JP2010505265A - フォトレジスト剥離および金属エッチング後パッシベーション用の高チャンバ温度プロセスおよびチャンバ設計 - Google Patents
フォトレジスト剥離および金属エッチング後パッシベーション用の高チャンバ温度プロセスおよびチャンバ設計 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/16—Vessels; Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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Abstract
Description
Claims (23)
- 真空チャンバに取付け可能であり、プロセスガスを半導体基板に供給するためのガス分配部材であって、
内部チャンバボディであって、その外面と前記真空チャンバの内面との間に間隙がある状態で、前記真空チャンバ上に摺動可能に支持されるように構成された当該内部チャンバボディと、
前記内部チャンバボディの上部分の中を延びる複数のガス通路であって、プロセスガスを前記半導体基板に向かって前記真空チャンバ内に誘導するように適合された当該複数のガス通路と、
前記基板を覆っていて、前記基板により近い位置でより広くなる空間内に前記プロセスガスを閉じ込めるように適合されたドーム形の内面と、
を備えることを特徴とするガス分配部材。 - 前記複数のガス通路の少なくとも一部は、その軸が前記基板の露出面と交差するように角度付けされることを特徴とする請求項1に記載のガス分配部材。
- 前記内部チャンバボディによって支持され、前記内部チャンバボディを要求温度に加熱するように動作可能な1つまたは複数のヒータをさらに備えることを特徴とする請求項2に記載のガス分配部材。
- 前記内部チャンバボディの温度を監視するための1つまたは複数の温度センサをさらに含むことを特徴とする請求項1に記載のガス分配部材。
- 前記内部チャンバボディが金属体であり、前記金属体が、前記真空チャンバのチャンバ天部と金属接触および真空密閉を形成する突出部を含むことを特徴とする請求項1に記載のガス分配部材。
- 前記ボディが、メインボディと、前記複数のガス通路が配置された上部板とを備え、前記メインボディがその上壁に開いた開口を含み、前記上壁が前記開口を取り囲む真空密閉面を含み、前記上部板が、前記複数のガス通路を取り囲む真空密閉面と、前記上部板の前記真空密閉面と前記メインボディの前記真空密閉面との間に真空密閉を形成するように、それらの間に嵌められたOリングとを含むことを特徴とする、請求項1に記載のガス分配部材。
- 上部真空密閉面と下部真空密閉面とを備え、前記上部真空密閉面が前記複数のガス通路を取り囲み、前記真空チャンバの上壁の下面と真空密閉を形成するように適合され、前記下部真空面が前記ガス分配部材の外側側壁を取り囲み、前記真空チャンバの側壁の上部分の上面と真空密閉を形成するように適合されることを特徴とする請求項1に記載のガス分配部材。
- 上壁と、側壁と、底壁とを備え、前記上壁がその外周に向かって増加する厚さを有し、前記側壁がその上部でより大きい厚さを有し、前記底壁が、前記真空チャンバの底部にある基板支持体がそこに嵌まることができるように前記ガス分配部材が前記真空チャンバ内に下ろされるのを可能にするようにサイズが設定された中央開口をその中に有することを特徴とする請求項1に記載のガス分配部材。
- 前記複数のガス通路が、第1のゾーンに配置された入口、および前記第1のゾーンよりも面積が広い第2のゾーンに配置された出口を有し、前記第2のゾーンが、前記真空チャンバ内で処理すべき基板の露出面の面積の50%以下の面積にわたって広がり、前記ガス出口が、内側ガス出口がプロセスガスを前記基板の中央領域に向かって誘導し、外側ガス出口がプロセスガスを前記基板の外側領域に向かって誘導するように方向付けされていることを特徴とする請求項1に記載のガス分配部材。
- 請求項1に記載の部材を備える真空チャンバであって、
前記内部チャンバボディをその上に摺動可能に取り付けるように適合され、前記内部チャンバの側面をそれとの間に間隙をもって取り囲むように構成された外部チャンバボディと、
前記真空チャンバから前記ガスをポンピングするように動作する排気ユニットと、
前記内部チャンバボディの上面それとの間に間隙をもって覆うように、前記内部チャンバボディに対して摺動可能に取り付けられ、前記複数のガス通路と流体連通する開口を有するチャンバ天部と、
プロセスガスを励起するように動作し、前記チャンバ天部に開いた前記開口と流体連通することができるように前記開口に結合されるプラズマ源と、
を備えることを特徴とする真空チャンバ。 - 前記外部チャンバボディが、前記外部チャンバボディから熱を除去するために、冷却流体の流れをその中に通すための少なくとも1つの流路を含むことを特徴とする請求項10に記載の真空チャンバ。
- 前記流路を通る前記冷却流体の流量を制御するためのフィードバック制御システムをさらに備えることを特徴とする、請求項11に記載の真空チャンバ。
- 1つまたは複数の温度センサに結合され、前記内部チャンバボディの温度の自動調整を行う温度調整システムをさらに含むことを特徴とする請求項10に記載の真空チャンバ。
- 前記温度調整システムが前記内部チャンバボディの温度を、20〜50℃、50〜100℃、100〜150℃、150〜200℃、200〜250℃、250〜300℃、または300〜350℃の範囲内に維持することを特徴とする請求項13に記載の真空チャンバ。
- 前記内部チャンバボディが前記外部チャンバボディ上に、複数の溝穴およびピンによって位置決めされ、前記溝穴がそれぞれ、前記内部チャンバボディの径方向に沿って延び、前記内部チャンバボディ内に形成され、かつ、それに沿って対応するピンが摺動するのを可能にするように構成され、前記ピンが前記外部チャンバボディに固定されることを特徴とする請求項10に記載の真空チャンバ。
- 前記内部チャンバボディが前記外部チャンバボディ上に、複数の溝穴およびピンによって位置決めされ、前記溝穴がそれぞれ、前記内部チャンバボディの径方向に沿って延び、前記外部チャンバボディ内に形成され、かち、それに沿って対応するピンが摺動するのを可能にするように構成され、前記ピンが前記内部チャンバボディに固定されることを特徴とする請求項10に記載の真空チャンバ。
- 前記チャンバ天部が、前記チャンバ天部から熱エネルギーを除去するために、冷却流体の流れをその中に通すための少なくとも1つの流路を含むことを特徴とする請求項10に記載の真空チャンバ。
- 前記流路の中に冷却流体を循環させる温度制御流体循環と協働するように動作可能なフィードバック制御システムをさらに備えることを特徴とする請求項17に記載の真空チャンバ。
- 半導体基板を処理する方法であって、
請求項10に記載の真空チャンバ内に半導体基板を支持すること、
前記プラズマ源の使用によりプラズマを発生させること、および
前記半導体基板を前記プラズマで処理すること
を含むことを特徴とする方法。 - 前記半導体基板がウェーハであり、前記処理することが、前記ウェーハ上のフォトレジスト層を剥離するステップを含むことを特徴とする請求項19に記載の方法。
- 前記半導体基板がウェーハであり、前記処理することが、金属エッチング後パッシベーションを含むことを特徴とする請求項19に記載の方法。
- 請求項14に記載のチャンバ内で半導体基板を処理する方法であって、前記半導体基板の暴露面をプラズマ処理することの間に、前記温度調整システムが前記内部チャンバボディの温度を、20〜50℃、50〜100℃、100〜150℃、150〜200℃、200〜250℃、250〜300℃、または300〜350℃の範囲内に維持することを特徴とする方法。
- 前記半導体基板がウェーハであり、前記プラズマ処理することが、前記ウェーハからフォトレジスト層を剥離することを含むことを特徴とする、請求項22に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/528,275 US7476291B2 (en) | 2006-09-28 | 2006-09-28 | High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation |
US11/528,275 | 2006-09-28 | ||
PCT/US2007/019886 WO2008042091A1 (en) | 2006-09-28 | 2007-09-13 | High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation |
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JP2010505265A true JP2010505265A (ja) | 2010-02-18 |
JP4995915B2 JP4995915B2 (ja) | 2012-08-08 |
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JP2009530359A Active JP4995915B2 (ja) | 2006-09-28 | 2007-09-13 | フォトレジスト剥離および金属エッチング後パッシベーション用の高チャンバ温度プロセスおよびチャンバ設計 |
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US (1) | US7476291B2 (ja) |
JP (1) | JP4995915B2 (ja) |
KR (1) | KR101411674B1 (ja) |
CN (1) | CN101523592B (ja) |
TW (1) | TWI428713B (ja) |
WO (1) | WO2008042091A1 (ja) |
Cited By (7)
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JP2017117978A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
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JP2020530201A (ja) * | 2017-08-07 | 2020-10-15 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | プラズマエッチングプロセスでのコーティング部品を使用するプロセスウィンドウの拡大 |
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JP7028956B2 (ja) | 2017-08-07 | 2022-03-02 | アプライド マテリアルズ インコーポレイテッド | プラズマエッチングプロセスでのコーティング部品を使用するプロセスウィンドウの拡大 |
WO2024004849A1 (ja) * | 2022-06-29 | 2024-01-04 | エドワーズ株式会社 | 真空ポンプ |
JP7493556B2 (ja) | 2022-06-29 | 2024-05-31 | エドワーズ株式会社 | 真空ポンプ |
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WO2008042091A1 (en) | 2008-04-10 |
KR20090080510A (ko) | 2009-07-24 |
KR101411674B1 (ko) | 2014-06-25 |
CN101523592A (zh) | 2009-09-02 |
CN101523592B (zh) | 2011-07-13 |
TWI428713B (zh) | 2014-03-01 |
US7476291B2 (en) | 2009-01-13 |
TW200823610A (en) | 2008-06-01 |
JP4995915B2 (ja) | 2012-08-08 |
US20080078744A1 (en) | 2008-04-03 |
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