KR940009176B1 - 다층회로부재 및 그 제조방법 - Google Patents

다층회로부재 및 그 제조방법 Download PDF

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KR940009176B1
KR940009176B1 KR1019910012011A KR910012011A KR940009176B1 KR 940009176 B1 KR940009176 B1 KR 940009176B1 KR 1019910012011 A KR1019910012011 A KR 1019910012011A KR 910012011 A KR910012011 A KR 910012011A KR 940009176 B1 KR940009176 B1 KR 940009176B1
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multilayer circuit
circuit
film
molding
multilayer
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KR1019910012011A
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KR920003826A (ko
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무네카즈 니시하라
테쯔오 후쿠시마
켕이찌로 스에쯔구
쥰지 이케다
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마쯔시다덴기산교 가부시기가이샤
다니이 아끼오
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
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    • H05K1/02—Details
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    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
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    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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    • H05K2203/06—Lamination
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    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
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    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
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    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음.

Description

다층회로부재 및 그 제조방법
제1도는 본 발명의 일실시예에 있어서의 다층회로부재의 사시도.
제2도∼제4도는 본 발명의 일실시예에 있어서의 다층회로부재의 제조방법을 표시하는 것.
제2도는 필름형상부재의 회로패턴을 묘화하는 상태의 사시도.
제3도는 회로패턴이 형성된 필름형상부재를 성형용틀에 얹어놓은 상태의 사시도.
제4도는 다층회로본체가 성형부재내에 일체로 성형된 다층회로부재의 사시도.
* 도면의 주요부분에 대한 부호의 설명
1 : 다층회로본체 2 : 성형부재
3 : 관통구멍 4 : 회로패턴
6 : 필름형상부재 7 : 틀
본 발명은 회로패턴이 형성된 다층회로부재 및 그 제조방법에 관한 것이다.
최근, 가정용 전기제품에 있어서 장치의 소형경량화의 필요성 증대에 따라서, 회로제작분야에 있어서도 회로의 소형고밀도화가 요구되고, 더욱이 회로의 다층화 및 패턴의 미세화가 진행되고 있다.
또, 상품수요의 다양화에 의해 회로패턴도 융통성 있게 설계제조할 수 있는 시스템으로 발전하여 가고 있다.
종래의 다층회로부재는, 프린트기판을 적층구조로 해서 3차원적인 회로구성으로 하므로서, 소형화를 실현하고 있다. 즉, 다층의 프린트기판을 1매씩 에칭하거나 또는 스크리인 인쇄등에 의해 회로패턴이 형성된 기판을 프레스에 의해 평면형상으로 적층한 후, 층사이를 구멍가공하고 도금하므로서 3차원적인 회로를 구성하고 있다.
그러나 상기와 같은 구성으로는, 다층화된 프린트기판의 형상이 평면형상이기 때문에, 소형의 상품유니트에 조립해 넣을 때, 아무래도 공간적으로 제약이 있다고 하는 문제가 있었다.
본 발명은 상기의 문제점에 비추어서, 임의형상의 성형품에 일체성형된 다층회로부재 및 그 제조방법을 제공하는 것을 목적으로 한다.
상기 과제를 해결하기 위하여 본 발명의 다층회로부재는, 회로패턴이 형성된 필름형상부재를 적층배선한 다층회로본체를, 임의형상의 성형품에 일체적으로 성형한 것을 특징으로 한다. 또한, 상기 구성에 있어서, 회로패턴은 도전성 재료의 묘화(描畵)에 의해 형성할 수 있다.
또, 본 발명의 다층회로부재의 제조방법은 회로패턴이 형성된 필름형상부재를 순차적으로 적층한 후, 각 필름형상부재의 관통구멍에 도전성 재료를 관통시켜서 적층배선한 다층회로본체를, 소망하는 성형품의 틀에 삽입하고 성형재료를 충전해서 다층회로부재를 일체적으로 성형하는 것을 특징으로 한다.
상기 구성에 의하면, 회로패턴이 형성된 필름형상부재를 사용하므로서 임의형상의 틀에 삽입하는 것이 가능하게 되고, 소망의 성형품에 일체적으로 성형된 구성의 회로형성이 가능하게 된다.
또, 회로패턴을 형성한 필름형상부재를 성형용의 틀에 삽입하여 소망성형품의 성형재료를 충전하여 성형하고, 필름형상부재를 순차, 적층성형한 후 관통구멍으로 관통시킨 도전성 재료에 의해 적층배선을 행하는 것으로 다층화하므로서, 융통성 있는 회로를 임의형상의 성형품내에 다층화할 수 있으므로, 상품수용의 소형다양화에 대응한 다층회로부재를 제공할 수 있다. 또, 회로패턴을 도전성 재료의 묘화에 의해서 형성하는 것은, 다층회로부재의 다품종 소량생산화에 유리하다.
이하, 본 발명의 실시예를 도면에 의거해서 설명한다.
제1도는 본 실시예에 있어서의 다층회로부재의 사시도이다. 제1도에 있어서, (1)은 회로패턴이 형성된 복수매의 필름형상부재를 적층배선하여 이루어진 다층회로본체이며, 성형부재(2)내에 일체적으로 성형되어 있다. 다층회로본체(1)의 외부회로와의 접속부는, 성형부재(2)의 끝면으로부터 외부로 뻗어나와 있다.
(3)은 다층회로본체(1)를 관통하여 성형부재(2)의 표면에 이르는 관통구멍이며, 다층회로본체(1)의 층사이의 접속을 가능하게 하는 동시에, 성형부재(2)의 표면에 있어서의 전자부품의 실장(實裝)을 가능하게 하고 있다. 이와같이 해서 얻은 다층회로부재의 표면에 상기 관통구멍(3)의 개소에 있어서의 전자부품을 실장하는 것도 가능하다. 필름형상부재로는 성형부재(2)의 재료의 수축이나 가열에 의한 변형에 견딜 수 있는 폴리이미드계의 필름등을 사용하였다. 또 성형부재(2)의 재료로서는, 열가소 및 열경화성의 수지이외에도 세라믹의 미소성재료(味燒性材料)등을 사용할 수 있다.
다음에, 상기 다층회로부재의 제조방법에 대해서 제2도 내지 제4도에 도시한다.
제2도에 있어서, (6)은 필름형상부재, (5)는 묘화용 노즐, (5)는 도전패턴이다. 도전성 재료로서는, 페이스트형상의 도전성 재료가 사용된다. 도전성 재료이외에도 광도파로 재료나 여러가지의 기능재료를 사용해도 된다. 또, 묘화이외의 방법으로서, 스퍼터(sputter) 또는 증착에 의한 박막패턴형성이나 종래의 에칭에 의한 패턴형성도 가능하다.
이와같이 해서 다층회로본체(1)의 다층을 제작한 후, 제3도와 같이 성형용의 틀에 필름형상부재(6)를 세트한다. 제3도에 있어서, (7)은 성형용 틀의 한쪽, (8)은 성형재료의 공급구(供給口)이다. 성형방법으로서는, 사출성형, 압축성형, 트랜스퍼성형(transfer molding), 블로우성형(blow molding : “중공성형”이라고도 함), 주형등을 사용할 수 있다. 필름형상부재(6)를 틀에 의해서 순차적으로 적층성형한 후, 관통구멍(3)을 형성하고, 이 관통구멍(3)에 페이스트형상의 도전성 재료를 충전해서 관통시켜 적층사이를 배선하므로서 임의형상의 다층회로부재를 얻을 수 있다. 제4도에 도시한 바와같이 다층회로부재의 표면, 즉 성형부재(2)의 표면에 전자부품(9)을 실장하는 것도 가능하고, 또한 각 필름형상부재(6)에 전자부품을 미리 실장해서 상기 전자부품을 성형부재(2)내에 매설하는 것도 가능하다.
이상과 같이, 각 층의 회로패턴을 묘화에 의해 작성하므로서, 상품수요의 다양화에 대응한 융통성 있는 다층회로부재의 효율적인 제조가 가능하게 된다. 그리고, 상기와 같은 제조방법에 의해 얻게된 다층회로부재는, 임의형상의 성형품 내부에 다층회로를 형성하므로서 상품의 외장케이스부재를 겸한 다층회로를 실현할 수 있는 등, 소형의 상품유니트제조에 있어서 새로운 소형경량화의 실현이 가능하게 된다.
이상과 같이 본 발명은, 회로패턴을 형성한 필름형상부재를 사용하므로서 임의형상의 틀에 삽입하는 것이 가능하고, 소망의 성형품에 일체적으로 형성된 다층회로형성이 가능하게 된다.
이 결과, 융통성 있는 회로를 임의형상의 성형품내에 다층회로화하는 것이 가능하게 되고, 상품수요의 소형다양화에 대응할 수 있다.

Claims (3)

  1. 회로패턴이 형성된 필름형상부재를 적층배선한 다층회로본체를, 임의형상의 성형품에 일체적을 성형해서 이루어진 것을 특징으로 하는 다층회로부재.
  2. 제1항에 있어서, 상기 회로패턴은 도전성 재료를 묘화해서 형성하여 이루어진 것을 특징으로 하는 다층회로부재.
  3. 회로패턴이 형성된 필름형상부재를 순차적으로 적층한 후, 각 필름형상부재의 관통구멍에 도전성 재료를 관통시켜서 적층배선한 다층회로본체를, 소망성형품의 틀에 삽입하고, 성형재료를 충전하여 다층회로부재를 일체로 성형하는 것을 특징으로 하는 다층회로부재의 제조방법.
KR1019910012011A 1990-07-17 1991-07-15 다층회로부재 및 그 제조방법 KR940009176B1 (ko)

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