JP2011082537A5 - - Google Patents
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- Publication number
- JP2011082537A5 JP2011082537A5 JP2010255262A JP2010255262A JP2011082537A5 JP 2011082537 A5 JP2011082537 A5 JP 2011082537A5 JP 2010255262 A JP2010255262 A JP 2010255262A JP 2010255262 A JP2010255262 A JP 2010255262A JP 2011082537 A5 JP2011082537 A5 JP 2011082537A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- chemical mechanical
- mechanical polishing
- water
- polishing abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 7
- 239000007800 oxidant agent Substances 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 4
- 229920003169 water-soluble polymer Polymers 0.000 claims 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 3
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 2
- 239000012964 benzotriazole Substances 0.000 claims 2
- 150000007524 organic acids Chemical class 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- 229920002125 Sokalan® Polymers 0.000 claims 1
- 229910001362 Ta alloys Inorganic materials 0.000 claims 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 1
- 239000001630 malic acid Substances 0.000 claims 1
- 235000011090 malic acid Nutrition 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 229920005575 poly(amic acid) Polymers 0.000 claims 1
- 229920002401 polyacrylamide Polymers 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 239000004584 polyacrylic acid Substances 0.000 claims 1
- -1 polyamidate Polymers 0.000 claims 1
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims 1
- 150000003482 tantalum compounds Chemical class 0.000 claims 1
- 239000011975 tartaric acid Substances 0.000 claims 1
- 235000002906 tartaric acid Nutrition 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010255262A JP5472049B2 (ja) | 1999-08-17 | 2010-11-15 | 化学機械研磨用研磨剤 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1999230930 | 1999-08-17 | ||
| JP23093099 | 1999-08-17 | ||
| JP1999308665 | 1999-10-29 | ||
| JP30866599 | 1999-10-29 | ||
| JP2010255262A JP5472049B2 (ja) | 1999-08-17 | 2010-11-15 | 化学機械研磨用研磨剤 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006034860A Division JP2006191132A (ja) | 1999-08-17 | 2006-02-13 | 化学機械研磨用研磨剤及び基板の研磨法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012099648A Division JP2012182473A (ja) | 1999-08-17 | 2012-04-25 | 化学機械研磨用研磨剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011082537A JP2011082537A (ja) | 2011-04-21 |
| JP2011082537A5 true JP2011082537A5 (enExample) | 2012-06-14 |
| JP5472049B2 JP5472049B2 (ja) | 2014-04-16 |
Family
ID=26529617
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517419A Expired - Lifetime JP3954383B2 (ja) | 1999-08-17 | 2000-08-17 | 化学機械研磨用研磨剤及び基板の研磨法 |
| JP2010255262A Expired - Lifetime JP5472049B2 (ja) | 1999-08-17 | 2010-11-15 | 化学機械研磨用研磨剤 |
| JP2012099648A Withdrawn JP2012182473A (ja) | 1999-08-17 | 2012-04-25 | 化学機械研磨用研磨剤 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001517419A Expired - Lifetime JP3954383B2 (ja) | 1999-08-17 | 2000-08-17 | 化学機械研磨用研磨剤及び基板の研磨法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012099648A Withdrawn JP2012182473A (ja) | 1999-08-17 | 2012-04-25 | 化学機械研磨用研磨剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7744666B2 (enExample) |
| EP (1) | EP1211717B1 (enExample) |
| JP (3) | JP3954383B2 (enExample) |
| KR (1) | KR100510977B1 (enExample) |
| CN (1) | CN101792655B (enExample) |
| AU (1) | AU6594200A (enExample) |
| TW (1) | TW501197B (enExample) |
| WO (1) | WO2001013417A1 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11181403A (ja) | 1997-12-18 | 1999-07-06 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
| US7232529B1 (en) | 1999-08-26 | 2007-06-19 | Hitachi Chemical Company, Ltd. | Polishing compound for chemimechanical polishing and polishing method |
| JP4505891B2 (ja) * | 1999-09-06 | 2010-07-21 | Jsr株式会社 | 半導体装置の製造に用いる化学機械研磨用水系分散体 |
| US6503418B2 (en) * | 1999-11-04 | 2003-01-07 | Advanced Micro Devices, Inc. | Ta barrier slurry containing an organic additive |
| US6605537B2 (en) | 2000-10-27 | 2003-08-12 | Rodel Holdings, Inc. | Polishing of metal substrates |
| JP2004523123A (ja) * | 2001-03-12 | 2004-07-29 | ロデール ホールディングス インコーポレイテッド | Cmp研磨のための方法及び組成物 |
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| JP7727461B2 (ja) * | 2021-09-17 | 2025-08-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、および半導体基板の製造方法 |
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| US6918820B2 (en) * | 2003-04-11 | 2005-07-19 | Eastman Kodak Company | Polishing compositions comprising polymeric cores having inorganic surface particles and method of use |
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2000
- 2000-08-16 TW TW089116550A patent/TW501197B/zh not_active IP Right Cessation
- 2000-08-17 WO PCT/JP2000/005508 patent/WO2001013417A1/ja not_active Ceased
- 2000-08-17 AU AU65942/00A patent/AU6594200A/en not_active Abandoned
- 2000-08-17 JP JP2001517419A patent/JP3954383B2/ja not_active Expired - Lifetime
- 2000-08-17 CN CN200910209364XA patent/CN101792655B/zh not_active Expired - Lifetime
- 2000-08-17 KR KR10-2002-7001957A patent/KR100510977B1/ko not_active Expired - Lifetime
- 2000-08-17 EP EP00953466.0A patent/EP1211717B1/en not_active Expired - Lifetime
-
2005
- 2005-08-11 US US11/201,242 patent/US7744666B2/en not_active Expired - Fee Related
-
2006
- 2006-02-13 US US11/352,326 patent/US7319072B2/en not_active Expired - Lifetime
-
2010
- 2010-11-15 JP JP2010255262A patent/JP5472049B2/ja not_active Expired - Lifetime
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2012
- 2012-04-25 JP JP2012099648A patent/JP2012182473A/ja not_active Withdrawn
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