JP5728482B2 - 誘導結合プラズマリアクタ内での高効率ガス解離のための方法及び装置 - Google Patents
誘導結合プラズマリアクタ内での高効率ガス解離のための方法及び装置 Download PDFInfo
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Description
本発明の実施形態は、概して、エッチング/蒸着(堆積)プロセスなどの基板処理システム及び関連する基板処理に関する。より具体的には、本発明の実施形態は、改良されたプラズマ解離効率を備えたプロセスチャンバに処理ガスを供給するための方法及び装置に関する。
マイクロ電子デバイスの製造は、多くの異なるステージを含み、その各々は多様なプロセスを含む。1つのステージの間、ある特定のプロセスは、基板の物理特性及び材料特性を変えるために、シリコン基板などの基板の表面にプラズマを付与する工程を含む場合がある。このプロセスは、穴、ビア、及び/又はその他の開口(以下、「トレンチ」と称する)を基板内に形成するために物質の除去を含むことができるエッチングとして知られているかもしれない。
チャンバエクステンション及びバッフルノズルアセンブリ301は、図2A〜2Bのチャンバエクステンション及びバッフルノズルアセンブリ201と同じチャンバエクステンション210及びガスバッフルノズル220を含む。チャンバエクステンション及びバッフルノズルアセンブリ301は、複数の部品を含むプラズマバッフル330を含む。プラズマバッフル330は、ステム332の周りにクランプを形成する2以上のブロッカープレート331を含む。バッフルプレート333は、ステム332の末端に形成されている。バッフルプレート333は、蓋43内の開口44よりも大きい。貫通穴334は、チャンバエクステンション210からのガス流用にブロッカープレート331を貫通して形成されている。迂回チャンネル336a、336bは、ブロッカープレート331及びステム332内に夫々形成されている。迂回チャンネル336bは、ステム332及びバッフルプレート333内に形成された中央チャンネル335に開放する。
Claims (15)
- 内側容積を画定する外側本体であって、前記外側本体は、前記内側容積に開放する第1入口チャンネルを有し、前記外側本体は出口を有する外側本体と、
前記内側容積内に配置され、前記内側容積を第1容積及び第2容積に分割する入口バッフルであって、前記第1入口チャンネルは、前記第1容積の第1端部近くに開放し、1以上の開口が前記第1容積の第2端部近くに配置され、前記1以上の開口は前記第1容積及び第2容積に接続される入口バッフルと、
前記外側本体の前記出口の上方に配置される出口バッフルであって、前記出口バッフルは前記内側容積の前記第2容積に開放する1以上の第1貫通穴を有し、前記出口バッフルは前記第1貫通穴から流れ出るガス流の方向を変える出口バッフルを含むバッフルノズルアセンブリ。 - 前記出口バッフルは、前記外側本体の前記出口の上方に配置されたブロッカープレートであって、前記1以上の第1貫通穴が前記ブロッカープレート内に形成されているブロッカープレートと、
前記外側本体の反対側で前記ブロッカープレートから延在するステムと、
前記ステムの末端上に、前記ブロッカープレートと実質的に平行にあるバッフルプレートを含む請求項1記載のバッフルノズルアセンブリ。 - 前記外側本体は、前記内側容積に開放する第2入口チャンネルを有し、前記入口バッフルは前記内側容積を第3容積に更に分割し、前記第2入口チャンネルは前記第3容積に開放する請求項2記載のバッフルノズルアセンブリ。
- 前記出口バッフルは、前記ステム内に前記バッフルプレートを貫通して形成された中央ガスチャンネルを有し、1以上の迂回チャンネルが前記中央ガスチャンネルを前記第3容積に接続する請求項3記載のバッフルノズルアセンブリ。
- 前記中央ガスチャンネルは、前記出口バッフル内の貫通穴であり、前記第2容積と流体連結している請求項4記載のバッフルノズルアセンブリ。
- 前記外側本体は、前記内側容積を画定する側壁及び上部を含み、前記出口は前記上部と対向する開口であり、前記入口バッフルは、前記外側本体の前記側壁と実質的に平行な側壁を含み、前記入口バッフルの前記側壁は、前記内側容積を前記第1容積及び前記第2容積に分割し、前記第1容積は前記外側本体の側壁及び前記入口バッフルの側壁によって画定され、前記第2容積は前記入口バッフルの前記側壁及び前記外側本体の前記上部によって画定される請求項1記載のバッフルノズルアセンブリ。
- 前記入口バッフルの前記側壁は、上側に形成された複数のスロットを有し、前記複数のスロット及び前記外側本体の前記上部は、前記第1容積及び第2容積に接続する前記1以上の開口を形成する請求項6記載のバッフルノズルアセンブリ。
- 前記内側容積は実質的に円筒形であり、前記入口バッフルは外側に螺旋状の溝を形成した円筒状の側壁であり、前記螺旋状の溝は前記第1容積内に渦流れを可能にする請求項6記載のバッフルノズルアセンブリ。
- 処理容積を画定するチャンバ本体であって、
側壁と、
前記処理容積へ処理ガスを導入するように適合された中央開口を有する蓋を含むチャンバ本体と、
前記蓋の上方で前記チャンバ本体の外側に配置されたソレノイドコイルアンテナであって、前記ソレノイドコイルアンテナは内側アンテナ容積を形成し、前記中央開口と同心であるソレノイドコイルアンテナと、
前記蓋の中央開口に結合され、前記内側アンテナ容積内に部分的に配置された請求項1〜8のいずれか1項記載のバッフルノズルアセンブリを含む基板処理システム。 - 前記ソレノイドアンテナは、螺旋状に巻かれた1以上の導体を含み、前記内側アンテナ容積は実質的に円筒形である請求項9記載の基板処理システム。
- 請求項9又は10のいずれか1項記載の処理システムの処理容積内に基板を位置決めする工程と、
前記外側本体を通して第1処理ガスを前記処理容積に流す工程と同時に、
プラズマ電源を前記ソレノイドコイルアンテナに印加し、これによって前記外側本体の前記内側容積と前記処理容積の両方の中で前記第1処理ガスのプラズマを生成する工程を含む基板を処理する方法。 - 前記内側容積を通して前記第1処理ガスを前記処理容積に流す工程は、
前記内側容積内に配置された入口バッフルを通して前記第1処理ガスを流す工程と、
前記処理容積内の前記蓋の前記中央開口の下に配置された出口バッフルを用いて前記内側容積から流れ出る前記第1処理ガスの向きを変える工程を含む請求項11記載の方法。 - 前記内側容積を通して前記第1処理ガスを前記処理容積に流しながら、前記内側容積を通過することなく、迂回チャンネルを通して前記第1処理ガスを前記処理容積に流す工程を更に含む請求項12記載の方法。
- プラズマ電源を前記ソレノイドコイルアンテナに印加し、これによって前記内側容積と前記処理容積の両方の中で前記第1処理ガスのプラズマを生成する工程は、前記ソレノイドコイルアンテナのサイズを増大させることによって、又は前記プラズマ電源の電力レベルを増加させることによって、前記第1処理ガスの解離速度を減少させる工程を含む請求項11記載の方法。
- プラズマ電源を前記ソレノイドコイルアンテナに印加し、これによって前記内側容積と前記処理容積の両方の中で前記第1処理ガスのプラズマを生成する工程は、前記ソレノイドコイルアンテナのサイズを増大させることによって、前記処理容積内のプラズマ均一性を向上させる工程を含む請求項11記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US24586909P | 2009-09-25 | 2009-09-25 | |
US61/245,869 | 2009-09-25 | ||
PCT/US2010/048269 WO2011037757A2 (en) | 2009-09-25 | 2010-09-09 | Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor |
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CN102763198A (zh) | 2012-10-31 |
WO2011037757A3 (en) | 2011-06-23 |
US20110073564A1 (en) | 2011-03-31 |
KR101450015B1 (ko) | 2014-10-13 |
US20140256148A1 (en) | 2014-09-11 |
US8753474B2 (en) | 2014-06-17 |
US9070633B2 (en) | 2015-06-30 |
CN102763198B (zh) | 2015-05-06 |
JP2013506292A (ja) | 2013-02-21 |
TW201511122A (zh) | 2015-03-16 |
KR20120073292A (ko) | 2012-07-04 |
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