JP2010093109A - 半導体装置、半導体装置の製造方法および半導体モジュールの製造方法 - Google Patents

半導体装置、半導体装置の製造方法および半導体モジュールの製造方法 Download PDF

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Publication number
JP2010093109A
JP2010093109A JP2008262682A JP2008262682A JP2010093109A JP 2010093109 A JP2010093109 A JP 2010093109A JP 2008262682 A JP2008262682 A JP 2008262682A JP 2008262682 A JP2008262682 A JP 2008262682A JP 2010093109 A JP2010093109 A JP 2010093109A
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Prior art keywords
group
solder
wiring board
solder ball
land
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JP2008262682A
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Japanese (ja)
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JP2010093109A5 (enExample
Inventor
Yoshinari Hayashi
義成 林
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Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2008262682A priority Critical patent/JP2010093109A/ja
Priority to US12/549,718 priority patent/US8076787B2/en
Priority to CN200910178994.5A priority patent/CN101719486B/zh
Publication of JP2010093109A publication Critical patent/JP2010093109A/ja
Priority to US13/289,593 priority patent/US8405231B2/en
Publication of JP2010093109A5 publication Critical patent/JP2010093109A5/ja
Pending legal-status Critical Current

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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
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    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
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    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
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