JP6110421B2 - フォノン散乱材、ナノコンポジット熱電材料及びその製造方法 - Google Patents
フォノン散乱材、ナノコンポジット熱電材料及びその製造方法 Download PDFInfo
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- JP6110421B2 JP6110421B2 JP2015047727A JP2015047727A JP6110421B2 JP 6110421 B2 JP6110421 B2 JP 6110421B2 JP 2015047727 A JP2015047727 A JP 2015047727A JP 2015047727 A JP2015047727 A JP 2015047727A JP 6110421 B2 JP6110421 B2 JP 6110421B2
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- 239000000463 material Substances 0.000 title claims description 149
- 239000002114 nanocomposite Substances 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 78
- 150000001875 compounds Chemical class 0.000 claims description 37
- 239000003638 chemical reducing agent Substances 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 6
- 238000010335 hydrothermal treatment Methods 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 230000032683 aging Effects 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 125000005641 methacryl group Chemical group 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000012266 salt solution Substances 0.000 claims description 2
- 125000005504 styryl group Chemical group 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 125000000101 thioether group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 35
- 239000002105 nanoparticle Substances 0.000 description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 19
- 239000000243 solution Substances 0.000 description 17
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 229910004298 SiO 2 Inorganic materials 0.000 description 15
- 239000000470 constituent Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- 239000002002 slurry Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052797 bismuth Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 229910052714 tellurium Inorganic materials 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052711 selenium Inorganic materials 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 229910018989 CoSb Inorganic materials 0.000 description 3
- 229910002665 PbTe Inorganic materials 0.000 description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000012279 sodium borohydride Substances 0.000 description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 description 3
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910002908 (Bi,Sb)2(Te,Se)3 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910019001 CoSi Inorganic materials 0.000 description 1
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- 229910019021 Mg 2 Sn Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- MOOAHMCRPCTRLV-UHFFFAOYSA-N boron sodium Chemical compound [B].[Na] MOOAHMCRPCTRLV-UHFFFAOYSA-N 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- VIEXQFHKRAHTQS-UHFFFAOYSA-N chloroselanyl selenohypochlorite Chemical compound Cl[Se][Se]Cl VIEXQFHKRAHTQS-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Silicon Polymers (AREA)
Description
ZT=α2σT/κ(=Pf・T/κ)
ここで、αは熱電変換材料のゼーベック係数、σは熱電変換材料の導電率、κは熱電変換材料の熱伝導率である。α2σの項をまとめて出力因子Pfという。そして、Zは温度の逆数の次元を有し、この性能指数Zに絶対温度Tを乗じて得られるZTは無次元の値となる。そしてこのZTを無次元性能指数と呼び、熱電変換材料の性能を表す指標として用いられている。
で表される化合物が提供される。
1/1000<(前記G1の数/n)≦1
とする。
BiCl3+NaBH4+H2O→Bi+NaCl+H3BO3+H2
下記の手順および条件により、(Bi、Sb)2Te3熱電変換材料母材にフォノン散乱粒子が結合したナノコンポジット熱電変換材料を製造した。
フォノン散乱粒子として下式
BiCl3(0.24g)、TeCl4(1.51g)、及びSbCl3(0.68g)を2−プロパノール100mL中に溶解し、熱電材料原料溶液(第1溶液)を調製した。一方、TEOS(0.14g)を2−プロパノール100mLに溶解して第2溶液を調製した。また、還元剤として水素化ホウ素ナトリウムNaBH4(1.59g)を2−プロパノール100mLに溶解した溶液(還元剤溶液)を調製した。
BiCl3(0.24g)、TeCl4(1.51g)、及びSbCl3(0.68g)をエタノール100mL中に溶解し、市販品SiO2(粒径5nm)を5vol%、13vol%及び20vol%となるように加え、得られたスラリーに、還元剤として水素化ホウ素ナトリウムNaBH4(1.59g)をエタノール100mLに溶解した溶液を滴下し、Bi、Te、Seのナノ粒子とSiO2のナノ粒子の混合物を得た。この混合物を密閉のオートクレーブに入れ、240℃、48時間の水熱処理を行い、合金化させた。次いで窒素ガスフロー雰囲気中で乾燥させ、BiSbTe系合金ナノ粒子とSiO2ナノ粒子との複合ナノ粒子の粉末が回収された。最後に、この粉末を360℃においてSPS焼結を行い、SiO2ナノ粒子が分散したナノコンポジット熱電変換材料のバルク体を作製した。
SiO2(粒径5nm)に代え、SiO2(粒径15nm)を10vol%及び20vol%となるように加えることを除き、比較例2と同様にしてSiO2ナノ粒子が分散したナノコンポジット熱電変換材料のバルク体を作製した。
Claims (6)
- 熱電変換材料母材中にフォノン散乱材として混合される化合物であって、下式
で表される化合物。 - 前記G1が、メルカプト基、カルボキシル基、アミノ基、ビニル基、エポキシ基、スチリル基、メタクリル基、アクリル基、イソシアヌレート基、ウレイド基、スルフィド基、イソシアネート基及びこれらの混合物からなる群より選ばれる、請求項1記載の化合物。
- 0.3〜5nmのサイズを有する、請求項1記載の化合物。
- 熱電変換材料母材と請求項1記載の化合物をフォノン散乱材として含むナノコンポジット熱電材料であって、前記化合物が熱電変換材料母材と前記官能基G1を介して結合していることを特徴とするナノコンポジット熱電材料。
- 前記化合物の体積分率が0.1〜20vol%である、請求項4記載のナノコンポジット熱電材料。
- 熱電変換材料の原料物質の塩の溶液に、還元剤と請求項1記載の化合物を混合し、この混合物を撹拌・熟成させ、次いでこの混合物に対して水熱処理を行うことを含む、ナノコンポジット熱電材料の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015047727A JP6110421B2 (ja) | 2014-03-28 | 2015-03-10 | フォノン散乱材、ナノコンポジット熱電材料及びその製造方法 |
US14/668,428 US9728700B2 (en) | 2014-03-28 | 2015-03-25 | Phonon scattering material, nanocomposite thermoelectric material, and method of producing the same |
DE102015104618.0A DE102015104618B4 (de) | 2014-03-28 | 2015-03-26 | Nanokomposit-thermoelektrisches Material und Verfahren zur Herstellung desselben |
CN201510140982.9A CN104953020B (zh) | 2014-03-28 | 2015-03-27 | 声子散射材料、纳米复合热电材料及其制造方法 |
Applications Claiming Priority (3)
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JP2014068975 | 2014-03-28 | ||
JP2014068975 | 2014-03-28 | ||
JP2015047727A JP6110421B2 (ja) | 2014-03-28 | 2015-03-10 | フォノン散乱材、ナノコンポジット熱電材料及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015195359A JP2015195359A (ja) | 2015-11-05 |
JP6110421B2 true JP6110421B2 (ja) | 2017-04-05 |
Family
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JP2015047727A Expired - Fee Related JP6110421B2 (ja) | 2014-03-28 | 2015-03-10 | フォノン散乱材、ナノコンポジット熱電材料及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9728700B2 (ja) |
JP (1) | JP6110421B2 (ja) |
CN (1) | CN104953020B (ja) |
DE (1) | DE102015104618B4 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6453748B2 (ja) * | 2015-12-09 | 2019-01-16 | トヨタ自動車株式会社 | 熱電変換材料 |
JP6475153B2 (ja) * | 2015-12-18 | 2019-02-27 | トヨタ自動車株式会社 | N型熱電変換材料の製造方法 |
JP6567991B2 (ja) * | 2016-03-04 | 2019-08-28 | トヨタ自動車株式会社 | 熱電変換材料の製造方法 |
JP6747828B2 (ja) * | 2016-03-04 | 2020-08-26 | トヨタ自動車株式会社 | 熱電変換材料及びその製造方法 |
Family Cites Families (20)
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NL131800C (ja) * | 1965-05-17 | |||
US4153641A (en) * | 1977-07-25 | 1979-05-08 | Bausch & Lomb Incorporated | Polysiloxane composition and contact lens |
US5206328A (en) * | 1990-02-08 | 1993-04-27 | Shin-Etsu Chemical Co., Ltd. | Process for the production of an organopolysiloxane |
US5206337A (en) * | 1990-05-10 | 1993-04-27 | Sumitomo Bakelite Company Limited | Solvent-soluble polyimidesiloxane oligomer and process for producing the same |
US6599631B2 (en) * | 2001-01-26 | 2003-07-29 | Nanogram Corporation | Polymer-inorganic particle composites |
JP4104329B2 (ja) * | 2001-12-26 | 2008-06-18 | 東レ・ダウコーニング株式会社 | 無機粉体処理剤、処理された無機粉体および熱可塑性樹脂組成物 |
KR100697511B1 (ko) * | 2003-10-21 | 2007-03-20 | 삼성전자주식회사 | 광경화성 반도체 나노결정, 반도체 나노결정 패턴형성용 조성물 및 이들을 이용한 반도체 나노결정의 패턴 형성 방법 |
US7309830B2 (en) * | 2005-05-03 | 2007-12-18 | Toyota Motor Engineering & Manufacturing North America, Inc. | Nanostructured bulk thermoelectric material |
JP4715953B2 (ja) * | 2008-10-10 | 2011-07-06 | トヨタ自動車株式会社 | ナノコンポジット熱電変換材料、それを用いた熱電変換素子およびナノコンポジット熱電変換材料の製造方法 |
US9718043B2 (en) * | 2009-02-24 | 2017-08-01 | Toyota Motor Engineering & Manufacturing North America, Inc. | Core-shell nanoparticles and process for producing the same |
JP2010275423A (ja) * | 2009-05-28 | 2010-12-09 | Seiko Epson Corp | 接合方法および接合体 |
WO2011022188A2 (en) * | 2009-08-17 | 2011-02-24 | Laird Technologies, Inc. | Formation of high electrical conductivity polymer composites with multiple fillers |
KR101180263B1 (ko) | 2010-05-24 | 2012-09-06 | 한국기계연구원 | 열전분말과 이를 원료로 한 복합재료 및 이들의 제조방법 |
JP2012031382A (ja) * | 2010-07-08 | 2012-02-16 | Dic Corp | 水性硬化性塗料組成物、及びその製造方法 |
JP5273744B2 (ja) * | 2010-07-16 | 2013-08-28 | 住友大阪セメント株式会社 | 無機酸化物粒子とシリコーン樹脂との複合組成物の製造方法 |
JP2012230309A (ja) * | 2011-04-27 | 2012-11-22 | Kaneka Corp | 貼り合せ光学部品 |
JP2012253178A (ja) * | 2011-06-02 | 2012-12-20 | Nec Corp | 熱電変換素子及びその製造方法、並びに熱電変換モジュール |
JP2012255086A (ja) * | 2011-06-09 | 2012-12-27 | National Institute Of Advanced Industrial Science & Technology | 高熱伝導性複合材料 |
JP5853483B2 (ja) | 2011-08-12 | 2016-02-09 | トヨタ自動車株式会社 | ナノコンポジット熱電変換材料 |
US8889027B2 (en) | 2012-03-16 | 2014-11-18 | Toyota Jidosha Kabushiki Kaisha | Method of production of nanocomposite thermoelectric conversion material |
-
2015
- 2015-03-10 JP JP2015047727A patent/JP6110421B2/ja not_active Expired - Fee Related
- 2015-03-25 US US14/668,428 patent/US9728700B2/en active Active
- 2015-03-26 DE DE102015104618.0A patent/DE102015104618B4/de not_active Expired - Fee Related
- 2015-03-27 CN CN201510140982.9A patent/CN104953020B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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DE102015104618A1 (de) | 2015-10-01 |
US20150280096A1 (en) | 2015-10-01 |
CN104953020B (zh) | 2017-09-22 |
US9728700B2 (en) | 2017-08-08 |
DE102015104618B4 (de) | 2021-01-07 |
CN104953020A (zh) | 2015-09-30 |
JP2015195359A (ja) | 2015-11-05 |
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