JP2010524208A5 - - Google Patents
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- Publication number
- JP2010524208A5 JP2010524208A5 JP2010501279A JP2010501279A JP2010524208A5 JP 2010524208 A5 JP2010524208 A5 JP 2010524208A5 JP 2010501279 A JP2010501279 A JP 2010501279A JP 2010501279 A JP2010501279 A JP 2010501279A JP 2010524208 A5 JP2010524208 A5 JP 2010524208A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- ether
- optionally
- glycol
- chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US90942807P | 2007-03-31 | 2007-03-31 | |
| US94373607P | 2007-06-13 | 2007-06-13 | |
| PCT/US2008/058878 WO2008121952A1 (en) | 2007-03-31 | 2008-03-31 | Methods for stripping material for wafer reclamation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010524208A JP2010524208A (ja) | 2010-07-15 |
| JP2010524208A5 true JP2010524208A5 (https=) | 2011-05-12 |
Family
ID=39577853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010501279A Pending JP2010524208A (ja) | 2007-03-31 | 2008-03-31 | ウエハ再生のために材料を剥離する方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1975987A3 (https=) |
| JP (1) | JP2010524208A (https=) |
| KR (1) | KR20100015974A (https=) |
| CN (1) | CN101681130A (https=) |
| SG (1) | SG166102A1 (https=) |
| TW (1) | TW200908148A (https=) |
| WO (1) | WO2008121952A1 (https=) |
Families Citing this family (61)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100301010A1 (en) * | 2007-10-08 | 2010-12-02 | Basf Se | ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo |
| JP2012504871A (ja) * | 2008-10-02 | 2012-02-23 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 高度な金属負荷及びシリコン基板の表面パッシベーションのための界面活性剤/消泡剤混合物の使用 |
| US8398779B2 (en) * | 2009-03-02 | 2013-03-19 | Applied Materials, Inc. | Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates |
| TWI480360B (zh) * | 2009-04-03 | 2015-04-11 | 杜邦股份有限公司 | 蝕刻劑組成物及方法 |
| CN101957563B (zh) * | 2009-07-13 | 2014-09-24 | 安集微电子(上海)有限公司 | 一种含氟等离子刻蚀残留物清洗液 |
| DE102010019079A1 (de) * | 2010-04-30 | 2011-11-03 | Gp Solar Gmbh | Additiv für alkalische Ätzlösungen, insbesondere für Texturätzlösungen, sowie Verfahren zu dessen Herstellung |
| CN102337102B (zh) * | 2010-07-21 | 2013-06-05 | 凤凰光学股份有限公司 | 一种化学研磨去除钢铁件毛刺的工艺方法 |
| KR101150857B1 (ko) * | 2010-10-22 | 2012-06-13 | 주식회사 티씨케이 | 세라믹 코팅층의 리페어방법 |
| CN102010797B (zh) * | 2010-12-23 | 2011-12-28 | 西安隆基硅材料股份有限公司 | 硅料清洗剂及硅料清洗的方法 |
| CN102533124A (zh) * | 2010-12-31 | 2012-07-04 | 上海硅酸盐研究所中试基地 | 碳化硅衬底用抛光液 |
| CN102115915B (zh) * | 2010-12-31 | 2012-08-22 | 百力达太阳能股份有限公司 | 一种单晶硅制绒添加剂以及单晶硅制绒工艺 |
| DE102011000322A1 (de) | 2011-01-25 | 2012-07-26 | saperatec GmbH | Trennmedium, Verfahren und Anlage zum Trennen von Mehrschichtsystemen |
| JP2012238849A (ja) * | 2011-04-21 | 2012-12-06 | Rohm & Haas Electronic Materials Llc | 改良された多結晶テクスチャ化組成物および方法 |
| US20130053291A1 (en) * | 2011-08-22 | 2013-02-28 | Atsushi Otake | Composition for cleaning substrates post-chemical mechanical polishing |
| SG11201400840UA (en) | 2011-10-05 | 2014-04-28 | Avantor Performance Mat Inc | Microelectronic substrate cleaning compositions having copper/azole polymer inhibition |
| JP2013102089A (ja) * | 2011-11-09 | 2013-05-23 | Adeka Corp | チタン酸鉛系材料用エッチング剤組成物 |
| KR101349975B1 (ko) * | 2011-11-17 | 2014-01-15 | 주식회사 이엔에프테크놀로지 | 몰리브덴 합금막 및 인듐 산화막 식각액 조성물 |
| KR102058485B1 (ko) * | 2012-03-13 | 2019-12-23 | 가부시키가이샤 아데카 | 에칭액 조성물 및 에칭방법 |
| WO2013137192A1 (ja) * | 2012-03-16 | 2013-09-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN103076725A (zh) * | 2013-01-31 | 2013-05-01 | 北京七星华创电子股份有限公司 | 一种去除光刻胶的溶液及其应用 |
| KR102091543B1 (ko) * | 2013-08-01 | 2020-03-23 | 동우 화인켐 주식회사 | 망상형 고분자 용해용 조성물 |
| US9633831B2 (en) * | 2013-08-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same |
| KR102352475B1 (ko) * | 2013-12-20 | 2022-01-18 | 엔테그리스, 아이엔씨. | 이온-주입된 레지스트의 제거를 위한 비-산화성 강산의 용도 |
| US11127587B2 (en) * | 2014-02-05 | 2021-09-21 | Entegris, Inc. | Non-amine post-CMP compositions and method of use |
| CN103839885B (zh) * | 2014-03-17 | 2016-09-07 | 上海华虹宏力半导体制造有限公司 | 去除缺陷的方法 |
| CN103972052B (zh) * | 2014-05-21 | 2018-05-04 | 上海华力微电子有限公司 | 应用晶边扫描预防线状分布缺陷发生的方法 |
| US11978622B2 (en) * | 2014-06-30 | 2024-05-07 | Entegris, Inc. | Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility |
| CN104120040B (zh) * | 2014-08-08 | 2017-08-01 | 常州时创能源科技有限公司 | 多晶硅链式制绒设备的清洗液添加剂及其应用 |
| WO2016076034A1 (ja) * | 2014-11-13 | 2016-05-19 | 三菱瓦斯化学株式会社 | 半導体素子を洗浄するためのアルカリ土類金属を含む洗浄液、およびそれを用いた半導体素子の洗浄方法 |
| TWI585841B (zh) | 2015-02-06 | 2017-06-01 | 國立台灣科技大學 | 基板及其加工方法與裝置 |
| CN104993014B (zh) * | 2015-05-27 | 2017-02-01 | 东方日升新能源股份有限公司 | 扩散后不良片的单独返工方法 |
| JP6619956B2 (ja) * | 2015-06-17 | 2019-12-11 | 日本放送協会 | 固体撮像素子の製造方法 |
| CN105045051B (zh) * | 2015-08-24 | 2016-06-01 | 北京中科紫鑫科技有限责任公司 | 光刻胶的去除方法 |
| US10538846B2 (en) * | 2015-12-11 | 2020-01-21 | Dongwoo Fine-Chem Co., Ltd. | Etching solution composition for tungsten layer, method for preparing electronic device using the same and electronic device |
| KR102487249B1 (ko) * | 2015-12-11 | 2023-01-13 | 동우 화인켐 주식회사 | 텅스텐막 식각액 조성물 |
| TWI717346B (zh) * | 2016-04-13 | 2021-02-01 | 大陸商盛美半導體設備(上海)股份有限公司 | 阻擋層的去除方法和半導體結構的形成方法 |
| CN107924836B (zh) * | 2016-05-26 | 2021-09-21 | 南京中云新材料有限公司 | 一种单晶硅片表面织构化的方法 |
| GB2557682A (en) * | 2016-12-15 | 2018-06-27 | saperatec GmbH | Method and apparatus for recycling packaging material |
| US20180371292A1 (en) * | 2017-06-21 | 2018-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Buffered cmp polishing solution |
| CN107357143B (zh) * | 2017-07-25 | 2018-06-19 | 上海新阳半导体材料股份有限公司 | 一种清洗剂、其制备方法和应用 |
| US10879076B2 (en) * | 2017-08-25 | 2020-12-29 | Versum Materials Us, Llc | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device |
| CN109988509B (zh) * | 2017-12-29 | 2021-07-09 | 浙江新创纳电子科技有限公司 | 一种钽酸锂还原片抛光液及其制备方法和用途 |
| US11365379B2 (en) | 2018-01-25 | 2022-06-21 | Merck Patent Gmbh | Photoresist remover compositions |
| US20190233777A1 (en) * | 2018-01-30 | 2019-08-01 | Dow Global Technologies Llc | Microemulsion removers for advanced photolithography |
| CN111742392B (zh) * | 2018-03-02 | 2024-12-17 | 三菱瓦斯化学株式会社 | 抑制了氧化铝的损伤的组合物及使用了其的半导体基板的制造方法 |
| US11499236B2 (en) * | 2018-03-16 | 2022-11-15 | Versum Materials Us, Llc | Etching solution for tungsten word line recess |
| CN109116689A (zh) * | 2018-09-19 | 2019-01-01 | 珠海特普力高精细化工有限公司 | 一种环保型有机干膜剥离液 |
| CN115651656B (zh) * | 2018-12-03 | 2024-09-03 | 富士胶片电子材料美国有限公司 | 蚀刻组合物 |
| CN109777393B (zh) * | 2019-03-19 | 2020-04-14 | 中国石油化工股份有限公司 | 一种泡沫驱油剂 |
| CN110702490A (zh) * | 2019-11-01 | 2020-01-17 | 上海申和热磁电子有限公司 | 一种半导体切片废液中碳化硅的提纯分析方法 |
| KR102192954B1 (ko) * | 2020-03-26 | 2020-12-18 | 동우 화인켐 주식회사 | 고분자 세정용 조성물 |
| TWI824299B (zh) | 2020-09-22 | 2023-12-01 | 美商恩特葛瑞斯股份有限公司 | 蝕刻劑組合物 |
| CN112326631B (zh) * | 2020-10-12 | 2023-11-07 | 宁波江丰电子材料股份有限公司 | 一种溶解钨钛合金样品的方法 |
| KR20220083186A (ko) | 2020-12-11 | 2022-06-20 | 동우 화인켐 주식회사 | 고분자 처리용 공정액 |
| CN112680288A (zh) * | 2020-12-24 | 2021-04-20 | 昆山晶科微电子材料有限公司 | 一种用于清洁半导体芯片洗涤剂及其制备方法 |
| KR102925424B1 (ko) | 2021-03-16 | 2026-02-11 | 동우 화인켐 주식회사 | 고분자 처리용 공정액 조성물 |
| KR20240011174A (ko) * | 2021-05-21 | 2024-01-25 | 버슘머트리얼즈 유에스, 엘엘씨 | 반도체 디바이스의 제조 동안 규소-게르마늄/규소 스택으로부터 규소-게르마늄 합금을 선택적으로 제거하기 위한 에칭 용액 |
| US20230025444A1 (en) * | 2021-07-22 | 2023-01-26 | Lawrence Livermore National Security, Llc | Systems and methods for silicon microstructures fabricated via greyscale drie with soi release |
| CN113862480A (zh) * | 2021-09-29 | 2021-12-31 | 天津绿展环保科技有限公司 | 一种用于paste罐的工业提取剂、处理方法及处理系统 |
| CN118295222B (zh) * | 2024-05-06 | 2025-08-12 | 惠州达诚微电子材料有限公司 | 一种光刻胶用剥离液及其制备方法 |
| CN118581455B (zh) * | 2024-05-31 | 2025-01-24 | 四川江化微电子材料有限公司 | 一种银蚀刻液及其制备方法和应用 |
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| JPH07122532A (ja) * | 1993-10-26 | 1995-05-12 | Mitsubishi Materials Corp | 再生ウェーハの製造方法 |
| ATE402410T1 (de) | 1996-03-19 | 2008-08-15 | Daikin Ind Ltd | Verfahren zur erfassung von komponentenkonzentrationen einer dreikomponentenmischung und prozess zur kontinuierlichen herstellung von fluorwasserstoff unter nutzung des verfahrens |
| JPH11150329A (ja) * | 1997-11-14 | 1999-06-02 | Sony Corp | 半導体素子の製造方法 |
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| JP2000133558A (ja) * | 1998-10-22 | 2000-05-12 | Canon Inc | 半導体基体の作製方法およびそれにより作製された基体 |
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| JP4085262B2 (ja) * | 2003-01-09 | 2008-05-14 | 三菱瓦斯化学株式会社 | レジスト剥離剤 |
| JP4159929B2 (ja) * | 2003-05-28 | 2008-10-01 | 花王株式会社 | レジスト用剥離剤組成物 |
| US7119052B2 (en) * | 2003-06-24 | 2006-10-10 | Advanced Technology Materials, Inc. | Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers |
| ATE520661T1 (de) | 2003-06-27 | 2011-09-15 | Univ Maryland | Heterocyclische verbindungen mit quaternärem stickstoff zum nachweis von wässrigen monosacchariden in physiologischen flüssigkeiten |
| CA2544198C (en) * | 2003-10-29 | 2011-07-26 | Mallinckrodt Baker, Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| PT1789527E (pt) * | 2004-08-03 | 2010-01-15 | Mallinckrodt Baker Inc | Composições de limpeza para substratos microelectrónicos |
| US7819981B2 (en) | 2004-10-26 | 2010-10-26 | Advanced Technology Materials, Inc. | Methods for cleaning ion implanter components |
| CN101233601A (zh) * | 2005-06-13 | 2008-07-30 | 高级技术材料公司 | 在金属硅化物形成后用于选择性除去金属或金属合金的组合物及方法 |
| TW200918664A (en) * | 2007-06-13 | 2009-05-01 | Advanced Tech Materials | Wafer reclamation compositions and methods |
-
2008
- 2008-03-31 WO PCT/US2008/058878 patent/WO2008121952A1/en not_active Ceased
- 2008-03-31 CN CN200880016177A patent/CN101681130A/zh active Pending
- 2008-03-31 EP EP08103209A patent/EP1975987A3/en not_active Withdrawn
- 2008-03-31 TW TW097111743A patent/TW200908148A/zh unknown
- 2008-03-31 SG SG201007080-3A patent/SG166102A1/en unknown
- 2008-03-31 KR KR1020097022496A patent/KR20100015974A/ko not_active Withdrawn
- 2008-03-31 JP JP2010501279A patent/JP2010524208A/ja active Pending
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