本發明之一實施例中，塑性材料更包括具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化，觸媒顆粒是選自於由金屬氧化物顆粒、金屬氮化物顆粒及金屬錯合物顆粒所組成的群組。
在本發明之一實施例中，觸媒顆粒的材質可以選自於由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
本發明提出一種多層立體線路的結構，包括一立體絕緣結構、一第一立體線路結構、一絕緣層、一第二立體線路結構以及至少一導電孔道。立體絕緣結構具有至少一立體化表面。第一立體線路結構配置於立體化表面上。絕緣層配置於立體絕緣結構上，絕緣層覆蓋第一立體線路結構。第二立體線路結構配置於絕緣層上。導電孔道貫穿絕緣層，並電性連接第一立體線路結構與第二立體線路結構。
在本發明之一實施例中，立體絕緣結構為一射出成型結構(injection molding structure)或一噴墨快速成型結構。
在本發明之一實施例中，絕緣層為一射出成型體(injection molding structure)、一塗佈成型體(coating structure)、二次成型體(two－shot molding structure)或插入模塑成型體(insert molding structure)或一噴墨快速 成型體。
在本發明之一實施例中，絕緣層為射出成型體(injection molding structure)，而多層立體線路結構更包括一黏著層，其配置於絕緣層與立體絕緣結構之間。
在本發明之一實施例中，立體絕緣結構與絕緣層的材質為一塑性材料，該塑性材料包括工程塑膠、陶瓷或玻璃。
在本發明之一實施例中，工程塑膠的材質可以選自於由聚碳酸酯樹脂、丙烯－丁二烯－苯乙烯共聚合物、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、液晶高分子、聚醯胺、尼龍、共聚聚甲醛、聚苯硫醚及環狀烯烴共聚高分子所組成的群組。
在本發明之一實施例中，塑性材料更包括具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化，觸媒顆粒為金屬氧化物顆粒、金屬氮化物顆粒或金屬錯合物顆粒。
在本發明之一實施例中，觸媒顆粒的材質可以選自於由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
承上所述，由於本發明之多層立體線路的製作方法可製得具有多層立體線路結構的立體線路，因此，相較於習知技術，本發明可更有效地利用立體絕緣結構的表面。
為讓本發明之上述和其他特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式，作詳細說明如下。
圖2為本發明一實施例之多層立體線路的製作流程 圖。請參照圖2，在本實施例中，多層立體線路的製作方法包括下列步驟：首先，如步驟S1所示，提供一立體絕緣結構，立體絕緣結構的形成方法例如是射出成型或噴墨快速成型。
立體絕緣結構的材質例如為一塑性材料，塑性材料包括工程塑膠、陶瓷或玻璃。工程塑膠的材質是選自於由聚碳酸酯樹脂、丙烯－丁二烯－苯乙烯共聚合物、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、液晶高分子、聚醯胺、尼龍、共聚聚甲醛、聚苯硫醚及環狀烯烴共聚高分子所組成的群組。塑性材料可選擇性地為具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化，且可藉由表面金屬化製程在雷射活化後的觸媒顆粒上形成一金屬層。觸媒顆粒可以是選自於由金屬氧化物顆粒、金屬氮化物顆粒及金屬錯合物顆粒所組成的群組，或者是由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
接著，如步驟S2所示，於立體絕緣結構的一表面上形成一第一立體線路結構。值得注意的是，當立體絕緣結構的材質為一般的塑性材料時，形成第一立體線路結構的方法可以是在立體絕緣結構的表面上進行熱壓印或電鑄。
當立體絕緣結構的材質為具有多個觸媒顆粒的絕緣材料時，形成第一立體線路結構的方法可以是先以雷射法活化立體絕緣結構的部分表面，然後，在立體絕緣結構的部分表面上進行一表面金屬化製程。
然後，如步驟S3所示，形成一絕緣層，其覆蓋第一 立體線路結構，形成絕緣層的方法可以是二次成型法、插入模塑法、射出成型法、塗佈法、噴塗法、噴墨快速成型法或是其他適合的形成方法。噴墨快速成型法的原理源自「快速成型」(Rapid Prototyping)，快速成型為一種結合CAD與層狀加工之自由實體製造技術，其將電腦設計模型透過切層處理後，以疊層加工的方式製作實體模型。噴墨快速成型法主要是利用3D印表機來製作實體模型，3D印表機原理類似噴墨印表機，只不過由粉末取代紙張，膠水取代墨水，再將原本平面的薄片，一層層的堆疊出立體物件。前述粉末為複合式粉料，其材質包括石膏、澱粉、ABS塑料。
以噴墨快速成型法製作絕緣層的流程如下所述。首先，以3D電腦輔助設計(3D CAD)系統，繪製出絕緣層的立體模型，再將3D檔案輸入3D印表機。接著，3D印表機內塗敷滾輪先從原料區，將複合式粉料送至成型平台，鋪上薄薄且均勻的一層。然後，成型噴頭再噴出膠水在粉末上，加以黏結並印出模型的橫剖面。之後，塗敷滾輪及噴頭退回原料區，成型平台向下降一層，反覆執行「列印」工作，直到絕緣層的模型完工。此外，在絕緣層完成之後，還可用硬化劑滴塗或浸泡絕緣層，並擺放10至15分鐘待絕緣層固定。
絕緣層的材質可為一塑性材料，塑性材料包括工程塑膠、陶瓷或玻璃。塑性材料可選擇性地為具有多個觸媒顆粒的絕緣材料，其中觸媒顆粒適於被雷射活化。觸媒顆粒 可以是選自於由金屬氧化物顆粒、金屬氮化物顆粒及金屬錯合物顆粒所組成的群組，或者是由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
之後，如步驟S4所示，於絕緣層上形成一第二立體線路結構。值得注意的是，與形成第一立體線路結構的方法一樣，當絕緣層的材質為一般的塑性材料時，形成第二立體線路結構的方法可以是在絕緣層的表面上進行熱壓印或電鑄。
當絕緣層的材質為具有多個觸媒顆粒的絕緣材料時，形成第二立體線路結構的方法可以是先以雷射法活化絕緣層的部分表面，然後，在絕緣層的部分表面上進行表面金屬化製程。
然後，如步驟S5所示，形成至少一貫穿絕緣層的導電孔道，以使第二立體線路結構與第一立體線路結構電性連接。值得注意的是，當絕緣層的材質為一般的塑性材料時，形成導電孔道的方法可以是在絕緣層的貫孔內壁進行電鑄。
當絕緣層的材質為具有多個觸媒顆粒的絕緣材料時，形成導電孔道的方法可以是先以雷射法活化絕緣層的貫孔內壁，然後，在絕緣層的貫孔內壁上進行表面金屬化製程。
值得注意的是，本實施例之步驟S1~步驟S5只形成兩層立體線路結構，但是在其他實施例中，可在步驟S5之後，依照所需的立體線路結構的層數而多次重複步驟S3 ~步驟S5。因此，在其他實施例中，立體線路結構的層數可以多於兩層，例如是三層、四層或四層以上等。值得注意的是，本實施例之每一步驟中的構件的各種材質與製作方法皆可與其他步驟中的構件的各種材質與製作方法任意組合。
承上所述，由於本實施例之多層立體線路的製作方法可製得具有多層立體線路結構的立體線路，因此，相較於習知技術，本實施可更有效地利用立體絕緣結構的表面。
為能更詳細地了解本發明之多層立體線路的製作方法，本發明將於下文中例舉三個實施例來作說明。值得注意的是，下列三個實施例並非用以限制本發明之多層立體線路的製作方法。
圖3A~圖3B為本發明一實施例之多層立體線路的製程剖面圖。首先，請參照圖3A，射出成型或噴墨快速成型具有一立體化表面312的立體絕緣結構310。立體絕緣結構310的材質例如為一塑性材料，塑性材料包括工程塑膠、陶瓷或玻璃。工程塑膠的材質是選自於由聚碳酸酯樹脂、丙烯－丁二烯－苯乙烯共聚合物、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、液晶高分子、聚醯胺、尼龍、共聚聚甲醛、聚苯硫醚及環狀烯烴共聚高分子所組成的群組。
此外，塑性材料可選擇性地為具有多個觸媒顆粒(未繪示)的絕緣材料，其中觸媒顆粒適於被雷射活化。觸媒顆粒可以是選自於由金屬氧化物顆粒、金屬氮化物顆粒及 金屬錯合物顆粒所組成的群組，或者是由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
接著，於立體化表面312上熱壓印或電鑄一第一金屬化圖案，以形成一第一立體線路結構320。若立體絕緣結構310的材質包括具有多個觸媒顆粒的絕緣材料時，形成第一立體線路結構320的方法如下所述。首先，以雷射法活化立體化表面312之預定形成第一立體線路結構320的區域。然後，可在立體化表面312之預定形成第一立體線路結構320的區域進行一表面金屬化製程，以形成第一立體線路結構320。
然後，請參照圖3B，以二次成型法、噴塗法、噴墨快速成型法或插入模塑法形成一絕緣層330，其可包覆立體絕緣結構310與第一立體線路結構320。之後，請再次參照圖3B，在絕緣層330上熱壓印或電鑄一第二金屬化圖案，以形成第二立體線路結構340。然後，形成多個貫穿絕緣層330的導電孔道350(conductive via)，以使第二立體線路結構340與第一立體線路結構320電性連接。
接下來，將針對圖3B中的多層立體線路的結構部分進行詳細的描述。
請參照圖3B，本實施例之多層立體線路300的結構包括一立體絕緣結構310、一第一立體線路結構320、一絕緣層330、一第二立體線路結構340以及多個導電孔道350。
立體絕緣結構310例如是一射出成型結構或一噴墨快速成型結構，其具有至少一立體化表面312，例如弧面、 具有顆粒或凸起的表面、具有凹槽的表面或其他非平坦表面。在本實施例中，為因應與其他密合性的組合構件的接合需求，可在非平坦表面上形成一接合部，以達到對位或者是固定的功效。第一立體線路結構320配置於立體化表面312上。絕緣層330配置於立體絕緣結構310上，並覆蓋第一立體線路結構320，且絕緣層330可為一二次成型體、噴墨成型體或插入模塑成型體。第二立體線路結構340配置於絕緣層330上，而導電孔道350貫穿絕緣層330，並電性連接第一立體線路結構320與第二立體線路結構340。
圖4A~圖4C為本發明另一實施例之多層立體線路的製程剖面圖。首先，請參照圖4A，射出成型或噴墨快速成型具有一第一立體化表面412的立體絕緣結構410，其材質例如為具有多個觸媒顆粒的絕緣材料。接著，以雷射法活化第一立體化表面412之預定形成第一立體線路結構的區域。然後，在第一立體化表面412之預定形成第一立體線路結構的區域上，進行一表面金屬化製程，以形成第一立體線路結構420。表面金屬化製程例如是在第一立體化表面412之預定形成第一立體線路結構的區域上進行化學沉積，或者是先進行化學沉積，然後再進行電鍍沉積。
然後，請參照圖4B，於第一立體化表面412上選擇性地形成一黏著層430，其覆蓋第一立體線路結構420。之後，射出成型或噴墨快速成型具有一第二立體化表面442與一第三立體化表面444的絕緣層440，且第二立體化表 面442相對於第三立體化表面444。第二立體化表面442大致上與第一立體化表面412的形狀相同。絕緣層440的材質可為具有多個觸媒顆粒的絕緣材料。此外，在其他實施例中，也可直接以二次成型法、噴墨快速成型法或插入模塑法形成絕緣層440，而不須形成黏著層430。
接著，請參照圖4C，壓合絕緣層440至黏著層430上，以使絕緣層440藉由黏著層430而固定在第一立體化表面412上。然後，以雷射法活化第三立體化表面444之預定形成第二立體線路結構的部分，以形成一第二立體線路結構450。之後，形成多個貫穿絕緣層440的導電孔道460，以使第二立體線路結構450與第一立體線路結構420電性連接。
形成導電孔道460的方法可為如下所述。首先，形成貫穿絕緣層440的多個貫孔446。然後，以雷射法活化貫孔446的內壁。之後，對貫孔446的內壁進行表面金屬化製程。此外，形成導電孔道460的方法也可以是在貫孔446的內壁上進行電鑄。
接下來，將針對圖4C中的多層立體線路的結構部分進行詳細的描述。
請參照圖4C，本實施例之多層立體線路400的結構包括一立體絕緣結構410、一第一立體線路結構420、一黏著層430、一絕緣層440、一第二立體線路結構450以及多個導電孔道460。
立體絕緣結構410例如是一射出成型結構或一噴墨快 速成型結構，其具有一第一立體化表面412。第一立體線路結構420配置於第一立體化表面412上。在本實施例中，立體絕緣結構410的材質可為具有多個觸媒顆粒的絕緣材料。第一立體線路結構420是在前述觸媒顆粒受雷射活化之後，在雷射活化的觸媒顆粒上進行表面金屬化製程所形成的線路結構。
絕緣層440配置於立體絕緣結構410上，並覆蓋第一立體線路結構420，且絕緣層440可為一射出成型體或一噴墨快速成型體。黏著層430配置於絕緣層440與立體絕緣結構410之間，以接合絕緣層440與立體絕緣結構410。第二立體線路結構450配置於絕緣層440上，而導電孔道460貫穿絕緣層440，並電性連接第一立體線路結構420與第二立體線路結構450。
在本實施例中，絕緣層440的材質可為具有多個觸媒顆粒的絕緣材料，而第二立體線路結構450是在前述觸媒顆粒受雷射活化之後，在雷射活化的觸媒顆粒上進行表面金屬化製程所形成的線路結構。
圖5A~圖5D為本發明又一實施例之多層立體線路的製程剖面圖。
首先，請參照圖5A，射出成型或噴墨快速成型具有一立體化表面512的立體絕緣結構510。接著，形成一第一導電層520a於立體化表面512上。
然後，請參照圖5B，蝕刻部分第一導電層520a，以形成第一立體線路結構520。之後，請參照圖5C，塗佈一 絕緣材料於立體化表面512上，以形成絕緣層530。接著，形成一第二導電層540a於絕緣層530上。
然後，請參照圖5D，蝕刻部分第二導電層540a，以形成第二立體線路結構540。之後，形成多個貫穿絕緣層530的導電孔道550，以使第二立體線路結構540與第一立體線路結構520電性連接。
此外，請參照圖5D，就結構而言，本實施例之多層立體線路500的結構與圖3B的多層立體線路300的結構相似，兩者的差異之處在於本實施例之絕緣層530為一塗佈成型體。
綜上所述，由於本發明之多層立體線路的製作方法可製得具有多層立體線路結構的立體線路，因此，相較於習知技術，本發明可更有效地利用立體絕緣結構的表面。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100‧‧‧立體線路
110‧‧‧立體結構
112‧‧‧表面
120‧‧‧立體線路結構
300、400、500‧‧‧多層立體線路
310、410、510‧‧‧立體絕緣結構
312、512‧‧‧立體化表面
320、420、520‧‧‧第一立體線路結構
330、440、530‧‧‧絕緣層
340、450、540‧‧‧第二立體線路結構
350、460、550‧‧‧導電孔道
412‧‧‧第一立體化表面
430‧‧‧黏著層
442‧‧‧第二立體化表面
444‧‧‧第三立體化表面
446‧‧‧貫孔
520a‧‧‧第一導電層
540a‧‧‧第二導電層
S1、S2、S3、S4、S5‧‧‧步驟
圖1繪示習知之立體線路的剖面圖。
圖2為本發明一實施例之多層立體線路的製作流程圖。
圖3A~圖3B為本發明一實施例之多層立體線路的製程剖面圖。
圖4A~圖4C為本發明另一實施例之多層立體線路的 製程剖面圖。
圖5A~圖5D為本發明又一實施例之多層立體線路的製程剖面圖。
300‧‧‧多層立體線路
310‧‧‧立體絕緣結構
312‧‧‧立體化表面
320‧‧‧第一立體線路結構
330‧‧‧絕緣層
340‧‧‧第二立體線路結構
350‧‧‧導電孔道

Claims (21)

  1. 一種多層立體線路的製作方法，包括：提供一立體絕緣結構；於該立體絕緣結構的一表面上形成一第一立體線路結構；形成一絕緣層，該絕緣層覆蓋該第一立體線路結構；於該絕緣層上形成一第二立體線路結構；以及形成至少一貫穿該絕緣層的導電孔道，以使該第二立體線路結構與該第一立體線路結構電性連接，其中形成該立體絕緣結構與該第一立體線路結構的方法包括：射出成型或噴墨快速成型具有一第一立體化表面的該立體絕緣結構，其材質包括具有多個觸媒顆粒的絕緣材料；以及以雷射法活化該第一立體化表面之預定形成該第一立體線路結構的區域；進行一表面金屬化製程，以於該第一立體化表面之預定形成該第一立體線路結構的區域上形成該第一立體線路結構。
  2. 如申請專利範圍第1項所述之多層立體線路的製作方法，其中該表面金屬化製程包括化學沉積法。
  3. 如申請專利範圍第1項所述之多層立體線路的製作方法，在完成該立體絕緣結構、該第一立體線路結構後，更包括，於該第一立體化表面上形成一黏著層，其覆蓋該 第一立體線路結構。
  4. 如申請專利範圍第3項所述之多層立體線路的製作方法，在完成該絕緣層以及該第二立體線路結構後，更包括，壓合該絕緣層至該黏著層上，其中該第二立體化表面大致上與該第一立體化表面的形狀相同。
  5. 如申請專利範圍第1項所述之多層立體線路的製作方法，其中形成該絕緣層以及該第二立體線路結構的方法包括：射出成型或噴墨快速成型具有一第二立體化表面與一第三立體化表面的該絕緣層，且該第二立體化表面相對於該第三立體化表面，該絕緣層的材質包括具有多個觸媒顆粒的絕緣材料；以及以雷射法活化該第三立體化表面之預定形成該第二立體線路結構的部分；進行一表面金屬化製程，以於該第三立體化表面之預定形成該第二立體線路結構的部分上形成該第二立體線路結構。
  6. 如申請專利範圍第5項所述之多層立體線路的製作方法，其中該表面金屬化製程包括化學沉積法。
  7. 如申請專利範圍第1項所述之多層立體線路的製作方法，其中形成該立體絕緣結構與該第一立體線路結構的方法包括：射出成型或噴墨快速成型具有一立體化表面的該立體絕緣結構； 形成一第一導電層於該立體化表面上；以及蝕刻部分該第一導電層，以形成該第一立體線路結構。
  8. 如申請專利範圍第7項所述之多層立體線路的製作方法，其中形成該絕緣層以及該第二立體線路結構的方法包括：塗佈一絕緣材料於該該立體化表面上，以形成該絕緣層；形成一第二導電層於該絕緣層上；以及蝕刻部分該第二導電層，以形成該第二立體線路結構。
  9. 如申請專利範圍第1項所述之多層立體線路的製作方法，其中該立體絕緣結構與絕緣層的材質為一塑性材料，該塑性材料包括工程塑膠、陶瓷或玻璃。
  10. 如申請專利範圍第9項所述之多層立體線路的製作方法，其中該工程塑膠的材質是選自於由聚碳酸酯樹脂、丙烯-丁二烯-苯乙烯共聚合物、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、液晶高分子、聚醯胺、尼龍、共聚聚甲醛、聚苯硫醚及環狀烯烴共聚高分子所組成的群組。
  11. 如申請專利範圍第9項所述之多層立體線路的製作方法，其中該塑性材料更包括具有多個觸媒顆粒的絕緣材料。
  12. 如申請專利範圍第11項所述之多層立體線路的 製作方法，其中該些觸媒顆粒是選自於由金屬氧化物顆粒、金屬氮化物顆粒及金屬錯合物顆粒所組成的群組。
  13. 如申請專利範圍第11項所述之多層立體線路的製作方法，其中該觸媒顆粒的材質是選自於由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
  14. 一種多層立體線路的結構，包括：一立體絕緣結構，且該立體絕緣結構具有至少一立體化表面，其中該立體絕緣結構更包括具有多個觸媒顆粒的絕緣材料，且該觸媒顆粒適於被雷射活化；一第一立體線路結構，配置於該立體化表面上；一絕綠層，配置於該立體絕緣結構上，該絕緣層覆蓋該第一立體線路結構；一第二立體線路結構，配置於該絕緣層上；以及至少一導電孔道，貫穿該絕緣層，並電性連接該第一立體線路結構與該第二立體線路結構。
  15. 如申請專利範圍第14項所述之多層立體線路的結構，其中該立體絕緣結構為一射出成型結構或一噴墨快速成型結構。
  16. 如申請專利範圍第14項所述之多層立體線路的結構，其中該絕緣層為一射出成型體、一噴墨快速成型體、一塗佈成型體、二次成型體或插入模塑成型體。
  17. 如申請專利範圍第16項所述之多層立體線路的結構，其中該絕緣層為射出成型體，而該多層立體線路結構更包括： 一黏著層，配置於該絕緣層與該立體絕緣結構之間。
  18. 如申請專利範圍第17項所述之多層立體線路的結構，其中該立體絕緣結構與該絕緣層的材質為一塑性材料，該塑性材料包括工程塑膠、陶瓷或玻璃。
  19. 如申請專利範圍第17項所述之多層立體線路的結構，其中該工程塑膠的材質是選自於由聚碳酸酯樹脂、丙烯-丁二烯-苯乙烯共聚合物、聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、液晶高分子、聚醯胺、尼龍、共聚聚甲醛、聚苯硫醚及環狀烯烴共聚高分子所組成的群組。
  20. 如申請專利範圍第19項所述之多層立體線路的結構，其中該些觸媒顆粒是選自於由金屬氧化物顆粒金屬氮化物顆粒及金屬錯合物顆粒所組成的群組。
  21. 如申請專利範圍第19項所述之多層立體線路的結構，其中該觸媒顆粒的材質是選自於由錳、鉻、鈀、銅、鋁以及鉑所組成的群組。
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