WO2012049712A1 - 有機発光パネルとその製造方法、および有機表示装置 - Google Patents
有機発光パネルとその製造方法、および有機表示装置 Download PDFInfo
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- WO2012049712A1 WO2012049712A1 PCT/JP2010/006125 JP2010006125W WO2012049712A1 WO 2012049712 A1 WO2012049712 A1 WO 2012049712A1 JP 2010006125 W JP2010006125 W JP 2010006125W WO 2012049712 A1 WO2012049712 A1 WO 2012049712A1
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- Prior art keywords
- light emitting
- organic light
- inclination angle
- partition
- emitting unit
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- 238000004519 manufacturing process Methods 0.000 title claims description 45
- 238000005192 partition Methods 0.000 claims description 193
- 239000000463 material Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 48
- 230000008569 process Effects 0.000 claims description 24
- 238000001035 drying Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 14
- 238000002834 transmittance Methods 0.000 claims description 11
- 238000000638 solvent extraction Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 182
- 239000000976 ink Substances 0.000 description 109
- 239000010408 film Substances 0.000 description 44
- -1 polyethylene Polymers 0.000 description 34
- 238000002347 injection Methods 0.000 description 22
- 239000007924 injection Substances 0.000 description 22
- 238000012986 modification Methods 0.000 description 18
- 230000004048 modification Effects 0.000 description 18
- 238000009826 distribution Methods 0.000 description 13
- 239000002585 base Substances 0.000 description 12
- 239000011247 coating layer Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000011161 development Methods 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 239000011368 organic material Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Natural products C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000000788 chromium alloy Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- WDECIBYCCFPHNR-UHFFFAOYSA-N Chrysene Natural products C1=CC=CC2=CC=C3C4=CC=CC=C4C=CC3=C21 WDECIBYCCFPHNR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910015202 MoCr Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N Phenanthrene Natural products C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- BBEAQIROQSPTKN-UHFFFAOYSA-N antipyrene Natural products C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N benzo-alpha-pyrone Natural products C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- DZBUGLKDJFMEHC-UHFFFAOYSA-N benzoquinolinylidene Natural products C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- VPUGDVKSAQVFFS-UHFFFAOYSA-N hexabenzobenzene Natural products C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- JEXVQSWXXUJEMA-UHFFFAOYSA-N pyrazol-3-one Chemical class O=C1C=CN=N1 JEXVQSWXXUJEMA-UHFFFAOYSA-N 0.000 description 1
- 150000003219 pyrazolines Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Definitions
- the present invention relates to an organic light emitting panel, a manufacturing method thereof, and an organic display device.
- each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween.
- driving the display device holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.
- the organic light emitting layers of adjacent pixel portions are partitioned by a partition (bank) made of an insulating material.
- the organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the partition walls and drying the ink.
- Patent Document 1 describes a technique in which a convex portion is provided on the surface portion of the partition wall, thereby controlling the pinning position of the ink with respect to the surface portion of the partition wall. ing. That is, by adopting the technique proposed in Patent Document 1, the pinning position when the ink in one pixel portion is dropped can be pinned to the convex portion formed on the surface portion, thereby The film thickness uniformity can be ensured.
- the technique proposed by the said patent document 1 is employ
- the present invention has been made to solve the above-described problems, and provides a display device with less inhomogeneous luminance in the surface and a method of manufacturing the same, by making the film thickness of the organic light emitting layer uniform over the entire surface of the panel. For the purpose.
- the organic light-emitting panel according to one embodiment of the present invention is characterized by adopting the following configuration.
- An organic light-emitting panel is an organic light-emitting panel in which a plurality of pixel units are arranged, and each pixel unit of the plurality of pixel units has a different emission color and is arranged in order. It has a light emitting part.
- Each light emitting unit includes a base layer including a first electrode, an organic light emitting layer provided opposite to the base layer, and formed by applying an ink containing an organic light emitting material corresponding to each emission color, and an organic light emitting layer And a second electrode formed on the side opposite to the base layer.
- the plurality of light-emitting portions in the same pixel portion are sequentially coated with ink corresponding to each light emission color from one side to the other side, whereby the organic light-emitting layer Formed on the one side and corresponding ink is applied on the first round, and the second light emitting portion is provided on the center side and the corresponding ink is applied on the second round. It has at least a light emitting part and a third light emitting part that is located on the other side and to which the corresponding ink is applied in the third round, and is adjacent to one of the light emitting parts above the base layer.
- a plurality of partition walls that divide the light emitting portions and define each light emitting portion are provided.
- the inclination angles of the opposing surface portions in the two adjacent partition walls defining the first light-emitting portion are the same among the plurality of pixel portions, and the second light-emitting portion is defined.
- the two adjacent partition walls have different inclination angles of the opposing surface portions, and the inclination angle of the surface portion of the partition wall located on the third light emitting unit side is greater than the inclination angle of the surface portion of the partition wall positioned on the first light emitting unit side. It is characterized by including a pixel portion that satisfies the relationship of large.
- the first light-emitting portion is formed by forming the organic light-emitting layer by applying the corresponding ink in the first round. In the region adjacent to the light emitting part, no ink is applied, and the vapor concentration of the ink is “0” and equal on one end side and the other end side of the first light emitting part, and the film thickness of the organic light emitting layer is biased. There is no. Therefore, with respect to the first light emitting part, by making the inclination angles of the opposing surface parts in the adjacent partition walls equal, it is possible to prevent the film thickness from being biased and to obtain good light emission characteristics.
- the corresponding ink is applied in the second round to form the organic light emitting layer. Therefore, when the second light emitting unit is formed, the ink in the region adjacent to the second light emitting unit is formed.
- the vapor concentration will be different. That is, in the second light emitting unit, the vapor concentration of the ink is higher at one end side which is the first light emitting unit side than at the other end side which is the third light emitting unit side. For this reason, in the second light emitting unit, the thickness of the light emitting layer on the other end side that is the third light emitting unit side in the organic light emitting layer is larger than the film thickness of the light emitting layer on the one end side that is the first light emitting unit side. Thus, the film thickness tends to be biased.
- the inclination angle of the surface portion of the partition located on the third light emitting unit side of the opposing surface portion in the two adjacent partitions defining the second light emitting unit is the first angle. Since the inclination angle of the surface portion of the partition located on the light emitting portion side is larger, the ink pinning position on the partition located on the third light emitting portion side is relative to the ink pinning position on the partition located on the first light emitting portion side. Become expensive. Thereby, the film thickness of the organic light emitting layer on the third light emitting part side can be suppressed, and the deviation of the film thickness between the one end part and the other end part of the second light emitting part can be prevented.
- the organic light-emitting panel according to one embodiment of the present invention, it is possible to prevent a deviation in the thickness of the organic light-emitting layer with respect to the light-emitting portions in the same pixel portion, and good light-emitting characteristics in the same pixel portion can be obtained.
- FIG. 1 is a block diagram showing a schematic configuration of an organic display device 1 according to Embodiment 1.
- FIG. 3 is a schematic cross-sectional view showing some subpixels 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing a configuration of subpixels 100a to 100c and banks 105a to 105d that partition the subpixels 100a to 100c in the display panel 10.
- (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small
- (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large
- (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small
- (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer.
- FIG. 6 is a diagram showing the film thickness distribution of organic light emitting layers in Samples 1 to 3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5.
- FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- FIG. (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A) is a schematic flow diagram showing a process order related to application and drying of inks 1060a to 1060c
- (b) is a schematic flow chart showing another process order related to application and drying of inks 1060a to 1060c. is there.
- 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1.
- FIG. (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- FIG. 6 is a schematic cross-sectional view showing a configuration of subpixels 300a to 300c and non-pixel portions 300d and 300e and banks 305a to 305e in a display panel included in the organic display device according to Embodiment 2.
- (A)-(c) is a schematic cross section which shows the process of apply
- (A), (b) is a schematic cross section for demonstrating the definition of a taper angle. 4 is a schematic plan view for explaining regions 10a1, 10a2, and 10b in the display panel 10.
- FIG. 2 is an external perspective view showing an example of an external appearance of a set including the organic display device 1.
- FIG. 14 is a schematic plan view showing a configuration of a bank 805 included in a display panel 80 according to Modification 3.
- FIG. (A), (b) is a schematic cross section which shows the biased state of the film thickness distribution of the organic light emitting layer for every adjacent sub pixel in a display panel.
- (A) to (c) are schematic cross-sectional views showing the vapor concentration distribution during the formation of the organic light emitting layer and the state of uneven film shape in the ink drying process.
- An organic light-emitting panel is an organic light-emitting panel in which a plurality of pixel units are arranged, and each pixel unit of the plurality of pixel units has a different emission color and is arranged in order. It has a light emitting part.
- Each light emitting unit includes a base layer including a first electrode, an organic light emitting layer provided opposite to the base layer, and formed by applying an ink containing an organic light emitting material corresponding to each emission color, and an organic light emitting layer And a second electrode formed on the side opposite to the base layer.
- the plurality of light-emitting portions in the same pixel portion are sequentially coated with ink corresponding to each light emission color from one side to the other side, whereby the organic light-emitting layer Formed on the one side and corresponding ink is applied on the first round, and the second light emitting portion is provided on the center side and the corresponding ink is applied on the second round. It has at least a light emitting part and a third light emitting part that is located on the other side and to which the corresponding ink is applied in the third round, and is adjacent to one of the light emitting parts above the base layer.
- a plurality of partition walls that divide the light emitting portions and define each light emitting portion are provided.
- the inclination angles of the opposing surface portions in the two adjacent partition walls defining the first light-emitting portion are the same among the plurality of pixel portions, and the second light-emitting portion is defined.
- the two adjacent partition walls have different inclination angles of the opposing surface portions, and the inclination angle of the surface portion of the partition wall located on the third light emitting unit side is greater than the inclination angle of the surface portion of the partition wall positioned on the first light emitting unit side. It is characterized by including a pixel portion that satisfies the relationship of large.
- the first light-emitting portion is formed by forming the organic light-emitting layer by applying the corresponding ink in the first round. In the region adjacent to the light emitting part, no ink is applied, and the vapor concentration of the ink is “0” and equal on one end side and the other end side of the first light emitting part, and the film thickness of the organic light emitting layer is biased. There is no. Therefore, with respect to the first light emitting part, by making the inclination angles of the opposing surface parts in the adjacent partition walls equal, it is possible to prevent the film thickness from being biased and to obtain good light emission characteristics.
- the corresponding ink is applied in the second round to form the organic light emitting layer. Therefore, when the second light emitting unit is formed, the ink in the region adjacent to the second light emitting unit is formed.
- the vapor concentration will be different. That is, in the second light emitting unit, the vapor concentration of the ink is higher at one end side which is the first light emitting unit side than at the other end side which is the third light emitting unit side. For this reason, in the second light emitting unit, the thickness of the light emitting layer on the other end side that is the third light emitting unit side in the organic light emitting layer is larger than the film thickness of the light emitting layer on the one end side that is the first light emitting unit side. Thus, the film thickness tends to be biased.
- the inclination angle of the surface portion of the partition located on the third light emitting unit side of the opposing surface portion in the two adjacent partitions defining the second light emitting unit is the first angle. Since the inclination angle of the surface portion of the partition located on the light emitting portion side is larger, the ink pinning position on the partition located on the third light emitting portion side is relative to the ink pinning position on the partition located on the first light emitting portion side. Become expensive. Thereby, the film thickness of the organic light emitting layer on the third light emitting part side can be suppressed, and the deviation of the film thickness between the one end part and the other end part of the second light emitting part can be prevented.
- the organic light-emitting panel according to one embodiment of the present invention, it is possible to prevent a deviation in the thickness of the organic light-emitting layer with respect to the light-emitting portions in the same pixel portion, and good light-emitting characteristics in the same pixel portion can be obtained.
- the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of
- the plurality of pixel portions are formed so as to be adjacent to each other, and the opposing surface portions of the two adjacent partition walls that define the third light-emitting portion are formed.
- a configuration in which the inclination angles are equal can be employed.
- the inclination angle of the opposing surface portions in the two adjacent partition walls that define the third light emitting portion is made equal so that the unevenness of the film thickness does not occur during manufacturing.
- the three light emitting portions it is possible to prevent the unevenness of the film thickness of the organic light emitting layer and to obtain good light emitting characteristics.
- good light emission characteristics can be obtained in the plurality of pixel portions.
- the inclination angle of the facing surface portion of the partition located on the first light-emitting portion side is the first angle. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in two adjacent partition walls that define the light emitting portion.
- the ink application has already been performed on the first light emitting portion in the first round.
- the vapor concentration of the ink on one end side that is the first light emitting unit side is higher than the other end side that is the third light emitting unit side, but in the two adjacent partitions that define the second light emitting unit,
- the organic light emitting layer formed The uneven thickness can be suppressed.
- the inclination angle of the facing surface portion of the partition located on the first light-emitting portion side in the two adjacent partitions defining the second light-emitting portion is the third angle. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in two adjacent partition walls that define the light emitting portion.
- the ink application has already been performed on the first light emitting portion in the first round.
- the vapor concentration of the ink on one end side that is the first light emitting unit side is higher than the other end side that is the third light emitting unit side, but in the two adjacent partitions that define the second light emitting unit,
- the organic light emitting layer formed The uneven thickness can be suppressed.
- the adjacent pixel portion and the pixel portion are formed continuously, and there is no non-pixel portion for disposing the bus bar between them, so that ink is applied to the third light emitting portion.
- the inclination angles of the opposing surface portions in the two adjacent partitions defining the third light emitting portion are set to be equal to each other.
- the inclination angle of the surface portion of each partition wall can be specifically set within the following range.
- the inclination angle of the opposing surface part of the partition located on the third light emitting part side can be set to 35 [°] or more and 45 [°] or less. .
- the inclination angle of the opposing surface part of the partition located on the first light emitting part side can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface portions in the two adjacent partition walls defining the first light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface portions in the two adjacent partitions defining the third light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- a non-pixel portion is formed between adjacent pixel portions of the plurality of pixel portions, and the pixel portion and the non-pixel portion are arranged between the pixel portion and the non-pixel portion.
- a partition wall for partitioning the non-pixel part is formed, and in each pixel part, the inclined angle of the opposing surface part in the two adjacent partition walls defining the third light emitting part is different, and the surface part of the partition wall located on the non-pixel part side It is possible to adopt a configuration in which the inclination angle is larger than the inclination angle of the surface portion of the partition wall located on the second light emitting portion side.
- the vapor concentration is different from the second light emitting portion side.
- the inclination angles of the opposing surface parts in the adjacent two partition walls defining the third light emitting part are different, and the surface part of the partition part located on the non-pixel part side is different.
- the non-pixel portion includes a second electrode and the same material as the first electrode without including an organic light-emitting layer.
- a configuration in which the second electrode and the third electrode are electrically connected can be employed.
- a light transmissive material for example, ITO, IZO, etc.
- ITO indium gallium oxide
- IZO indium gallium oxide
- the second electrode and the third electrode are connected to reduce the electrical resistance, and even when the panel size is large, a voltage drop hardly occurs and high light emission characteristics can be secured.
- the third electrode is, for example, a bus bar.
- the inclination angle of the facing surface portion of the barrier rib located on the third light-emitting portion side is the first angle.
- the inclination angle of the opposing surface portion of the partition located on the light emitting portion side is larger than the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side in two adjacent partitions defining the third light emitting portion. It is possible to adopt a configuration that is larger than the inclination angle of the facing surface portions of the partition located on the second light emitting portion side.
- the inclination angle of the surface portion of the partition located on the third light emitting unit side among the opposing surface portions of the two adjacent partitions defining the second light emitting unit is set on the first light emitting unit side.
- the pinning position of the ink applied to the second light emitting part is set to be larger than the inclination angle of the surface part of the partition wall positioned, and the first light emitting part side is closer to the corresponding surface part of the partition on the third light emitting part side. Therefore, the unevenness of the film thickness of the formed organic light emitting layer can be suppressed.
- the organic light-emitting panel in the above configuration, in the two adjacent barrier ribs defining the second light-emitting portion, the inclination angle of the facing surface portion of the barrier rib located on the third light-emitting portion side, and the third It is possible to employ a configuration in which two adjacent partition walls defining the light emitting portion have the same inclination angle of the opposing surface portions of the partition wall located on the non-pixel portion side.
- the non-pixel portion is arranged adjacent to the third light emitting portion, and therefore, when applying ink to the third light emitting portion, from the second light emitting portion side.
- the vapor concentration is low on the non-pixel portion side
- the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side in the two adjacent partitions defining the third light emitting portion as described above is Similar to the second light emitting unit, the organic light emitting layer in the third light emitting unit is made to be equal to the inclination angle of the opposing surface part of the partition located on the third light emitting unit side in the two adjacent partitions defining the light emitting unit. Can be suppressed.
- the inclination angle of the facing surface portion of the partition located on the first light-emitting portion side is the first angle. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in two adjacent partition walls that define the light emitting portion.
- the vapor concentration on the first light emitting unit side is the third light emission.
- the vapor concentration on the part side is higher and the thickness of the organic light emitting layer tends to be thicker on the third light emitting part side, but such tendency is less on the first light emitting part side. . Therefore, in the case of adopting the above configuration, it is possible to suppress the relative thickness deviation of the organic light emitting layer of the second light emitting unit by defining the inclination angle in the surface part of the partition wall by the above relationship.
- the inclination angle of the facing surface portion of the partition located on the second light-emitting portion side is the first angle. It is possible to adopt a configuration that is equal to the inclination angle of the opposing surface portions in two adjacent partition walls that define the light emitting portion.
- the organic light emitting layer tends to be thicker on the non-pixel part side due to the uneven vapor concentration, but on the second light emitting part side, There is little tendency. Therefore, in the case of adopting the above configuration, it is possible to suppress the relative thickness deviation of the organic light emitting layer of the third light emitting unit by defining the inclination angle in the surface portion of the partition wall by the above relationship.
- the inclination angle of the surface portion of each partition wall in the configuration in which the non-pixel portion is arranged between the adjacent pixel portions, can be specifically set within the following range. it can.
- the inclination angle of the opposing surface part of the partition located on the third light emitting part side can be set to 35 [°] or more and 45 [°] or less. .
- the inclination angle of the opposing surface portion of the partition located on the non-pixel portion side can be set to 35 [°] or more and 45 [°] or less.
- the inclination angle of the opposing surface portion of the partition located on the first light emitting unit side can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle of the opposing surface of the partition located on the second light emitting unit side can be set to 25 [°] or more and 35 [°] or less. .
- the inclination angle of the opposing surface portions in the two adjacent partitions defining the first light emitting portion can be set to 25 [°] or more and 35 [°] or less.
- the inclination angle is defined as an angle formed by each of the facing surface portions of the partition and the upper surface of the base layer on which the partition is formed. Can do.
- the base layer includes a TFT (thin film transistor) layer formed below the first electrode, and in each pixel portion, the first electrode is the TFT.
- TFT thin film transistor
- An organic display device includes any one of the organic light-emitting panels described above. For this reason, the organic display device according to one embodiment of the present invention has the same effect as the organic display panel according to one embodiment of the present invention.
- the method for manufacturing an organic light emitting panel according to an aspect of the present invention is a method for manufacturing an organic light emitting panel in which a plurality of pixel portions are arranged, and includes the following steps.
- a photosensitive resist material is laminated on the underlayer.
- a plurality of openings corresponding to a plurality of light emitting portions are formed for each pixel portion by patterning by exposing the laminated photosensitive resist material to a mask and partitioning adjacent light emitting portions.
- a plurality of partition walls defining each light emitting portion are formed.
- a 2nd electrode is formed above an organic light emitting layer.
- a first opening corresponding to the first light emitting portion located on one side and a first opening located on the center side Forming a second opening corresponding to the two light-emitting portions and a third opening corresponding to the third light-emitting portion located on the other side, and further, the opposing surface portions of the two adjacent partition walls defining the first light-emitting portion
- the inclination angle is formed equally.
- the manufacturing method of the organic light emitting panel which concerns on 1 aspect of this invention, in the said 3rd process, opposing in the adjacent 2 partition which prescribes
- the slope angle of the surface portion to be made is different, and the slope angle of the surface portion of the partition wall located on the third light emitting portion side is made larger than the tilt angle of the surface portion of the partition wall located on the first light emitting portion side.
- the ink corresponding to each light emission color is applied to each pixel portion in the first opening, the second opening, and the third opening. It drops in order and forms an organic light emitting layer, It is characterized by the above-mentioned.
- the manufacturing method which concerns on 1 aspect of this invention is employ
- the third light-emitting portion in two adjacent partition walls that define the second light-emitting portion is related to exposure of the photosensitive resist material.
- the second light emitting part is defined by making the exposure amount to the part corresponding to the surface part of the partition located on the side larger than the exposure amount to the part corresponding to the surface part of the partition located on the first light emitting part side. It is possible to adopt a configuration in which the inclination angle of the surface portion of the partition located on the third light emitting unit side in the two adjacent partitions is larger than the inclination angle of the surface portion of the partition located on the first light emitting unit side. .
- the third light-emitting portion in two adjacent partition walls that define the second light-emitting portion is related to exposure of the photosensitive resist material.
- the transmittance of light to the portion corresponding to the surface portion of the partition located on the side is smaller than the transmittance of light to the portion corresponding to the surface portion of the partition located on the first light emitting portion side.
- the third step after exposing and developing the photosensitive resist material, in two adjacent partitions defining the second light-emitting portion, By performing an additional exposure process on the portion corresponding to the surface portion of the partition located on the third light emitting unit side, the two adjacent partition walls defining the second light emitting unit are located on the third light emitting unit side.
- a configuration in which the inclination angle of the surface portion of the partition wall is made larger than the inclination angle of the surface portion of the partition wall located on the first light emitting unit side can be employed.
- An organic display device includes an organic light-emitting panel obtained by any of the manufacturing methods described above.
- the organic display device thus obtained has the same effect as the organic light emitting panel obtained by the above manufacturing method.
- an anode electrode 902 and an electrode coating layer 903 covering the anode electrode 902 are provided on a substrate 901 for each of the subpixels 900a, 900b, and 900c. Then, a hole injection layer 904 is formed so as to cover the electrode coating layer 902 and the surface of the substrate 901.
- organic light emitting layers 906a, 906a, 906a, 906a, 906a, 906a, 906b and 906c are stacked.
- the organic light emitting layers 906a, 906b, and 906c are partitioned by banks 905a to 905d provided upright on the hole injection layer 904.
- the organic light emitting layer 906b of the subpixel 900b arranged in the center in the arrangement order may cause a deviation in film thickness.
- the height of the location C 3 in the bank 905 c of the organic light emitting layer 906 b is the height of the location C 2 in the bank 905 b and the location C on the bank 905 b side of the organic light emitting layer 906 a in the subpixel 900 a. The phenomenon that it becomes higher than the height of 1 occurs.
- the heights of the respective locations C 12 and C 14 on the banks 955c and 955d side of the organic light emitting layers 956b and 956c in the subpixels 950b and 950c are as follows.
- a phenomenon occurs in which the height of each of the organic light emitting layers 956b and 956c is higher than the height of the respective portions C 11 and C 13 on the banks 955b and 955c side.
- the height of the portion on the bank 955a side and the height of the portion on the bank 955b side are substantially equal, resulting in a large deviation in film thickness. Absent.
- the present inventor presumed that the decrease in film thickness uniformity in the organic light-emitting layer was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did.
- FIG. 24A a state is assumed in which ink 9060b for forming an organic light emitting layer is applied to a region defined between the banks 905b and 905c.
- the vapor concentration distribution is lower on the right side than on the left side of FIG. 24A as indicated by a two-dot chain line, it is considered that the thickness of the organic light emitting layer is biased due to the following relationship. .
- surface profile L 90 of ink 9060B has a shape which raised the central portion of the sub-pixels.
- fast evaporation rate at low vapor concentrations side since slower at high vapor concentrations side, the changes to the surface profile L 91 It can be considered formally.
- the solvent moves as indicated by the broken line arrow L 92 inside the ink 9061b in the middle of drying.
- the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves.
- FIG. 24C when the vapor concentration distribution is biased, an organic light emitting layer 906b having a surface profile L 93 that rises toward the right side is formed.
- the present inventor has obtained an inference regarding the organic light emitting panel that the uniformity of the thickness of the formed organic light emitting layer is reduced due to the nonuniformity of the vapor concentration distribution when the ink is dried. .
- the present inventor changes the pinning position of the bank side surface portion of the ink by changing the inclination angle of the surface portion of the bank in the panel surface. As a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.
- a display device (organic display device) 1 includes a display panel (organic light emitting panel) unit 10 and a drive control unit 20 connected thereto.
- the display panel unit 10 is an organic light emitting panel using an electroluminescence phenomenon of an organic material, and a plurality of pixel units are two-dimensionally arranged in the XY plane direction.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.
- the configuration of the display panel 10 will be described with reference to FIG. Note that the display panel 10 according to the present embodiment employs a top emission type organic light emitting panel as an example, and emits organic light having one of red (R), green (G), and blue (B). A plurality of pixel portions including layers are arranged and configured in a matrix. In FIG. 2, one subpixel 100 in one pixel portion is extracted and drawn.
- the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each subpixel 100.
- a bank (partition wall) 105 made of an insulating material and partitioning between the sub-pixels 100 is erected.
- An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each subpixel 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .
- the substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.
- the substrate 101 includes a TFT layer, a passivation film, an interlayer insulating film, and the like that are stacked.
- the anode electrode 102 is composed of a single layer made of a conductive material or a laminated body formed by laminating a plurality of layers.
- a conductive material for example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- Al aluminum
- an alloy containing the same For example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- MoCr molybdenum and chromium alloy
- NiCr nickel and
- Electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers at least a part of the surface of the anode electrode 102 at the upper part in the Z-axis direction.
- ITO indium tin oxide
- the hole injecting and transporting layer 104 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- PEDOT mixture of polythiophene and polystyrene sulfonic acid
- the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.
- the bank (partition wall) 105 is made of an organic material such as resin and has an insulating property.
- the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin.
- the bank 105 preferably has organic solvent resistance.
- the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the process.
- the side surface portion can be treated with fluorine.
- a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or more and having water repellency can be used as the insulating material used for forming the bank 105. This is because when a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent subpixels 100 is generated. This is because various problems such as an increase in power consumption are caused.
- the bank 105 when the bank 105 is formed using a hydrophilic material, the difference in lyophilicity / liquid repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. This is because it becomes difficult to selectively hold the ink containing an organic substance in the opening of the bank 105 in order to form the ink.
- the structure of the bank 105 not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted.
- the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.
- Organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108.
- As a material used for forming the organic light emitting layer 106 it is necessary to use a light emitting organic material that can be formed by a wet printing method.
- Electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
- the cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance
- the cathode electrode 108 As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also.
- the layer containing silver may be formed of silver alone, or may be formed of a silver alloy.
- a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.
- the sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.
- the display panel 10 employs a line bank 105 as an example. Specifically, each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction.
- the sub-pixel 100 is formed so that the emission color is different for each area partitioned by the bank 105.
- the sub-pixel 100 has 3 emission colors of red (R), green (G), and blue (B).
- R red
- G green
- B blue
- One pixel portion is configured by a combination of two subpixels.
- FIG. 4 is a cross-sectional end view in which the display panel 10 in FIG. 1 is cut along the AA ′ cross section and a part thereof is schematically shown.
- a subpixel 100a, a subpixel 100b, and a subpixel 100c are sequentially arranged in this order from the left side in the X-axis direction.
- the pixel portion and the pixel portion are arranged so as to be adjacent to each other.
- the subpixel 100a is defined by the bank 105a and the bank 105b
- the subpixel 100b is defined by the bank 105b and the bank 105c
- the subpixel 100c is defined by the bank 105b and the bank 105d.
- the surface portions 105aa, 105ba, 105bb, 105cb, 105cc, and 105dc and the surface of the hole injecting and transporting layer 104, which is the base layer have angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cb, ⁇ cc and ⁇ dc are formed.
- angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cb, ⁇ cc, and ⁇ dc satisfy the relationships shown by the following equations.
- FIG. 5 schematically illustrates the structure of one subpixel.
- the angle of inclination of the surface portion of the bank 105x (the angle formed by the surface portion of the bank 105x and the surface of the hole injecting and transporting layer 104) is the angle ⁇ x
- the inclination angle of the surface portion of the bank 105y (the angle formed by the surface portion of the bank 105y and the surface of the hole injection transport layer 104) is the angle ⁇ y.
- the angle ⁇ x and the angle ⁇ y satisfy the following relationship.
- Hy> Hx As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the sub-pixel is formed in the organic light emitting layer 106x to be formed due to the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.
- the thickness Tx and the thickness Ty satisfy the following relationship.
- the pinning position is higher in Sample 3 and Sample 4 where the taper angle is larger than the thickness distribution of Sample 2.
- the horizontal axis indicates the horizontal direction
- the vertical axis indicates the height direction.
- Sample 5 in which the taper angle (inclination angle) at the bank surface portion was increased to 50 [°] was less uniform in film thickness than Sample 2.
- the anode electrode 102 and the electrode covering layer 103 are sequentially stacked on the upper surface in the Z-axis direction of the substrate 101 so as to correspond to the respective subpixel planned areas 1000a, 1000b, and 1000c. .
- a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface.
- the anode electrode 102 is formed by, for example, forming a thin film made of Al or an alloy thereof or an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the thin film using a photolithography method.
- the electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method and patterning the ITO thin film using a photolithography method or the like.
- a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injecting and transporting layer 104.
- a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coat method.
- a photosensitive resist material is used for the formation of the bank material layer 1050.
- an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.
- a mask 501 provided with openings 501a, 501b, 501c, and 501d is provided above the bank material layer 1050 at a location where a bank is to be formed. In this state, exposure is performed through the openings 501a, 501b, 501c, and 501d of the mask 501.
- the opening 501a of the mask 501 located on the left side of the planned subpixel area 1000a has a width Wa of the surface portion 105aa of the bank 105a to be formed. 4)) at the lower end points Pa1 and Pa2.
- the opening 501c of the mask 501 located between the sub-pixel 1000b and the sub-pixel 1000c has a width Wc1 of the point Pc1 at the upper end of the surface portion 105cb (see FIG. 4) of the bank 105c to be formed and the surface portion 105cc. (Refer to FIG. 4) and the point Pc2 of the skirt portion.
- a mask 502 having an opening 502c provided at a position corresponding to the surface portion 105cb (see FIG. 4) of the bank 105c is disposed above the bank material layer 1050.
- the second exposure is executed through the opening 502c of the mask 502.
- the width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the surface portion 105cb of the bank 105c to be formed.
- the surface portion 105cb of the bank 105c on the subpixel planned area 1000b side is more than the surface portion 105aa, 105ba, 105bb, 105dc of the banks 105a, 105b, and 105d and the surface portion 105cc of the bank 105c on the subpixel planned area 1000c side.
- the inclination angle increases.
- an ink 1060a containing an organic light emitting material is applied to the opening (subpixel planned area 1000a) partitioned by the bank 105a and the bank 105b using an ink jet method or the like.
- an ink 1060b containing an organic light emitting material is applied to the opening (sub-pixel planned region 1000b) partitioned by the bank 105b and the bank 105c, similarly using an inkjet method or the like.
- the pinning position Qcb of the ink 1060b with respect to the surface portion 105cb of the bank 105c is another pinning position. The position is higher than Qaa, Qba, and Qbb.
- ink 1060c containing an organic light emitting material is applied to the opening (subpixel planned region 1000c) partitioned by the bank 105c and the bank 105d using the same ink jet method or the like.
- the ink 1060c is applied to both sides in the X-axis direction. There is no difference in the vapor concentration, and the thickness of the organic light emitting layer is not biased even if the inclination angle of the bank surface is not adjusted. This is clear from the above.
- red ink (ink 1060a) is applied (step S1)
- green ink (ink 1060b)
- blue ink (ink) is applied.
- 1060c) is applied (step S3), and then the ink drying process (step S4) is collectively performed.
- step S11 application (step S11) of red ink (ink 1060a) and drying (step S12) are performed, and then application of green ink (ink 1060b) is performed.
- the execution of (Step S21) and its drying (Step S22) and the application of the blue ink (ink 1060c) (Step S31) and its drying (Step S32) may be performed sequentially.
- the relationship between the inclination angles of the surface portions 105aa, 105ba, 105bb, 105cb, 105cc, and 105dc of the banks 105a, 105b, 105c, and 105d can be the same as described above. Also in this case, the uneven thickness of the formed organic light emitting layer 106 can be suppressed.
- the inclination angle ⁇ cb of the surface portion 105cb on the subpixel 100c side in the bank 105c is set to the other surface portions 105aa, 105ba, 105bb, 105cc,
- the inclination angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cc, and ⁇ dc of 105 dc are set large. For this reason, as shown in FIG. 11A, when the ink 1060b is applied to the planned sub-pixel area 1000b, the pinning position Qcb becomes higher than the other pinning positions Qaa, Qba, Qbb.
- the inclination angles ⁇ aa, ⁇ ba, ⁇ bb, ⁇ cc, ⁇ dc of the surface portions 105aa, 105ba, 105bb, 105cc, 105dc are equal to each other.
- the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in the subpixels 100a, 100b, and 100c, and luminance unevenness is small.
- the display apparatus 1 which has the said effect is manufactureable.
- “equal” does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device 1. Specifically, in the display panel 10, it means that the inclination angles are made equal within a practically allowable range of the difference in luminance efficiency (luminance unevenness) of the subpixels 100 a, 100 b, and 100 c belonging to each.
- Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG.
- FIG. 13 shows a step corresponding to the step shown in FIG. 9C to FIG.
- a mask 503 is disposed thereon.
- the mask 503 is provided with light transmitting portions 503a, 503b, 503c1, 503c2, and 503d.
- Each of the light transmitting portions 503a, 503b, 503c1, 503c2, and 503d is provided corresponding to a location where the banks 105a, 105b, 105c, and 105d are to be formed.
- the width Wa of the light transmitting portion 503a in the region corresponding to the left side of the planned subpixel region 1000a is the surface portion 105aa of the bank 105a to be formed (FIG. 4). )) At the lower end points Pa1 and Pa2.
- the width Wc2 of the light transmitting portion 503c1 in the region corresponding to between the subpixel 1000b and the subpixel 1000c depends on the lower end point Pc2 and the upper end point Pc1 of the bank 105c (see FIG. 4) to be formed. It is prescribed.
- the light transmitting portion 503c2 is defined by the upper and lower end points Pc3 and Pc1 of the surface portion 105cb (see FIG. 4) of the bank 105c to be formed.
- the mask 503 is configured using a mask such as a halftone, and the light transmittances of the light transmitting portions 503a, 503b, 503c1, and 503d and the light transmitting portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a, 503b, 503c1, and 503d.
- Banks 105a, 105b, 105c, and 105d as shown in FIG. 10B are formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then baking. Can do. That is, the relationship expressed by the above [Equation 1] is higher in the portion exposed through the light transmitting portion 503c2 where the light transmittance is set higher than in the portion exposed through the other light transmitting portions 503a, 503b, 503c1, and 503d. As described above, the inclination angle of the side wall surface is increased.
- the display device 1 can also be manufactured by the manufacturing method as described above.
- a mask 504 is disposed thereon.
- the mask 504 is provided with openings 504a, 504c, and 504d corresponding to the respective locations where the bank 105 is to be formed.
- the openings 504a, 504b, and 504d are formed with the same width as the opening 501a of the mask 501 used in the manufacturing method of the above embodiment.
- the width Wc3 of the opening 504c provided at the location where the bank 105c (see FIG. 4) to be formed between the planned subpixel region 1000b and the planned subpixel region 1000c is to be formed is shown in FIG.
- the width is set to be larger than the width defined by the upper and lower points Pc2 and Pc3 of the surface portion 105cb (see FIG. 4) of the bank 105c. .
- the width is increased at a location where the inclination angle is to be increased.
- bank material layers 1051a, 1051b, 1051c, and 1051d remain at locations corresponding to the openings 504a, 504b, 504c, and 504d, respectively.
- the inclination angles of the respective surface portions of the bank material layers 1051a, 1051b, 1051c, and 1051d are uniform.
- baking is not performed at this time.
- a mask 505 is disposed thereabove.
- the mask 505 is provided with an opening 505c only in a portion (surface portion 105cb of the bank 105c) where the inclination angle is to be increased among portions corresponding to the surface portions of the banks 105a, 105b, 105c, and 105d to be formed. .
- Banks 105a, 105b, 105c, and 105d as shown in FIG. 15B can be formed by performing the second exposure / development with the mask 505 disposed and then baking.
- the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
- the inclination angle of the bank side surface formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.
- the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.
- a horizontal axis shows a horizontal direction and a vertical axis
- shaft shows a height direction.
- Embodiment 2 The configuration of the display device according to Embodiment 2 will be described with reference to FIGS.
- the display panel 30 is formed on a TFT substrate (hereinafter simply referred to as “substrate”) 101, similarly to the display panel 10 according to the first embodiment.
- An anode electrode 102 is formed corresponding to each of the subpixels 300 a, 300 b, and 300 c, and an electrode coating layer 103 and a hole injection / transport layer 104 are sequentially stacked on the anode electrode 102.
- each subpixel 300a, 300b, and 300c an organic light emitting layer, an electron injection layer, a cathode electrode, and a sealing layer are sequentially stacked in a region partitioned by the banks 305a, 305b, 305c, and 305d. (The illustration is omitted in FIG. 17).
- the display panel 30 according to the present embodiment is the same as the display panel 10 according to the first embodiment in that one pixel unit is configured by combining the sub-pixels 300a, 300b, and 300c. However, in the display panel 30 according to the present embodiment, the non-pixel portions 300d and 300e are provided between the adjacent pixel portions.
- an electrode (bus bar) 302 made of the same material as the anode electrode 102 and an electrode coating layer 303 covering the same are provided in the non-pixel portions 300d and 300e.
- a hole injecting and transporting layer 104 is extended on the electrode covering layer 303, and the cathode electrode 108 is formed on the hole injecting and transporting layer 104.
- the electrode 302 and the cathode electrode 108 are electrically connected. Connected.
- the organic light emitting layer 106 is not formed in the non-pixel portions 300d and 300e. By adopting such a configuration, it is possible to reduce the electrical resistance of the cathode electrode 108 made of ITO or the like, and to suppress a voltage drop.
- the surface 104 forms angles ⁇ 3aa, ⁇ 3ba, ⁇ 3bb, ⁇ 3cb, ⁇ 3cc, and ⁇ 3dc, respectively.
- angles ⁇ 3aa, ⁇ 3ba, ⁇ 3bb, ⁇ 3cb, ⁇ 3cc, and ⁇ 3dc satisfy the relationship represented by the following equations.
- an ink 3060a containing an organic light-emitting material is applied to the opening (sub-pixel planned region 3000a) partitioned by the bank 305a and the bank 305b using an inkjet method or the like.
- the ink concentration is not applied to the left side of the bank 305a and the right side of the bank 305b, so the vapor concentration distribution is substantially uniform.
- ink 3060b containing an organic light-emitting material is applied to the opening (sub-pixel planned region 3000b) partitioned by the bank 305b and the bank 305c, using the inkjet method or the like.
- the inclination angle ⁇ 3cb (see FIG. 17) of the surface portion 305cb in the bank 305c is set so as to satisfy the relationship of [Expression 7] (relatively large). Therefore, the pinning position Q3cb of the ink 3060b with respect to the surface portion 305cb of the bank 305c is higher than the other pinning positions Q3aa, Q3ba, Q3bb.
- the ink 3060c containing the organic light emitting material is applied to the opening (subpixel planned region 3000c) partitioned by the bank 305c and the bank 305d using the same ink jet method or the like.
- the non-pixel portion 3000d to which ink is not applied exists on the right side of the sub-pixel planned area 3000c, the vapor concentration on the right side of the sub-pixel 3000c is lower than that on the left side. Therefore, also for the bank 305d, the inclination angle ⁇ 3dc (see FIG. 17) of the surface portion 305dc on the side of the planned sub-pixel region 3000c (see FIG.
- the ink is dried, and then the display panel 30 is formed by sequentially stacking an electron injection layer, a cathode electrode, a sealing layer, and the like.
- the organic light-emitting layers in all the subpixels 300a, 300b, and 300c are provided.
- the uneven thickness can be suppressed, and the display panel 30 having high light emission characteristics can be obtained.
- the bank 105, 105a to 105d, 105x, 105y, and 305a to 305e are schematically shown as being flat. May not necessarily be a plane.
- FIG. 19 (a) when the bank 605, and the surface between the point P 61 to a point P 62, and the surface between the point P 62 to a point P 63, intersects It will be.
- pinning position Qy1 during inking resides on the surface between the point P 62 to a point P 63.
- the inclination angle ⁇ y2 face portion which is formed when subtracting the imaginary straight line L 1 which passes through the point P 62 is important in relation to the pinning position.
- the angle ⁇ y1 in the formation of the bank 605, by controlling the angle ⁇ y1 the surface and forms between the point P 61 of the hole injection transport layer 104 and the bank 605 is an underlying layer to the point P 62, the angle ⁇ y2 also controlled Therefore, it is possible to obtain the above effect by controlling the inclination angle ⁇ y1 substantially. That is, when the relative angle ⁇ y1 shown in FIG. 19 (a), to form the bank 705 angle ⁇ y11 large surface between the point P 71 to a point P 72 is (FIG. 19 (b)), 19 (b), the angle ⁇ y12 the surface between the point P 72 to a point P 73 with respect to the virtual straight line L 2 also increases with respect to the angle ⁇ y2 in FIG 19 (a).
- the application area of the above configuration in the display panels 10 and 30 is not limited, but the above configuration is applied to the entire area in the display panel.
- the above configuration can also be applied to a limited area.
- the display panel 10 in the direction along the surface, the display panel 10 can be formally divided into a region 10a disposed in the center and a region 10b disposed in the vicinity thereof.
- the region 10a is connected to the source electrode or drain electrode of the TFT layer in which the anode electrode is formed, and contributes to light emission.
- the region 10b has the anode electrode below it.
- the region including the peripheral region 10a2 and the region 10b may be a pixel portion of about 0.5 [%] to several [%] (for example, 1 [%]) of the outer peripheral portion of the panel. This is because the film thickness variation of the organic light emitting layer in the case of not adjusting the tilt angle in the bank surface portion is taken into consideration.
- each configuration as an example is adopted in order to easily understand the configuration, operation, and effect of the present invention.
- it is not limited to the said form.
- the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example.
- a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.
- the cathode electrode 108 When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.
- the specific appearance of the display device 1 is not shown. However, for example, a part of the system shown in FIG. 21 can be used.
- the organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.
- the banks 105, 105a to 105d, 105x, 105y, 305a to 305e, 605, and 705 are so-called line banks as shown in FIG.
- the display panel 80 may be configured using a pixel bank 805 including a bank element 805a extending in the Y-axis direction and a bank element 805b extending in the X-axis direction as shown in FIG. it can.
- the adjustment of the inclination angle of the bank surface portion adopted in the first and second embodiments and the first and second modifications is based on the vapor concentration distribution in the ink application process and the drying process related to the formation of the organic light emitting layer at the time of manufacture. It can be appropriately changed according to individual. For example, due to the structure of the drying device, etc., when the flow of vapor during drying of the ink is in the direction from the outer periphery of the panel toward the center of the panel, it corresponds to the location where the film thickness of the organic light emitting layer increases. Then, the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.
- Embodiments 1 and 2 and Modifications 1 and 2 there is no distinction in the setting of the inclination angle in the bank surface portion for each emission color (red, green, and blue), but organic light emission is performed according to the emission color. Since it is conceivable that the characteristics of the ink including the material change, in this case, the inclination angle of the surface portion of the corresponding bank can be defined according to the ink characteristics of each emission color.
- the present invention is useful for realizing an organic light-emitting panel and an organic display device having little luminance unevenness and high image quality performance.
- Subpixel planned areas 1050, 1051a, 1051b, 1051e, 1051f. Bank material layers 1060a to 1060c, 1060x, 1060y, 3060a to 3060c. Ink 3000d, 3000e.
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Abstract
Description
本発明の一態様に係る有機発光パネルは、複数の画素部が配列されてなる有機発光パネルであって、複数の画素部の各画素部が、互いに発光色が異なり、順に配列された複数の発光部を有する。各発光部は、第1電極を含む下地層と、下地層に対向して設けられ、発光色ごとに対応した有機発光材料を含むインクが塗布されて形成された有機発光層と、有機発光層に対して下地層と反対側に形成された第2電極とを含む。
以下では、本発明を実施するための形態の一例について、図面を参酌しながら説明する。
本発明者は、[背景技術]において記載した有機発光パネルおよびこれを備える有機表示装置に関し、鋭意研究の結果、次のような知見を得た。
1.表示装置1の概略構成
本実施の形態に係る表示装置1の全体構成について、図1を用い説明する。
表示パネル10の構成について、図2を用い説明する。なお、本実施の形態に係る表示パネル10は、一例として、トップエミッション型の有機発光パネルを採用し、赤(R)、緑(G)、青(B)の何れか発光色を有する有機発光層を備える複数の画素部がマトリクス状に配置され構成されているが、図2では、一の画素部における一つのサブピクセル100を抜き出して描いている。
基板101は、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、又はアルミナ等の絶縁性材料をベースとして形成されている。そして、基板101には、図示を省略しているが、TFT層およびパッシベーション膜、さらには、層間絶縁膜などが積層形成されている。
アノード電極102は、導電性材料からなる単層、あるいは複数の層が積層されてなる積層体から構成されており、例えば、Al(アルミニウム)やこれを含む合金、Ag(銀)、APC(銀、パラジウム、銅の合金)、ARA(銀、ルビジウム、金の合金)、MoCr(モリブデンとクロムの合金)、NiCr(ニッケルとクロムの合金)などを用い形成されている。なお、本実施の形態のように、トップエミッション型の場合には、高反射性の材料で形成されていることが好ましい。
電極被覆層103は、例えば、ITO(酸化インジウムスズ)を用い形成されており、アノード電極102のZ軸方向上部の表面の少なくとも一部を被覆する。
ホール注入輸送層104は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)などの酸化物、あるいは、PEDOT(ポリチオフェンとポリスチレンスルホン酸との混合物)などの導電性ポリマー材料からなる層である。上記の内、酸化金属からなるホール注入輸送層104は、ホールを安定的に、またはホールの生成を補助して、有機発光層106に対しホールを注入および輸送する機能を有し、大きな仕事関数を有する。
バンク(隔壁)105は、樹脂等の有機材料で形成されており絶縁性を有する。バンク105の形成に用いる有機材料の例としては、アクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等があげられる。そして、バンク105は、有機溶剤耐性を有することが好ましい。
有機発光層106は、アノード電極102から注入されたホールと、カソード電極108から注入された電子とが再結合されることにより励起状態が生成され発光する機能を有する。有機発光層106の形成に用いる材料は、湿式印刷法を用い製膜できる発光性の有機材料を用いることが必要である。
電子注入層107は、カソード電極108から注入された電子を有機発光層106へ輸送する機能を有し、例えば、バリウム、フタロシアニン、フッ化リチウム、あるいはこれらの組み合わせで形成されることが好ましい。
カソード電極108は、例えば、ITO、IZO(酸化インジウム亜鉛)などで形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。光透過性については、透過率が80[%]以上とすることが好ましい。
封止層109は、有機発光層106などが水分に晒されたり、空気に晒されたりすることを抑制する機能を有し、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)などの材料を用い形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。
図3に示すように、本実施の形態に係る表示パネル10では、一例としてライン状のバンク105を採用している。具体的には、バンク105は、各々がY軸方向に延伸形成され、X軸方向において隣接する画素部100間を区画している。そして、サブピクセル100は、バンク105により区画された領域ごとに、発光色が異なるように形成されており、例えば、赤色(R)、緑色(G)、青色(B)の各発光色の3つのサブピクセルの組み合わせを以って、一つの画素部が構成されている。
領域ごとのバンク105の構成について、図4を用い説明する。なお、図4は、図1における表示パネル10をA-A'断面で切断し、その一部を模式化した断面端面図である。
なお、本実施の形態では、それぞれの角度θaa,θba,θbb,θcb,θcc,θdcを、上記[数1]の関係を満たし、且つ、次のような範囲で設定することが望ましい。
[数3] 35[°]<θcb<45[°]
5.バンク105における側面部の傾斜角度θと有機発光層106の膜厚との関係
バンク105における面部の傾斜角度θと有機発光層106の膜厚との関係について、図5および図6を用い説明する。なお、図5では、一つのサブピクセルの構造を模式的に描いている。
各バンク105x,105yで区画された開口部に有機発光材料を含むインク1060x,1060yを滴下(塗布)すると、各ピンニング位置Px,Pyの高さHx,Hyが次のような関係となる。
図5(c)に示すように、インク1060xを乾燥させると、ピンニング位置Pxの高さHxが相対的に低いことに起因して、形成される有機発光層106xでは、サブピクセルの中央部分が盛り上がり、その膜厚が厚みTxとなる。
上記の関係を図6に纏めて示す。図6に示すように、バンク105の面部における傾斜角度(テーパ角)θを小さくすれば、ピンニング位置の高さHが低くなり、結果的に得られる有機発光層106の膜厚Tが厚くなる。逆に、バンク105の面部における傾斜角度(テーパ角)θを大きくすれば、ピンニング位置の高さHが高くなり、結果的に得られる有機発光層106の膜厚Tが薄くなる。
本実施の形態に係る表示パネル10の製造方法について、図9、図10および図11を用い、特徴となる部分を説明する。なお、以下で説明を省略する製造工程については、従来技術として提案されている種々の工程を採用することが可能である。
インクの塗布工程と乾燥工程との関係について、図12を用い説明する。
図4に示すように、本実施の形態に係る表示装置1の表示パネル10では、バンク105cにおけるサブピクセル100c側の面部105cbの傾斜角度θcbが、他の面部105aa,105ba,105bb,105cc,105dcの各傾斜角度θaa,θba,θbb,θcc,θdc大きく設定されている。このため、図11(a)に示すように、サブピクセル予定領域1000bにインク1060bを塗布した際に、そのピンニング位置Qcbが、他のピンニング位置Qaa,Qba,Qbbよりも高くなる。
次に、図13を用い、表示装置1の製造方法の変形例1について説明する。図13は、図9(c)から図10(a)に示す工程に対応する工程を示す。
次に、図14および図15を用い、表示装置1の製造方法の変形例2について説明する。図14および図15は、図9(c)から図10(b)に示す工程に対応する工程を示す。
上記実施の形態および変形例1,2に係る各製造方法について、具体例を以って形成後のバンク形状について検証を行った。その結果について、図16を用い説明する。
実施の形態2に係る表示装置の構成について、図17および図18を用い説明する。
図17に示すように、表示パネル30は、上記実施の形態1に係る表示パネル10と同様に、TFT基板(以下では、単に「基板」と記載する。)101上に、サブピクセル300a,300b,300cの各々に対応して、アノード電極102が形成されており、アノード電極102上に、電極被覆層103およびホール注入輸送層104が順に積層形成されている。
[数8] θ3dc>θ3aa=θ3ba=θ3bb=θ3cc
なお、本実施の形態では、それぞれの角度θ3aa,θ3ba,θ3bb,θ3cb,θ3cc,θ3dcを次のような範囲で設定することが望ましい。
[数10] 35[°]<θ3cb<45[°]
[数11] 35[°]<θ3dc<45[°]
上記[数7]、[数8]、[数9]、[数10]、[数11]の関係でバンク305a,305b,305c,305dの各々の面部305aa,305ba,305bb,305cb,305cc,305dcの傾斜角度θ3aa,θ3ba,θ3bb,θ3cb,θ3cc,θ3dcを規定するのは、隣り合う画素部と画素部との間に非画素部300d,300eを配することによるものである。これについて、インク3060a,3060b,3060cの塗布との関係を交えながら次に説明する。
表示パネル30の製造方法について、特徴となる工程を抜き出して、図18を用い説明する。なお、図18に示す工程以外の工程については、上記実施の形態1と同様である。
先ず、上記実施の形態1,2および変形例1,2では、バンク105,105a~105d,105x,105y,305a~305eの各面部が平面であると模式的に示したが、バンクの面部については、必ずしも平面でなくてもよい。例えば、図19(a)に示すように、バンク605の場合には、ポイントP61からポイントP62までの間の面と、ポイントP62からポイントP63までの間の面とが、交差することになる。この場合、インク塗布時におけるピンニング位置Qy1は、ポイントP62からポイントP63までの間の面に存する。そして、ポイントP62を通る仮想直線L1を引いたときに形成される面部の傾斜角度θy2が、ピンニング位置との関係で重要となる。
10,30,80.表示パネル
10a1.発光中央領域
10a2.発光周辺領域
10b.ダミー領域
20.駆動制御部
21~24.駆動回路
25.制御回路
100,100a~100c,300a~300c.サブピクセル
101.基板
102.アノード電極
103.電極被覆層
104.ホール注入層
105,105a~105d,105x,105y,305a~305e,605,705,805.バンク
106,106a,106c,106x,106y.有機発光層
107.電子注入層
108.カソード電極
109.封止層
300d,300e.非画素部
501~505.マスク
1000a~1000c,3000a~3000c.サブピクセル予定領域
1050,1051a,1051b,1051e,1051f.バンク材料層
1060a~1060c,1060x,1060y,3060a~3060c.インク
3000d,3000e.非画素予定領域
Claims (19)
- 複数の画素部が配列されてなる有機発光パネルであって、
前記複数の画素部の各画素部は、互いに発光色が異なり、順に配列された複数の発光部を有し、
各発光部は、第1電極を含む下地層と、前記下地層に対向して設けられ、発光色ごとに対応した有機発光材料を含むインクが塗布されて形成された有機発光層と、前記有機発光層に対して前記下地層と反対側に形成された第2電極とを含み、
同一画素部内における前記複数の発光部は、一方側から他方側に向け、各発光色に対応する前記インクが順番に塗布され、前記有機発光層が形成されてなり、一方側に位置し,対応するインクが第1巡目に塗布される第1発光部と、中央側に位置し,対応するインクが第2巡目に塗布される第2発光部と、他方側に位置し,対応するインクが第3巡目に塗布される第3発光部とを少なくとも有し、
前記下地層の上方には、前記複数の発光部のうちの隣り合う発光部を区画し、各発光部を規定する複数の隔壁が設けられ、
前記複数の画素部は、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しく、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、かつ、前記第3発光部側に位置する隔壁の面部の傾斜角度が、前記第1発光部側に位置する隔壁の面部の傾斜角度よりも大きい、
画素部を含む
ことを特徴とする有機発光パネル。 - 前記複数の画素部は、連続して隣り合うように形成されており、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しい、
請求項1記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項2記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項3記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
ことを特徴とする請求項4記載の有機発光パネル。 - 前記複数の画素部の隣り合う画素部の各間には、非画素部が形成され、
前記画素部と前記非画素部との間には、画素部と非画素部を区画する隔壁が形成されており、
各画素部では、
前記第3発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が異なり、前記非画素部側に位置する隔壁の面部の傾斜角度が、前記第2発光部側に位置する隔壁の面部の傾斜角度よりも大きい、
請求項1記載の有機発光パネル。
- 前記非画素部は、前記有機発光層を含むことなく、前記第2電極と、前記第1電極と同じ材料を以って構成された第3電極とを含み、前記第2電極と前記第3電極とが電気的に接続される、
請求項6記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度が、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きく、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度が、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きい、
請求項6記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度と、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度とが等しい、
請求項8記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項6記載の有機発光パネル。 - 前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度と等しい、
請求項10記載の有機発光パネル。 - 前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記非画素部側に位置する隔壁の対向する面部の傾斜角度は、35度以上45度以下であり、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第1発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第3発光部を規定する隣り合う2つの隔壁における、前記第2発光部側に位置する隔壁の対向する面部の傾斜角度は、25度以上35度以下であり、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度は、25度以上35度以下である、
請求項11記載の有機発光パネル。 - 前記傾斜角度は、前記隔壁における前記対向する各面部と、前記隔壁が形成されている前記下地層の上面とがなす角度である、請求項1記載の有機発光パネル。
- 請求項1から請求項13の何れかに記載の有機発光パネルを備えた有機表示装置。
- 複数の画素部が配列されてなる有機発光パネルの製造方法であって、
基板上に、第1電極を含む下地層を形成する第1工程と、
前記下地層の上に、感光性レジスト材料を積層する第2工程と、
前記積層された感光性レジスト材料をマスク露光してパターニングすることにより、各画素部ごとに複数の発光部に対応する複数の開口を形成するとともに、隣接する前記発光部を区画して各発光部を規定する複数の隔壁を形成する第3工程と、
前記複数の開口のそれぞれに対して、有機発光材料を含むインクを滴下して乾燥させ、有機発光層を形成する第4工程と、
前記有機発光層の上方に、第2電極を形成する第5工程と、
を有し、
前記第3工程では、
各画素部ごとに、一方側に位置する第1発光部に対応する第1開口と、中央側に位置する第2発光部に対応する第2開口と、他方側に位置する第3発光部に対応する第3開口とを形成し、
さらに、
前記第1発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度を等しく形成するとともに、
前記第2発光部および前記第3発光部のうち、少なくとも前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度を異ならせ、且つ、前記第3発光部側に位置する隔壁の面部の傾斜角度を前記第1発光部側に位置する隔壁の面部の傾斜角度よりも大きくなるように形成し、
前記第4工程では、
各画素部ごとに、各発光色に対応する前記インクを、前記第1開口、前記第2開口、前記第3開口の順番に滴下し、前記有機発光層を形成する、
ことを特徴とする有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部に相当する部分への露光量を、前記第1発光部側に位置する隔壁の面部に相当する部分への露光量よりも大きくすることにより、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部の傾斜角度を、前記第1発光部側に位置する隔壁の面部の傾斜角度よりも大きくする、
請求項15記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部に相当する部分への光の透過率が、前記第1発光部側に位置する隔壁の面部に相当する部分への光の透過率よりも小さくなるように、それぞれの面部に相当する部分に対して互いに異なるマスクを用いることにより、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部の傾斜角度を、前記第1発光部側に位置する隔壁の面部の傾斜角度よりも大きくする、
請求項15記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料を露光して現像した後、前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部に相当する部分に対し、露光処理を追加して行うことにより、
前記第2発光部を規定する隣り合う2つの隔壁における、前記第3発光部側に位置する隔壁の面部の傾斜角度を、前記第1発光部側に位置する隔壁の面部の傾斜角度よりも大きくする、
請求項15記載の有機発光パネルの製造方法。 - 請求項15から請求項18の何れかに記載の製造方法により得られた有機発光パネルを備えた有機表示装置。
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