JP2011142248A - 基板のクリーニング方法及び基板のクリーニング装置 - Google Patents
基板のクリーニング方法及び基板のクリーニング装置 Download PDFInfo
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- 238000004140 cleaning Methods 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000007789 gas Substances 0.000 claims abstract description 79
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 55
- 239000011737 fluorine Substances 0.000 claims abstract description 55
- 239000006227 byproduct Substances 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 238000001020 plasma etching Methods 0.000 claims abstract description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 239000000470 constituent Substances 0.000 claims abstract description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 52
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 2
- 238000012545 processing Methods 0.000 description 60
- 239000004065 semiconductor Substances 0.000 description 45
- 238000012546 transfer Methods 0.000 description 29
- 239000010410 layer Substances 0.000 description 22
- 230000007246 mechanism Effects 0.000 description 21
- 230000008569 process Effects 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
- H01L21/02049—Dry cleaning only with gaseous HF
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
- H01L21/0234—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
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- Cleaning Or Drying Semiconductors (AREA)
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Abstract
【解決手段】基板上のパターンをプラズマエッチングにより形成した後に、基板の表面をクリーニングする基板のクリーニング方法であって、基板をHFガス雰囲気に晒して副生成物を除去する副生成物除去工程と、水素ガスと、炭素と水素を構成元素として含む化合物のガスとを含むクリーニングガスをプラズマ化して基板に作用させ、当該基板に残留したフッ素を除去する残留フッ素除去工程とを具備している。
【選択図】図3
Description
副生成物除去工程における処理条件は、
圧力=1330Pa(10Torr)、
HFガス=2800sccm、
ステージ温度=30℃、
処理時間=60秒
である。また、残留フッ素除去工程における処理条件は、
圧力=133Pa(1Torr)、
クリーニングガス=4体積%H2/Ar=1700sccm+CH4(5sccm)、
高周波電力=200W(27MHz)、
ステージ温度=80℃、
処理時間=10分
である。
Claims (9)
- 基板上のパターンをプラズマエッチングにより形成した後に、前記基板の表面をクリーニングする基板のクリーニング方法であって、
前記基板をHFガス雰囲気に晒して副生成物を除去する副生成物除去工程と、
水素ガスと、炭素と水素を構成元素として含む化合物のガスとを含むクリーニングガスをプラズマ化して前記基板に作用させ、当該基板に残留したフッ素を除去する残留フッ素除去工程と
を具備したことを特徴とする基板のクリーニング方法。 - 前記炭素と水素を構成元素として含む化合物のガスが、CH4ガス又はCH3OHガスであることを特徴とする請求項1記載のクリーニング方法。
- 前記クリーニングガスが、さらに希ガスを含むことを特徴とする請求項1又は2記載のクリーニング方法。
- 前記希ガスがArガスであることを特徴とする請求項3記載のクリーニング方法。
- 前記クリーニングガスが、前記水素ガスを4体積%以下含むことを特徴とする請求項1〜4いずれか1項記載のクリーニング方法。
- 前記基板上のパターンは、シリコン層の露出部を含むパターンであることを特徴とする請求項1〜5いずれか1項記載のクリーニング方法。
- 前記残留フッ素除去工程で、前記シリコン層の露出部の表面にSiCからなる層を形成することを特徴とする請求項6記載のクリーニング方法。
- 基板上のパターンをプラズマエッチングにより形成した後に、前記基板の表面をクリーニングする基板のクリーニング装置であって、
前記基板をHFガス雰囲気に晒して副生成物を除去する副生成物除去手段と、
水素ガスと、炭素と水素を構成元素として含む化合物のガスとを含むクリーニングガスをプラズマ化して前記基板に作用させ、当該基板に残留したフッ素を除去する残留フッ素除去手段と
を具備したことを特徴とする基板のクリーニング装置。 - 前記基板上のパターンは、シリコン層の露出部を含むパターンであることを特徴とする請求項8記載の基板のクリーニング装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010002720A JP5492574B2 (ja) | 2010-01-08 | 2010-01-08 | 基板のクリーニング方法及び基板のクリーニング装置 |
KR1020100140228A KR101773806B1 (ko) | 2010-01-08 | 2010-12-31 | 기판의 클리닝 방법 및 기판의 클리닝 장치 |
US12/985,652 US20110168205A1 (en) | 2010-01-08 | 2011-01-06 | Substrate cleaning method and substrate cleaning apparatus |
TW100100563A TWI521591B (zh) | 2010-01-08 | 2011-01-07 | A cleaning method of the substrate and a cleaning device for the substrate |
CN2011100206392A CN102148153B (zh) | 2010-01-08 | 2011-01-07 | 基板清洁方法及基板清洁装置 |
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JP2010002720A JP5492574B2 (ja) | 2010-01-08 | 2010-01-08 | 基板のクリーニング方法及び基板のクリーニング装置 |
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JP2011142248A true JP2011142248A (ja) | 2011-07-21 |
JP5492574B2 JP5492574B2 (ja) | 2014-05-14 |
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JP2010002720A Active JP5492574B2 (ja) | 2010-01-08 | 2010-01-08 | 基板のクリーニング方法及び基板のクリーニング装置 |
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Country | Link |
---|---|
US (1) | US20110168205A1 (ja) |
JP (1) | JP5492574B2 (ja) |
KR (1) | KR101773806B1 (ja) |
CN (1) | CN102148153B (ja) |
TW (1) | TWI521591B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017528910A (ja) * | 2014-08-05 | 2017-09-28 | 東京エレクトロン株式会社 | マイクロエレクトロニクス基板上のドライハードマスク除去のための方法 |
KR20190031101A (ko) * | 2017-09-15 | 2019-03-25 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 처리 방법 |
CN112272861A (zh) * | 2018-06-25 | 2021-01-26 | 玛特森技术公司 | 刻蚀后脱氟工艺 |
JPWO2019175704A1 (ja) * | 2018-03-16 | 2021-04-08 | 株式会社半導体エネルギー研究所 | 電気モジュール、表示パネル、表示装置、入出力装置、情報処理装置、電気モジュールの作製方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201318463D0 (en) * | 2013-08-13 | 2013-12-04 | Medical Res Council | Graphene Modification |
KR102396247B1 (ko) * | 2014-08-12 | 2022-05-09 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 |
WO2016118088A1 (en) * | 2015-01-22 | 2016-07-28 | Chan Chia Sern | Non-thermal soft plasma cleaning |
US9601319B1 (en) * | 2016-01-07 | 2017-03-21 | Lam Research Corporation | Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process |
JP6854611B2 (ja) * | 2016-01-13 | 2021-04-07 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び基板処理システム |
JP6869024B2 (ja) * | 2016-12-20 | 2021-05-12 | 東京エレクトロン株式会社 | パーティクル除去方法及び基板処理方法 |
CN112424925A (zh) * | 2018-08-31 | 2021-02-26 | 玛特森技术公司 | 从氮化钛表面去除氧化物 |
JP7345334B2 (ja) * | 2019-09-18 | 2023-09-15 | 東京エレクトロン株式会社 | エッチング方法及び基板処理システム |
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-
2010
- 2010-01-08 JP JP2010002720A patent/JP5492574B2/ja active Active
- 2010-12-31 KR KR1020100140228A patent/KR101773806B1/ko active IP Right Grant
-
2011
- 2011-01-06 US US12/985,652 patent/US20110168205A1/en not_active Abandoned
- 2011-01-07 TW TW100100563A patent/TWI521591B/zh not_active IP Right Cessation
- 2011-01-07 CN CN2011100206392A patent/CN102148153B/zh not_active Expired - Fee Related
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JP2017528910A (ja) * | 2014-08-05 | 2017-09-28 | 東京エレクトロン株式会社 | マイクロエレクトロニクス基板上のドライハードマスク除去のための方法 |
KR20190031101A (ko) * | 2017-09-15 | 2019-03-25 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 처리 방법 |
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TWI521591B (zh) | 2016-02-11 |
CN102148153B (zh) | 2013-04-17 |
CN102148153A (zh) | 2011-08-10 |
TW201142942A (en) | 2011-12-01 |
KR20110081765A (ko) | 2011-07-14 |
KR101773806B1 (ko) | 2017-09-01 |
US20110168205A1 (en) | 2011-07-14 |
JP5492574B2 (ja) | 2014-05-14 |
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