JP2010521065A5 - - Google Patents
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- JP2010521065A5 JP2010521065A5 JP2009552709A JP2009552709A JP2010521065A5 JP 2010521065 A5 JP2010521065 A5 JP 2010521065A5 JP 2009552709 A JP2009552709 A JP 2009552709A JP 2009552709 A JP2009552709 A JP 2009552709A JP 2010521065 A5 JP2010521065 A5 JP 2010521065A5
- Authority
- JP
- Japan
- Prior art keywords
- nitride
- layer
- intermediate layer
- semiconductor structure
- semiconductor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims 110
- 150000004767 nitrides Chemical class 0.000 claims 93
- 239000004065 semiconductor Substances 0.000 claims 75
- 239000000463 material Substances 0.000 claims 43
- 238000000034 method Methods 0.000 claims 36
- 239000011229 interlayer Substances 0.000 claims 20
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 12
- 229910052733 gallium Inorganic materials 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 5
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- 239000002019 doping agent Substances 0.000 claims 4
- 238000010276 construction Methods 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/716,317 | 2007-03-09 | ||
| US11/716,317 US7825432B2 (en) | 2007-03-09 | 2007-03-09 | Nitride semiconductor structures with interlayer structures |
| PCT/US2008/002848 WO2008112097A2 (en) | 2007-03-09 | 2008-03-04 | Nitride semiconductor structures with interlayer structures and methods of fabricating nitride semiconductor structures with interlayer structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010521065A JP2010521065A (ja) | 2010-06-17 |
| JP2010521065A5 true JP2010521065A5 (enExample) | 2012-07-12 |
| JP5520056B2 JP5520056B2 (ja) | 2014-06-11 |
Family
ID=39539542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009552709A Active JP5520056B2 (ja) | 2007-03-09 | 2008-03-04 | 中間層構造を有する窒化物半導体構造、及び中間層構造を有する窒化物半導体構造を製造する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7825432B2 (enExample) |
| EP (1) | EP2064730B1 (enExample) |
| JP (1) | JP5520056B2 (enExample) |
| CN (1) | CN101627458B (enExample) |
| WO (1) | WO2008112097A2 (enExample) |
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| DE102008056411A1 (de) * | 2008-11-07 | 2010-05-20 | Dürr Systems GmbH | Beschichtungsanlagenbauteil, insbesondere Glockenteller, und entsprechendes Herstellungsverfahren |
| DE112010001557T5 (de) * | 2009-04-08 | 2012-09-13 | Efficient Power Conversion Corporation | Dotierungsdiffusionsverfahren an GaN-Pufferschichten |
| WO2011022730A1 (en) * | 2009-08-21 | 2011-02-24 | The Regents Of The University Of California | Anisotropic strain control in semipolar nitride quantum wells by partially or fully relaxed aluminum indium gallium nitride layers with misfit dislocations |
| DE102009047881B4 (de) | 2009-09-30 | 2022-03-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer epitaktisch hergestellten Schichtstruktur |
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| JP5781292B2 (ja) | 2010-11-16 | 2015-09-16 | ローム株式会社 | 窒化物半導体素子および窒化物半導体パッケージ |
| CN102468142B (zh) * | 2010-11-18 | 2015-06-24 | 比亚迪股份有限公司 | 一种外延片的形成方法及外延片 |
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| DE102011114665B4 (de) * | 2011-09-30 | 2023-09-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Nitrid-Verbindungshalbleiter-Bauelements |
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| JP5117609B1 (ja) | 2011-10-11 | 2013-01-16 | 株式会社東芝 | 窒化物半導体ウェーハ、窒化物半導体装置及び窒化物半導体結晶の成長方法 |
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| JP5950643B2 (ja) * | 2012-03-19 | 2016-07-13 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| JP5705179B2 (ja) * | 2012-08-15 | 2015-04-22 | 株式会社東芝 | 窒化物半導体ウェーハ、窒化物半導体装置及び窒化物半導体結晶の成長方法 |
| CN102856163B (zh) * | 2012-09-04 | 2015-09-09 | 苏州晶湛半导体有限公司 | 半导体外延结构及其生长方法 |
| CN102851734B (zh) * | 2012-09-06 | 2015-11-25 | 苏州晶湛半导体有限公司 | 半导体外延结构及其生长方法 |
| JP5425284B1 (ja) | 2012-09-21 | 2014-02-26 | 株式会社東芝 | 半導体ウェーハ、半導体素子及び窒化物半導体層の製造方法 |
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| JP6302254B2 (ja) * | 2014-01-15 | 2018-03-28 | 株式会社東芝 | 窒化物半導体素子、窒化物半導体ウェーハ、及び、窒化物半導体素子の製造方法 |
| JP6185398B2 (ja) * | 2014-01-31 | 2017-08-23 | 東京エレクトロン株式会社 | 窒化ガリウム系結晶の成長方法及び熱処理装置 |
| US10266397B2 (en) * | 2014-08-13 | 2019-04-23 | University Of South Carolina | III-V nitride resonate structure based photoacoustic sensor |
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| WO2017069087A1 (ja) * | 2015-10-21 | 2017-04-27 | エア・ウォーター株式会社 | SiC層を備えた化合物半導体基板 |
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| JP6781095B2 (ja) | 2017-03-31 | 2020-11-04 | エア・ウォーター株式会社 | 化合物半導体基板 |
| JP7158272B2 (ja) | 2018-12-25 | 2022-10-21 | エア・ウォーター株式会社 | 化合物半導体基板 |
| CN109830580B (zh) * | 2019-01-29 | 2021-10-08 | 华灿光电(浙江)有限公司 | 氮化镓基发光二极管外延片及其制造方法 |
| US11688825B2 (en) * | 2019-01-31 | 2023-06-27 | Industrial Technology Research Institute | Composite substrate and light-emitting diode |
| CN111834496B (zh) * | 2020-05-27 | 2021-08-06 | 华灿光电(浙江)有限公司 | 发光二极管外延片及其制备方法 |
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-
2007
- 2007-03-09 US US11/716,317 patent/US7825432B2/en active Active
-
2008
- 2008-03-04 EP EP08742018.8A patent/EP2064730B1/en active Active
- 2008-03-04 JP JP2009552709A patent/JP5520056B2/ja active Active
- 2008-03-04 CN CN2008800076018A patent/CN101627458B/zh active Active
- 2008-03-04 WO PCT/US2008/002848 patent/WO2008112097A2/en not_active Ceased
-
2010
- 2010-10-19 US US12/907,556 patent/US8324005B2/en active Active
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