JP2011082537A5 - - Google Patents

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JP2011082537A5
JP2011082537A5 JP2010255262A JP2010255262A JP2011082537A5 JP 2011082537 A5 JP2011082537 A5 JP 2011082537A5 JP 2010255262 A JP2010255262 A JP 2010255262A JP 2010255262 A JP2010255262 A JP 2010255262A JP 2011082537 A5 JP2011082537 A5 JP 2011082537A5
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acid
chemical mechanical
mechanical polishing
water
polishing abrasive
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JP2011082537A (ja
JP5472049B2 (ja
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本発明の研磨剤は、表面に二酸化シリコンの凹部を有する基板上にバリア層及び銅又は銅合金を含む金属膜を形成・充填した基板を研磨対象とする場合に好適である。このような基板は、例えば、図１に示すようにシリコンウエハ１０（図１（ａ））の表面に二酸化シリコン膜１１を形成し（図１（ｂ））、この表面に所定のパターンのレジスト層１２を形成して（図１（ｃ））、ドライエッチングにより二酸化シリコン膜１１に凹部１３を形成してレジスト層１２を除去し（図１（ｄ））、二酸化シリコン膜１１表面とシリコンウエハ１０の露出箇所とを覆うように、蒸着、ＣＶＤなどによりタンタルなどのバリア金属を成膜してバリア層１４を形成し（図１（ｅ））、その表面に銅などの金属を蒸着、めっき又はＣＶＤにより成膜して配線層１５とすることにより得られる（図１（ｆ））。

Claims (5)

  1. 少なくともタンタル、タンタル合金、タンタル化合物からなる群より選択される一種類以上のバリア層を研磨するための化学機械研磨用研磨剤であって、該化学機械研磨用研磨剤は、
    導体の酸化剤と、
    ベンゾトリアゾール又はその誘導体からなる群から選ばれる少なくとも１種の保護膜形成剤と、
    マロン酸、リンゴ酸、酒石酸、グリコール酸及びクエン酸から選ばれる少なくとも１種の有機酸と、
    水溶性高分子と、
    水とを含み、
    前記水溶性高分子は、導体の酸化剤、有機酸、保護膜形成剤、水溶性高分子及び水の総量１００ｇに対して、０．００１〜０．５重量％含まれてなり、
    ｐＨが３以下であり、
    前記酸化剤の濃度が０．０１〜３重量％である化学機械研磨用研磨剤。
  2. 前記水溶性高分子が、ポリアクリル酸、ポリアクリル酸塩、ポリメタクリル酸、ポリメタクリル酸塩、ポリアミド酸、ポリアミド酸塩、ポリアクリルアミド、ポリビニルアルコール及びポリビニルピロリドンからなる群から選ばれる少なくとも１種である請求項１記載の化学機械研磨用研磨剤。
  3. 前記保護膜形成剤がベンゾトリアゾールを含む請求項１又は２記載の化学機械研磨用研磨剤。
  4. 上記導体の酸化剤の濃度が０．０１〜１．５重量％である請求項１〜３のいずれかに記載の化学機械研磨用研磨剤。
  5. 上記導体の酸化剤が、過酸化水素である請求項１〜４のいずれかに記載の化学機械研磨用研磨剤。
JP2010255262A 1999-08-17 2010-11-15 化学機械研磨用研磨剤 Expired - Lifetime JP5472049B2 (ja)

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JP2010255262A JP5472049B2 (ja) 1999-08-17 2010-11-15 化学機械研磨用研磨剤

Applications Claiming Priority (5)

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JP23093099 1999-08-17
JP1999230930 1999-08-17
JP1999308665 1999-10-29
JP30866599 1999-10-29
JP2010255262A JP5472049B2 (ja) 1999-08-17 2010-11-15 化学機械研磨用研磨剤

Related Parent Applications (1)

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JP2006034860A Division JP2006191132A (ja) 1999-08-17 2006-02-13 化学機械研磨用研磨剤及び基板の研磨法

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JP2012099648A Division JP2012182473A (ja) 1999-08-17 2012-04-25 化学機械研磨用研磨剤

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JP2011082537A JP2011082537A (ja) 2011-04-21
JP2011082537A5 true JP2011082537A5 (ja) 2012-06-14
JP5472049B2 JP5472049B2 (ja) 2014-04-16

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JP2001517419A Expired - Lifetime JP3954383B2 (ja) 1999-08-17 2000-08-17 化学機械研磨用研磨剤及び基板の研磨法
JP2010255262A Expired - Lifetime JP5472049B2 (ja) 1999-08-17 2010-11-15 化学機械研磨用研磨剤
JP2012099648A Withdrawn JP2012182473A (ja) 1999-08-17 2012-04-25 化学機械研磨用研磨剤

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US (2) US7744666B2 (ja)
EP (1) EP1211717B1 (ja)
JP (3) JP3954383B2 (ja)
KR (1) KR100510977B1 (ja)
CN (1) CN101792655B (ja)
AU (1) AU6594200A (ja)
TW (1) TW501197B (ja)
WO (1) WO2001013417A1 (ja)

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