JP2009117761A5 - - Google Patents

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Publication number
JP2009117761A5
JP2009117761A5 JP2007292079A JP2007292079A JP2009117761A5 JP 2009117761 A5 JP2009117761 A5 JP 2009117761A5 JP 2007292079 A JP2007292079 A JP 2007292079A JP 2007292079 A JP2007292079 A JP 2007292079A JP 2009117761 A5 JP2009117761 A5 JP 2009117761A5
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JP
Japan
Prior art keywords
semiconductor device
pad
wiring
dummy pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007292079A
Other languages
English (en)
Japanese (ja)
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JP5291917B2 (ja
JP2009117761A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007292079A external-priority patent/JP5291917B2/ja
Priority to JP2007292079A priority Critical patent/JP5291917B2/ja
Priority to TW097135640A priority patent/TWI453842B/zh
Priority to TW103128729A priority patent/TWI552239B/zh
Priority to US12/239,810 priority patent/US8552552B2/en
Priority to CN2008101707993A priority patent/CN101431058B/zh
Publication of JP2009117761A publication Critical patent/JP2009117761A/ja
Publication of JP2009117761A5 publication Critical patent/JP2009117761A5/ja
Priority to US13/613,602 priority patent/US8552555B2/en
Priority to US14/012,937 priority patent/US8785318B2/en
Application granted granted Critical
Publication of JP5291917B2 publication Critical patent/JP5291917B2/ja
Priority to US14/320,686 priority patent/US9508630B2/en
Priority to US14/953,382 priority patent/US9484286B2/en
Priority to US14/953,390 priority patent/US9484287B2/en
Priority to US14/994,016 priority patent/US20160126264A1/en
Priority to US14/993,981 priority patent/US20160126203A1/en
Priority to US15/264,588 priority patent/US9748191B2/en
Priority to US15/674,406 priority patent/US10204878B2/en
Priority to US16/267,307 priority patent/US10741517B2/en
Priority to US16/920,625 priority patent/US11239191B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007292079A 2007-11-09 2007-11-09 半導体装置およびその製造方法 Active JP5291917B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2007292079A JP5291917B2 (ja) 2007-11-09 2007-11-09 半導体装置およびその製造方法
TW097135640A TWI453842B (zh) 2007-11-09 2008-09-17 Semiconductor device and manufacturing method thereof
TW103128729A TWI552239B (zh) 2007-11-09 2008-09-17 Semiconductor device
US12/239,810 US8552552B2 (en) 2007-11-09 2008-09-28 Semiconductor device and a method of manufacturing the same
CN2008101707993A CN101431058B (zh) 2007-11-09 2008-10-29 半导体器件及其制造方法
US13/613,602 US8552555B2 (en) 2007-11-09 2012-09-13 Semiconductor device and a method of manufacturing the same
US14/012,937 US8785318B2 (en) 2007-11-09 2013-08-28 Semiconductor device and a method of manufacturing the same
US14/320,686 US9508630B2 (en) 2007-11-09 2014-07-01 Semiconductor device and a method of manufacturing the same
US14/953,382 US9484286B2 (en) 2007-11-09 2015-11-29 Semiconductor device and a method of manufacturing the same
US14/953,390 US9484287B2 (en) 2007-11-09 2015-11-29 Semiconductor device and a method of manufacturing the same
US14/994,016 US20160126264A1 (en) 2007-11-09 2016-01-12 Semiconductor device and a method of manufacturing the same
US14/993,981 US20160126203A1 (en) 2007-11-09 2016-01-12 Semiconductor device and a method of manufacturing the same
US15/264,588 US9748191B2 (en) 2007-11-09 2016-09-13 Semiconductor device and a method of manufacturing the same
US15/674,406 US10204878B2 (en) 2007-11-09 2017-08-10 Semiconductor device and a method of manufacturing the same
US16/267,307 US10741517B2 (en) 2007-11-09 2019-02-04 Semiconductor device and a method of manufacturing the same
US16/920,625 US11239191B2 (en) 2007-11-09 2020-07-03 Semiconductor device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007292079A JP5291917B2 (ja) 2007-11-09 2007-11-09 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012237427A Division JP5466280B2 (ja) 2012-10-29 2012-10-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2009117761A JP2009117761A (ja) 2009-05-28
JP2009117761A5 true JP2009117761A5 (enExample) 2010-11-25
JP5291917B2 JP5291917B2 (ja) 2013-09-18

Family

ID=40622952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007292079A Active JP5291917B2 (ja) 2007-11-09 2007-11-09 半導体装置およびその製造方法

Country Status (4)

Country Link
US (12) US8552552B2 (enExample)
JP (1) JP5291917B2 (enExample)
CN (1) CN101431058B (enExample)
TW (2) TWI453842B (enExample)

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JP5415710B2 (ja) * 2008-04-10 2014-02-12 ルネサスエレクトロニクス株式会社 半導体装置
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JP5315186B2 (ja) 2009-09-18 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2013033775A (ja) * 2009-12-03 2013-02-14 Panasonic Corp 半導体集積回路及びそれを備えた半導体装置、並びに電子機器
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US8434041B2 (en) * 2011-01-10 2013-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Increasing dielectric strength by optimizing dummy metal distribution
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JP5995518B2 (ja) * 2012-05-11 2016-09-21 ローム株式会社 半導体装置および半導体装置の製造方法
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JP6180801B2 (ja) * 2013-06-07 2017-08-16 ルネサスエレクトロニクス株式会社 半導体装置
JP6334851B2 (ja) * 2013-06-07 2018-05-30 シナプティクス・ジャパン合同会社 半導体装置、表示デバイスモジュール、及び、表示デバイスモジュールの製造方法
JP2015032661A (ja) * 2013-08-01 2015-02-16 ルネサスエレクトロニクス株式会社 半導体装置とその製造方法および半導体装置の実装方法
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JP2015079848A (ja) * 2013-10-17 2015-04-23 シナプティクス・ディスプレイ・デバイス株式会社 表示装置駆動用半導体集積回路装置
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US9508637B2 (en) 2014-01-06 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Protrusion bump pads for bond-on-trace processing
US9418928B2 (en) 2014-01-06 2016-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Protrusion bump pads for bond-on-trace processing
US9305890B2 (en) 2014-01-15 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Package having substrate with embedded metal trace overlapped by landing pad
KR102398451B1 (ko) * 2015-01-13 2022-05-16 데쿠세리아루즈 가부시키가이샤 범프 형성용 필름, 반도체 장치 및 그의 제조 방법 및 접속 구조체
WO2016114318A1 (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 多層基板
KR102410525B1 (ko) * 2015-04-14 2022-06-20 삼성디스플레이 주식회사 박막 트랜지스터 기판, 이를 구비한 디스플레이 장치, 박막 트랜지스터 기판 제조방법 및 디스플레이 장치 제조방법
JP6503286B2 (ja) * 2015-12-24 2019-04-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体ウェハ
JP2017116798A (ja) * 2015-12-25 2017-06-29 株式会社ジャパンディスプレイ 表示装置、表示装置の製造方法、及びドライバｉｃ
CN105514075B (zh) * 2015-12-31 2019-05-17 昆山国显光电有限公司 显示装置绑定结构
KR102487061B1 (ko) * 2016-06-30 2023-01-12 삼성디스플레이 주식회사 표시 장치
JP6106794B1 (ja) * 2016-08-05 2017-04-05 サーパス工業株式会社 流体機器
TWI587043B (zh) * 2017-01-25 2017-06-11 友達光電股份有限公司 畫素結構及其顯示面板
CN107807479B (zh) * 2017-11-15 2021-01-22 京东方（河北）移动显示技术有限公司 阵列基板和显示面板
EP4425708A3 (en) 2017-11-29 2024-11-27 Dai Nippon Printing Co., Ltd. Wiring board and method for manufacturing wiring board
CN109920787B (zh) * 2017-12-12 2021-05-25 中芯国际集成电路制造(北京)有限公司 互连结构的设计方法、装置及制造方法
KR102481468B1 (ko) * 2018-01-04 2022-12-26 삼성디스플레이 주식회사 표시 장치
CN110557887B (zh) * 2018-05-31 2021-10-12 京东方科技集团股份有限公司 电路对位组件及显示装置
CN108919571B (zh) * 2018-07-11 2021-07-27 业成科技（成都）有限公司 显示面板
JP6705479B2 (ja) * 2018-09-12 2020-06-03 日亜化学工業株式会社 光源装置の製造方法
US11259406B2 (en) * 2018-11-21 2022-02-22 Synaptics Incorporated Flexible connector for a display device
KR20210018700A (ko) * 2019-08-09 2021-02-18 삼성디스플레이 주식회사 접착 부재 및 이를 포함한 표시장치
KR102891620B1 (ko) * 2019-09-25 2025-11-28 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
CN110579917B (zh) * 2019-10-15 2022-03-01 上海中航光电子有限公司 显示模组及显示装置
CN113496891B (zh) * 2020-04-03 2023-03-14 重庆超硅半导体有限公司 一种集成电路硅片表面氧化膜自适应均匀腐蚀方法
CN114442353A (zh) * 2020-10-30 2022-05-06 京东方科技集团股份有限公司 驱动背板及其制备方法和显示面板
CN112710928B (zh) * 2020-12-10 2023-02-21 国网宁夏电力有限公司电力科学研究院 基于自相关性分析的直流局部放电波形去干扰方法及系统
CN114823351B (zh) * 2021-01-28 2025-05-16 欣兴电子股份有限公司 金属凸块结构及其制作方法与驱动基板
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CN115714161A (zh) * 2022-02-25 2023-02-24 友达光电股份有限公司 用于显示装置的电路板结构
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