JP2009506490A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009506490A5 JP2009506490A5 JP2008527504A JP2008527504A JP2009506490A5 JP 2009506490 A5 JP2009506490 A5 JP 2009506490A5 JP 2008527504 A JP2008527504 A JP 2008527504A JP 2008527504 A JP2008527504 A JP 2008527504A JP 2009506490 A5 JP2009506490 A5 JP 2009506490A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- organic electronic
- electronic device
- bank
- well
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 306
- 239000000463 material Substances 0.000 claims description 111
- 238000000034 method Methods 0.000 claims description 78
- 238000000151 deposition Methods 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 68
- 230000008021 deposition Effects 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 125000006850 spacer group Chemical group 0.000 claims description 47
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 46
- 239000002904 solvent Substances 0.000 claims description 42
- 239000012776 electronic material Substances 0.000 claims description 33
- 238000005530 etching Methods 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 238000004380 ashing Methods 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 2
- 239000000243 solution Substances 0.000 description 20
- 239000011159 matrix material Substances 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 15
- 238000009736 wetting Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 11
- 230000002209 hydrophobic effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 230000005525 hole transport Effects 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000007641 inkjet printing Methods 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 150000003384 small molecules Chemical class 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000000412 dendrimer Substances 0.000 description 4
- 229920000736 dendritic polymer Polymers 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000002679 ablation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 230000005258 radioactive decay Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- HHNHBFLGXIUXCM-GFCCVEGCSA-N cyclohexylbenzene Chemical compound [CH]1CCCC[C@@H]1C1=CC=CC=C1 HHNHBFLGXIUXCM-GFCCVEGCSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000010336 energy treatment Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 poly (p-phenylene vinylene) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0517195.4A GB0517195D0 (en) | 2005-08-23 | 2005-08-23 | Molecular electronic device structures and fabrication methods |
| GB0517195.4 | 2005-08-23 | ||
| GB0605128.8 | 2006-03-15 | ||
| GBGB0605128.8A GB0605128D0 (en) | 2005-08-23 | 2006-03-15 | Molecular electronic device structures and fabrication methods |
| PCT/GB2006/003135 WO2007023272A1 (en) | 2005-08-23 | 2006-08-22 | Organic electronic device structures and fabrication methods |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011258870A Division JP5575094B2 (ja) | 2005-08-23 | 2011-11-28 | 液滴堆積ウェルの形成方法、有機電子デバイス、有機電子デバイスの形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009506490A JP2009506490A (ja) | 2009-02-12 |
| JP2009506490A5 true JP2009506490A5 (https=) | 2010-11-25 |
| JP5183475B2 JP5183475B2 (ja) | 2013-04-17 |
Family
ID=35098100
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008527504A Expired - Fee Related JP5183475B2 (ja) | 2005-08-23 | 2006-08-22 | 有機電子デバイスの構造および製造方法 |
| JP2011258870A Expired - Fee Related JP5575094B2 (ja) | 2005-08-23 | 2011-11-28 | 液滴堆積ウェルの形成方法、有機電子デバイス、有機電子デバイスの形成方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011258870A Expired - Fee Related JP5575094B2 (ja) | 2005-08-23 | 2011-11-28 | 液滴堆積ウェルの形成方法、有機電子デバイス、有機電子デバイスの形成方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8436528B2 (https=) |
| JP (2) | JP5183475B2 (https=) |
| KR (2) | KR101335852B1 (https=) |
| CN (1) | CN101243553B (https=) |
| GB (4) | GB0517195D0 (https=) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0618698D0 (en) * | 2006-09-22 | 2006-11-01 | Cambridge Display Tech Ltd | Molecular electronic device fabrication methods and structures |
| US20090058271A1 (en) * | 2007-08-28 | 2009-03-05 | Lg Electronics Inc. | Organic light emitting device |
| WO2010092796A1 (ja) | 2009-02-10 | 2010-08-19 | パナソニック株式会社 | 発光素子、発光素子を備えた発光装置および発光素子の製造方法 |
| EP2398083B1 (en) | 2009-02-10 | 2018-06-13 | Joled Inc. | Light-emitting element, display device, and method for manufacturing light-emitting element |
| US8525407B2 (en) * | 2009-06-24 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Light source and device having the same |
| JP5437736B2 (ja) | 2009-08-19 | 2014-03-12 | パナソニック株式会社 | 有機el素子 |
| CN101996951B (zh) * | 2009-08-20 | 2013-09-11 | 中芯国际集成电路制造(上海)有限公司 | 非易失性存储器结构及其形成方法 |
| KR101588899B1 (ko) * | 2009-09-17 | 2016-01-27 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 |
| CN102097490A (zh) * | 2009-12-15 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | 双位快闪存储器的制作方法 |
| CN102097383B (zh) * | 2009-12-15 | 2013-06-19 | 中芯国际集成电路制造(上海)有限公司 | 双位快闪存储器的制作方法 |
| KR101643009B1 (ko) * | 2009-12-22 | 2016-07-27 | 가부시키가이샤 제이올레드 | 표시 장치와 그 제조 방법 |
| CN102110658B (zh) * | 2009-12-29 | 2013-07-17 | 中芯国际集成电路制造(上海)有限公司 | 双位快闪存储器的制作方法 |
| CN102110657A (zh) * | 2009-12-29 | 2011-06-29 | 中芯国际集成电路制造(上海)有限公司 | 双位快闪存储器的制作方法 |
| US8603922B2 (en) * | 2010-01-27 | 2013-12-10 | Creator Technology B.V. | Semiconductor device, display, electronic apparatus and method of manufacturing a semiconductor device |
| CN102440071B (zh) | 2010-07-05 | 2014-09-03 | 松下电器产业株式会社 | 发光元件的制造方法,使用发光元件的有机显示面板、有机发光装置及有机显示装置 |
| WO2012014256A1 (ja) | 2010-07-30 | 2012-02-02 | パナソニック株式会社 | 有機el素子 |
| WO2012017496A1 (ja) * | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 発光素子、発光素子を備えた発光装置および発光素子の製造方法 |
| CN103038908B (zh) | 2010-08-06 | 2016-01-06 | 株式会社日本有机雷特显示器 | 发光元件、具备发光元件的发光装置以及发光元件的制造方法 |
| WO2012017495A1 (ja) * | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子およびその製造方法 |
| WO2012017492A1 (ja) * | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 発光素子とその製造方法、および発光装置 |
| JP5543599B2 (ja) | 2010-08-06 | 2014-07-09 | パナソニック株式会社 | 発光素子の製造方法 |
| JP5677433B2 (ja) | 2010-08-06 | 2015-02-25 | パナソニック株式会社 | 有機el素子、表示装置および発光装置 |
| WO2012017488A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 発光素子とその製造方法、および発光装置 |
| WO2012017502A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子およびその製造方法 |
| JP5612692B2 (ja) | 2010-08-06 | 2014-10-22 | パナソニック株式会社 | 有機el素子およびその製造方法 |
| JP5677436B2 (ja) | 2010-08-06 | 2015-02-25 | パナソニック株式会社 | 有機el素子 |
| WO2012017503A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子 |
| WO2012017497A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子 |
| WO2012017485A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子、表示装置および発光装置 |
| WO2012017489A1 (ja) | 2010-08-06 | 2012-02-09 | パナソニック株式会社 | 有機el素子、表示装置および発光装置 |
| JP5197882B2 (ja) | 2010-10-15 | 2013-05-15 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
| CN102960066B (zh) | 2010-10-15 | 2015-09-30 | 株式会社日本有机雷特显示器 | 有机发光面板及其制造方法以及有机显示装置 |
| JP5677448B2 (ja) | 2010-10-15 | 2015-02-25 | パナソニック株式会社 | 有機発光パネルとその製造方法、および有機表示装置 |
| JP5573616B2 (ja) | 2010-11-12 | 2014-08-20 | 住友化学株式会社 | 表示装置 |
| JP5418487B2 (ja) * | 2010-12-16 | 2014-02-19 | 住友化学株式会社 | 表示装置 |
| CN103283054B (zh) | 2011-01-21 | 2015-12-16 | 株式会社日本有机雷特显示器 | 有机el元件 |
| US8981361B2 (en) | 2011-02-25 | 2015-03-17 | Panasonic Corporation | Organic electroluminescence display panel with tungsten oxide containing hole injection layer that electrically connects electrode to auxiliary wiring, and organic electroluminescence display device |
| GB201105582D0 (en) * | 2011-04-01 | 2011-05-18 | Cambridge Display Tech Ltd | Organic light-emitting device and method |
| WO2012153445A1 (ja) | 2011-05-11 | 2012-11-15 | パナソニック株式会社 | 有機el表示パネルおよび有機el表示装置 |
| KR20120128966A (ko) * | 2011-05-18 | 2012-11-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| US10158089B2 (en) | 2011-05-27 | 2018-12-18 | Universal Display Corporation | Organic electroluminescent materials and devices |
| KR101888941B1 (ko) * | 2012-05-16 | 2018-08-16 | 엘지디스플레이 주식회사 | 표시장치 및 이의 제조 방법 |
| KR102022123B1 (ko) * | 2012-09-05 | 2019-09-17 | 리쿠아비스타 비.브이. | 표시기판, 이의 제조방법 및 이를 포함하는 전기습윤 표시패널 |
| JP6204012B2 (ja) * | 2012-10-17 | 2017-09-27 | 株式会社半導体エネルギー研究所 | 発光装置 |
| KR101427776B1 (ko) * | 2013-01-23 | 2014-08-12 | 서울대학교산학협력단 | 준 면발광 수직형 유기발광 트랜지스터 및 그 제조 방법 |
| CN103187434A (zh) * | 2013-04-01 | 2013-07-03 | 京东方科技集团股份有限公司 | 有机电致发光器件及制备有机电致发光器件的方法 |
| GB2514401B (en) * | 2013-05-23 | 2017-08-23 | Cambridge Display Tech Ltd | Inkjet Devices |
| CN103337594B (zh) | 2013-05-30 | 2016-02-10 | 京东方科技集团股份有限公司 | 一种oled基板和显示装置 |
| KR102114314B1 (ko) | 2013-06-26 | 2020-05-25 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
| KR102038817B1 (ko) * | 2013-06-28 | 2019-11-01 | 엘지디스플레이 주식회사 | 유기전계 발광소자 및 이의 제조 방법 |
| US8907438B1 (en) * | 2013-08-08 | 2014-12-09 | The United States Of America As Represented By The Secretary Of The Army | Semiconducting organic photovoltaic sensor |
| KR102076620B1 (ko) * | 2013-09-24 | 2020-02-12 | 엘지디스플레이 주식회사 | 유기발광 다이오드 표시장치 및 그 제조 방법 |
| JP6059647B2 (ja) | 2013-12-06 | 2017-01-11 | 双葉電子工業株式会社 | 有機エレクトロルミネッセンスデバイス及びその製造方法 |
| KR102361967B1 (ko) * | 2014-07-11 | 2022-02-11 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 |
| KR102242078B1 (ko) * | 2014-08-05 | 2021-04-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| CN104167430B (zh) * | 2014-08-08 | 2017-04-05 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板、其制作方法及显示装置 |
| KR20160104804A (ko) | 2015-02-26 | 2016-09-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN105140236B (zh) * | 2015-07-31 | 2019-08-06 | 京东方科技集团股份有限公司 | 基板组件及其制备方法以及显示装置 |
| CN105118929B (zh) * | 2015-08-03 | 2018-01-02 | 京东方科技集团股份有限公司 | 电极结构和有机发光单元及其制造方法 |
| KR102515628B1 (ko) * | 2015-12-31 | 2023-03-29 | 엘지디스플레이 주식회사 | 유기 발광 표시 패널 |
| KR102550322B1 (ko) | 2016-03-22 | 2023-07-03 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| CN112117318B (zh) * | 2016-07-29 | 2024-11-01 | 京东方科技集团股份有限公司 | Oled阵列基板及其制作方法、oled显示面板 |
| CN106067478A (zh) * | 2016-08-08 | 2016-11-02 | 深圳市华星光电技术有限公司 | 像素界定层的制作方法与oled器件的制作方法 |
| WO2018036542A1 (zh) * | 2016-08-26 | 2018-03-01 | 纳晶科技股份有限公司 | 发光器件的制作方法、发光器件及混合发光器件 |
| CN108074950B (zh) * | 2016-11-11 | 2021-11-23 | 乐金显示有限公司 | 电致发光显示设备及其制造方法 |
| CN106654052B (zh) * | 2017-03-10 | 2018-11-30 | 江苏集萃有机光电技术研究所有限公司 | 有机发光二极管器件及其封装方法 |
| CN108630728B (zh) * | 2017-03-24 | 2020-07-28 | 京东方科技集团股份有限公司 | 像素界定层、有机电致发光器件及其制备方法和显示装置 |
| JP6470477B1 (ja) * | 2017-11-28 | 2019-02-13 | 堺ディスプレイプロダクト株式会社 | 有機el発光素子及びその製造方法 |
| CN109192886B (zh) * | 2018-09-05 | 2021-01-22 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示面板及显示装置 |
| KR102837792B1 (ko) * | 2019-05-13 | 2025-07-23 | 삼성디스플레이 주식회사 | 디스플레이 패널 및 이를 포함하는 디스플레이 장치 |
| CN110993646B (zh) * | 2019-11-08 | 2022-07-12 | 深圳市华星光电半导体显示技术有限公司 | Oled背板的制备方法及oled背板 |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4539507A (en) | 1983-03-25 | 1985-09-03 | Eastman Kodak Company | Organic electroluminescent devices having improved power conversion efficiencies |
| US5075241A (en) * | 1988-01-29 | 1991-12-24 | Texas Instruments Incorporated | Method of forming a recessed contact bipolar transistor and field effect device |
| GB8909011D0 (en) | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| GB9317932D0 (en) | 1993-08-26 | 1993-10-13 | Cambridge Display Tech Ltd | Electroluminescent devices |
| JP3813217B2 (ja) * | 1995-03-13 | 2006-08-23 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルの製造方法 |
| JP4142117B2 (ja) * | 1995-10-06 | 2008-08-27 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネル及びその製造方法 |
| US6037712A (en) * | 1996-06-10 | 2000-03-14 | Tdk Corporation | Organic electroluminescence display device and producing method thereof |
| JP3899566B2 (ja) | 1996-11-25 | 2007-03-28 | セイコーエプソン株式会社 | 有機el表示装置の製造方法 |
| US6069443A (en) * | 1997-06-23 | 2000-05-30 | Fed Corporation | Passive matrix OLED display |
| ATE268806T1 (de) | 1997-10-23 | 2004-06-15 | Isis Innovation | Lichtemittierende dendrimere |
| JPH11212483A (ja) | 1998-01-27 | 1999-08-06 | Seiko Epson Corp | 液晶表示装置 |
| JPH11212493A (ja) * | 1998-01-29 | 1999-08-06 | Sharp Corp | 発光表示装置 |
| GB9805476D0 (en) | 1998-03-13 | 1998-05-13 | Cambridge Display Tech Ltd | Electroluminescent devices |
| KR100660384B1 (ko) | 1998-03-17 | 2006-12-21 | 세이코 엡슨 가부시키가이샤 | 표시장치의 제조방법 |
| JP3646510B2 (ja) | 1998-03-18 | 2005-05-11 | セイコーエプソン株式会社 | 薄膜形成方法、表示装置およびカラーフィルタ |
| JP3951445B2 (ja) * | 1998-05-15 | 2007-08-01 | セイコーエプソン株式会社 | 有機el素子、表示装置、光学装置、有機el素子の製造方法、表示装置の製造方法、および光学装置の製造方法 |
| KR100495740B1 (ko) | 1999-03-29 | 2005-06-17 | 세이코 엡슨 가부시키가이샤 | 조성물, 막의 제조방법, 및 기능 소자와 이의 제조방법 |
| GB9920543D0 (en) | 1999-08-31 | 1999-11-03 | Cambridge Display Tech Ltd | A formulation for depositing a light-emitting polymer layer |
| JP2003515909A (ja) * | 1999-11-29 | 2003-05-07 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 有機エレクトロルミネッセント装置とその製造方法 |
| AU2001235796A1 (en) | 2000-08-30 | 2002-03-13 | Cambridge Display Technology Limited | A formulation for depositing a conjugated polymer layer |
| JP3628997B2 (ja) * | 2000-11-27 | 2005-03-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置の製造方法 |
| GB0104177D0 (en) | 2001-02-20 | 2001-04-11 | Isis Innovation | Aryl-aryl dendrimers |
| EP1388171A1 (en) * | 2001-05-03 | 2004-02-11 | Koninklijke Philips Electronics N.V. | Electroluminescent device |
| US6963169B2 (en) * | 2001-11-13 | 2005-11-08 | Kuan-Chang Peng | Organic electro-luminescence device |
| JP3705264B2 (ja) * | 2001-12-18 | 2005-10-12 | セイコーエプソン株式会社 | 表示装置及び電子機器 |
| JP3823916B2 (ja) * | 2001-12-18 | 2006-09-20 | セイコーエプソン株式会社 | 表示装置及び電子機器並びに表示装置の製造方法 |
| GB0207134D0 (en) * | 2002-03-27 | 2002-05-08 | Cambridge Display Tech Ltd | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
| DE10228103A1 (de) | 2002-06-24 | 2004-01-15 | Bayer Cropscience Ag | Fungizide Wirkstoffkombinationen |
| GB2391686B (en) | 2002-07-31 | 2006-03-22 | Dainippon Printing Co Ltd | Electroluminescent display and process for producing the same |
| JP2004071432A (ja) | 2002-08-08 | 2004-03-04 | Dainippon Printing Co Ltd | パターン形成体およびその製造方法 |
| JP2004127933A (ja) * | 2002-09-11 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
| US7291970B2 (en) | 2002-09-11 | 2007-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting apparatus with improved bank structure |
| GB0227778D0 (en) | 2002-11-28 | 2003-01-08 | Cambridge Display Tech Ltd | Droplet-deposition related methods and apparatus |
| US7563748B2 (en) | 2003-06-23 | 2009-07-21 | Cognis Ip Management Gmbh | Alcohol alkoxylate carriers for pesticide active ingredients |
| JP2005044577A (ja) * | 2003-07-25 | 2005-02-17 | Dainippon Printing Co Ltd | パターン形成体 |
| US7132788B2 (en) * | 2003-09-09 | 2006-11-07 | Osram Opto Semiconductors Gmbh | Optimal bank shapes for inkjet printing |
| US7307382B2 (en) * | 2003-10-30 | 2007-12-11 | Samsung Sdi Co., Ltd. | Flat display device including an overflow barrier |
| JP3915806B2 (ja) * | 2003-11-11 | 2007-05-16 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| JP2005158494A (ja) * | 2003-11-26 | 2005-06-16 | Seiko Epson Corp | 薄膜の形成方法、電気光学装置の製造方法及び電気光学装置並びに電子機器 |
| KR100549984B1 (ko) * | 2003-12-29 | 2006-02-07 | 엘지.필립스 엘시디 주식회사 | 듀얼패널타입 유기전계발광 소자 및 그 제조방법 |
| KR20050068860A (ko) * | 2003-12-30 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | 듀얼 플레이트 유기전계 발광소자용 상부기판 및 그의제조방법 |
| JP2005222776A (ja) * | 2004-02-04 | 2005-08-18 | Seiko Epson Corp | 有機エレクトロルミネセンス装置及びその製造方法、有機エレクトロルミネセンス装置製造用基板、並びに電子機器 |
| GB0402559D0 (en) | 2004-02-05 | 2004-03-10 | Cambridge Display Tech Ltd | Molecular electronic device fabrication methods and structures |
| US7276453B2 (en) * | 2004-08-10 | 2007-10-02 | E.I. Du Pont De Nemours And Company | Methods for forming an undercut region and electronic devices incorporating the same |
| JP2006179213A (ja) | 2004-12-21 | 2006-07-06 | Seiko Epson Corp | パターン形成基板、電気光学装置及び電気光学装置の製造方法 |
-
2005
- 2005-08-23 GB GBGB0517195.4A patent/GB0517195D0/en not_active Ceased
-
2006
- 2006-03-15 GB GBGB0605128.8A patent/GB0605128D0/en not_active Ceased
- 2006-08-22 KR KR1020087006960A patent/KR101335852B1/ko not_active Expired - Fee Related
- 2006-08-22 US US12/063,984 patent/US8436528B2/en not_active Expired - Fee Related
- 2006-08-22 GB GB1322071.0A patent/GB2507203A/en not_active Withdrawn
- 2006-08-22 CN CN2006800305982A patent/CN101243553B/zh not_active Expired - Fee Related
- 2006-08-22 KR KR1020137014519A patent/KR101431408B1/ko not_active Expired - Fee Related
- 2006-08-22 GB GB0803371.4A patent/GB2500361B/en not_active Expired - Fee Related
- 2006-08-22 JP JP2008527504A patent/JP5183475B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-28 JP JP2011258870A patent/JP5575094B2/ja not_active Expired - Fee Related
-
2013
- 2013-03-18 US US13/846,607 patent/US8836214B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5183475B2 (ja) | 有機電子デバイスの構造および製造方法 | |
| JP2009506490A5 (https=) | ||
| JP5421778B2 (ja) | 分子電子素子の製造方法及び構造体 | |
| US7695759B2 (en) | Display device and manufacturing method thereof | |
| US7892059B2 (en) | Manufacturing method for organic electroluminescent display device including etching partition wall after imparting lyophilicity to partion wall and pixel electrode | |
| JP4328384B2 (ja) | 有機elディスプレイパネルおよびその製造方法 | |
| WO2007023272A1 (en) | Organic electronic device structures and fabrication methods | |
| EP1552570A2 (en) | Method of patterning a functional material on to a substrate | |
| EP2144291A1 (en) | Organic light emitting display and method of fabricating the same | |
| US20080095981A1 (en) | Molecular Electronic Device Fabrication Methods and Structures | |
| JP2009070708A (ja) | 表示装置及び表示装置の製造方法 | |
| JP4742317B2 (ja) | 表示装置及びその製造方法 | |
| JP2007533091A (ja) | 基板に機能材料をパターン形成する方法 | |
| JP4935599B2 (ja) | 表示装置の製造方法 | |
| KR100601371B1 (ko) | 유기 전계발광 표시 소자 및 이의 형성 방법 | |
| JP2005322469A (ja) | 電気光学装置及びその製造方法、並びに電子機器 |