JP2009529799A5 - - Google Patents
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- JP2009529799A5 JP2009529799A5 JP2008558741A JP2008558741A JP2009529799A5 JP 2009529799 A5 JP2009529799 A5 JP 2009529799A5 JP 2008558741 A JP2008558741 A JP 2008558741A JP 2008558741 A JP2008558741 A JP 2008558741A JP 2009529799 A5 JP2009529799 A5 JP 2009529799A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor material
- different
- element group
- processing step
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 6
- 229910052719 titanium Inorganic materials 0.000 claims 4
- 229910052726 zirconium Inorganic materials 0.000 claims 4
- 229910052732 germanium Inorganic materials 0.000 claims 3
- 229910052735 hafnium Inorganic materials 0.000 claims 3
- 229910052738 indium Inorganic materials 0.000 claims 3
- 229910052758 niobium Inorganic materials 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 2
- 238000003181 co-melting Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 229910052692 Dysprosium Inorganic materials 0.000 claims 1
- 229910052691 Erbium Inorganic materials 0.000 claims 1
- 229910052693 Europium Inorganic materials 0.000 claims 1
- 229910052688 Gadolinium Inorganic materials 0.000 claims 1
- 229910052689 Holmium Inorganic materials 0.000 claims 1
- 229910052765 Lutetium Inorganic materials 0.000 claims 1
- 229910052779 Neodymium Inorganic materials 0.000 claims 1
- 229910052777 Praseodymium Inorganic materials 0.000 claims 1
- 229910052772 Samarium Inorganic materials 0.000 claims 1
- 229910052771 Terbium Inorganic materials 0.000 claims 1
- 229910052775 Thulium Inorganic materials 0.000 claims 1
- 229910052769 Ytterbium Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052785 arsenic Inorganic materials 0.000 claims 1
- 229910052790 beryllium Inorganic materials 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- 229910052792 caesium Inorganic materials 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 229910052729 chemical element Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052740 iodine Inorganic materials 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052746 lanthanum Inorganic materials 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- 229910052702 rhenium Inorganic materials 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 229910052701 rubidium Inorganic materials 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 229910052706 scandium Inorganic materials 0.000 claims 1
- 229910052711 selenium Inorganic materials 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06111281.9 | 2006-03-16 | ||
| EP06111281 | 2006-03-16 | ||
| PCT/EP2007/050851 WO2007104601A2 (de) | 2006-03-16 | 2007-01-29 | Dotierte bleitelluride fuer thermoelektrische anwendungen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009529799A JP2009529799A (ja) | 2009-08-20 |
| JP2009529799A5 true JP2009529799A5 (enExample) | 2010-02-18 |
| JP5042245B2 JP5042245B2 (ja) | 2012-10-03 |
Family
ID=38229098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008558741A Expired - Fee Related JP5042245B2 (ja) | 2006-03-16 | 2007-01-29 | 熱電用途用のドープ処理テルル化鉛 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8716589B2 (enExample) |
| EP (1) | EP1999066A2 (enExample) |
| JP (1) | JP5042245B2 (enExample) |
| KR (1) | KR101364895B1 (enExample) |
| CN (1) | CN101421185B (enExample) |
| CA (1) | CA2646191A1 (enExample) |
| RU (1) | RU2413042C2 (enExample) |
| TW (1) | TW200737556A (enExample) |
| UA (1) | UA92213C2 (enExample) |
| WO (1) | WO2007104601A2 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200933940A (en) | 2007-12-28 | 2009-08-01 | Basf Se | Extrusion process for preparing improved thermoelectric materials |
| CN101965313A (zh) * | 2008-02-07 | 2011-02-02 | 巴斯夫欧洲公司 | 用于热电应用的掺杂的碲化锡 |
| KR101063938B1 (ko) * | 2008-11-13 | 2011-09-14 | 한국전기연구원 | 중저온용 열전재료 |
| SG174453A1 (en) * | 2009-03-24 | 2011-10-28 | Basf Se | Self-organising thermoelectric materials |
| SG174559A1 (en) | 2009-04-02 | 2011-10-28 | Basf Se | Thermoelectric module with insulated substrate |
| TW201042789A (en) | 2009-04-02 | 2010-12-01 | Basf Se | Thermoelectric material coated with a protective layer |
| JP2010245492A (ja) * | 2009-04-02 | 2010-10-28 | 繁 佐藤 | 熱発電素子構成手段と熱発電素子 |
| CA2768978A1 (en) | 2009-07-27 | 2011-02-03 | Basf Se | Method for producing thermoelectric semiconductor materials and branches |
| CN101656291B (zh) * | 2009-09-21 | 2011-02-09 | 吉林大学 | 功能梯度热电材料n-PbTe及其制备方法 |
| CN102403446A (zh) * | 2011-11-08 | 2012-04-04 | 西华大学 | 一种在PbTe或PbSe中添加元素铝的热电材料 |
| KR20130126035A (ko) * | 2012-05-10 | 2013-11-20 | 삼성전자주식회사 | 왜곡된 전자 상태 밀도를 갖는 열전소재, 이를 포함하는 열전모듈과 열전 장치 |
| CN102808215A (zh) * | 2012-06-28 | 2012-12-05 | 北京工业大学 | 大尺寸多元稀土硼化物(Ce0.9Pr0.1)B6单晶体制备方法 |
| KR101528589B1 (ko) * | 2013-06-10 | 2015-06-16 | 연세대학교 산학협력단 | 열전 재료 제조 방법, 열전 재료 및 열전 발전기 |
| US9444025B2 (en) | 2013-06-10 | 2016-09-13 | Industry-Academic Cooperation Foundation, Yonsei University | Method of manufacturing thermoelectric material and thermoelectric material prepared by the method and thermoelectric generator |
| CN103397239A (zh) * | 2013-08-08 | 2013-11-20 | 常熟市东方特种金属材料厂 | 高纯度的金属 |
| EP2958156B1 (en) * | 2013-10-04 | 2018-04-04 | LG Chem, Ltd. | Novel compound semiconductor and use thereof |
| KR101531011B1 (ko) * | 2013-11-27 | 2015-06-25 | 한국전기연구원 | Ｎａ이 첨가된 Ａｇ 도핑 ＰｂＴｅ계 열전재료 및 그 제조방법 |
| CN103762301A (zh) * | 2014-01-26 | 2014-04-30 | 海安县申菱电器制造有限公司 | 一种内电极为缠绕在绝缘管上的金属线的热电转换器件 |
| CN106575697B (zh) | 2014-08-12 | 2019-06-25 | 密歇根州立大学董事会 | 热电设备及其加工和使用方法 |
| CN105047808A (zh) * | 2015-09-11 | 2015-11-11 | 广东雷子克热电工程技术有限公司 | 一种BiSbTeSe基热电材料 |
| CN108886081B (zh) | 2016-03-31 | 2022-05-13 | 住友化学株式会社 | 化合物及热电转换材料 |
| EP3439052B8 (en) * | 2016-03-31 | 2021-03-17 | Sumitomo Chemical Company, Limited | Compound, thermoelectric conversion material, and method for producing compound |
| CN105755348A (zh) * | 2016-04-20 | 2016-07-13 | 苏州市相城区明达复合材料厂 | 一种铸造用光亮镀层合金 |
| KR101816212B1 (ko) * | 2016-09-12 | 2018-01-08 | 두산중공업 주식회사 | 연소물의 특성 요소의 영향도 분석 장치 |
| CN106435329A (zh) * | 2016-09-30 | 2017-02-22 | 无锡市明盛强力风机有限公司 | 一种金属合金导热材料及其制备方法 |
| JPWO2018123899A1 (ja) | 2016-12-26 | 2019-10-31 | 国立大学法人名古屋大学 | 熱電変換材料および熱電変換素子 |
| KR102573731B1 (ko) * | 2018-08-24 | 2023-08-31 | 주식회사 엘지화학 | 칼코겐 화합물, 이의 제조 방법, 및 이를 포함하는 열전소자 |
| TWI683910B (zh) * | 2018-10-18 | 2020-02-01 | 國立中山大學 | 熱電合金及其製作方法與熱電合金複合物 |
| CN110299444A (zh) * | 2019-05-30 | 2019-10-01 | 同济大学 | 一种EuCd2Sb2基热电材料及其制备方法 |
| CN110218888B (zh) * | 2019-06-20 | 2021-05-04 | 电子科技大学 | 一种新型Zintl相热电材料及其制备方法 |
| CN110528081A (zh) * | 2019-10-08 | 2019-12-03 | 西北工业大学 | 一种LiXSe2多晶化合物与单晶体的合成方法 |
| CN111799360B (zh) * | 2020-07-03 | 2022-08-05 | 中国科学院合肥物质科学研究院 | 一种n型PbTe基热电材料及其制备方法 |
| CN112645710B (zh) * | 2020-12-11 | 2022-08-02 | 哈尔滨石油学院 | 一种用Er和Ag共掺提高碲化铋基赝三元热电材料热电性能的方法 |
| CN112885948B (zh) * | 2021-01-14 | 2022-07-29 | 电子科技大学 | 一种具有高结构稳定性的铜硒基热电材料及其制备方法 |
| CN112968120A (zh) * | 2021-03-04 | 2021-06-15 | 杭州安誉科技有限公司 | 一种半导体制冷片及其在实时荧光定量pcr仪中的应用 |
| CN114561687B (zh) * | 2022-02-28 | 2023-11-17 | 福建师范大学 | 一种S掺杂MnBi2Te4单晶的制备方法 |
| JP2023130192A (ja) * | 2022-03-07 | 2023-09-20 | 国立研究開発法人産業技術総合研究所 | 熱電変換材料、熱電変換材料を用いた熱電発電モジュール及びペルチェ冷却モジュール |
| CN114524417B (zh) * | 2022-03-07 | 2023-07-28 | 先导薄膜材料（广东）有限公司 | 一种高收率碲化铅的制备方法 |
| CN114790569B (zh) * | 2022-04-22 | 2023-07-07 | 福建师范大学 | 一种制备Se掺杂二维钒基单晶超导材料的方法 |
| CN115650181B (zh) * | 2022-10-20 | 2023-11-17 | 中国科学院合肥物质科学研究院 | 一种n型PbTe基热电材料及其制备方法 |
| CN117964367A (zh) * | 2024-02-01 | 2024-05-03 | 福州大学 | 一种新型银铋硫矿结构热电材料及其制备方法 |
| CN118274987B (zh) * | 2024-04-09 | 2024-10-22 | 重庆材料研究院有限公司 | 传感器偶丝的材料及采用该材料制备的一体化多点式温度传感器 |
| CN118851763B (zh) * | 2024-07-12 | 2025-07-15 | 西华大学 | 一种p型CaMg2Sb2基热电材料及其制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3652421A (en) * | 1968-08-01 | 1972-03-28 | Gen Electric | N-type lead telluride |
| US4447277A (en) * | 1982-01-22 | 1984-05-08 | Energy Conversion Devices, Inc. | Multiphase thermoelectric alloys and method of making same |
| SU1829809A1 (ru) * | 1991-04-22 | 1996-02-10 | Институт Металлургии Им.А.А.Байкова | Термоэлектрический материал для положительной ветви термоэлемента |
| JP3170311B2 (ja) * | 1991-07-29 | 2001-05-28 | キヤノン株式会社 | 記録ヘッドおよび記録装置 |
| JPH0685333A (ja) * | 1992-09-03 | 1994-03-25 | Idemitsu Petrochem Co Ltd | 熱電変換材料の製造法 |
| US6069312A (en) * | 1994-01-28 | 2000-05-30 | California Institute Of Technology | Thermoelectric materials with filled skutterudite structure for thermoelectric devices |
| US5448109B1 (en) | 1994-03-08 | 1997-10-07 | Tellurex Corp | Thermoelectric module |
| JPH11152503A (ja) * | 1997-11-19 | 1999-06-08 | Kubota Corp | Ｐｂ−Ｔｅ系化合物粉末の製造方法 |
| KR20000028741A (ko) * | 1998-10-12 | 2000-05-25 | 안자키 사토루 | 열전반도체 재료 또는 소자의 제조방법 및 열전모듈의제조방법 |
| EP1083610A4 (en) * | 1999-03-10 | 2007-02-21 | Neomax Co Ltd | THERMOELECTRIC CONVERSION MATERIAL AND MANUFACTURING METHOD THEREFOR |
| US6225550B1 (en) | 1999-09-09 | 2001-05-01 | Symyx Technologies, Inc. | Thermoelectric material system |
| DE19955788A1 (de) | 1999-11-19 | 2001-05-23 | Basf Ag | Thermoelektrisch aktive Materialien und diese enthaltende Generatoren |
| JP2003243734A (ja) * | 2002-02-14 | 2003-08-29 | Mitsui Mining & Smelting Co Ltd | 熱電変換材料およびその製造方法 |
| US7326851B2 (en) * | 2003-04-11 | 2008-02-05 | Basf Aktiengesellschaft | Pb-Ge-Te-compounds for thermoelectric generators or Peltier arrangements |
| CN100452466C (zh) * | 2003-09-12 | 2009-01-14 | 密歇根州州立大学托管委员会 | 热电材料及其制备方法、热电元件以及从热能生成电流的方法 |
| US20050150537A1 (en) * | 2004-01-13 | 2005-07-14 | Nanocoolers Inc. | Thermoelectric devices |
| JP2005294478A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 熱電変換材料 |
| DE102004025066A1 (de) * | 2004-05-18 | 2005-12-08 | Basf Ag | Telluride mit neuen Eigenschaftskombinationen |
| WO2006085929A2 (en) * | 2004-06-14 | 2006-08-17 | Delphi Technologies, Inc. | Thermoelectric materials comprising nanoscale inclusions to enhance seebeck coefficient |
| US7586033B2 (en) * | 2005-05-03 | 2009-09-08 | Massachusetts Institute Of Technology | Metal-doped semiconductor nanoparticles and methods of synthesis thereof |
| CN101965313A (zh) | 2008-02-07 | 2011-02-02 | 巴斯夫欧洲公司 | 用于热电应用的掺杂的碲化锡 |
-
2007
- 2007-01-29 US US12/293,170 patent/US8716589B2/en not_active Expired - Fee Related
- 2007-01-29 JP JP2008558741A patent/JP5042245B2/ja not_active Expired - Fee Related
- 2007-01-29 UA UAA200812232A patent/UA92213C2/ru unknown
- 2007-01-29 KR KR1020087025340A patent/KR101364895B1/ko not_active Expired - Fee Related
- 2007-01-29 WO PCT/EP2007/050851 patent/WO2007104601A2/de not_active Ceased
- 2007-01-29 CN CN200780013506.4A patent/CN101421185B/zh not_active Expired - Fee Related
- 2007-01-29 RU RU2008140844/05A patent/RU2413042C2/ru not_active IP Right Cessation
- 2007-01-29 CA CA002646191A patent/CA2646191A1/en not_active Abandoned
- 2007-01-29 EP EP07704205A patent/EP1999066A2/de not_active Withdrawn
- 2007-02-15 TW TW096105762A patent/TW200737556A/zh unknown
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