CN107807479B - 阵列基板和显示面板 - Google Patents
阵列基板和显示面板 Download PDFInfo
- Publication number
- CN107807479B CN107807479B CN201711131501.3A CN201711131501A CN107807479B CN 107807479 B CN107807479 B CN 107807479B CN 201711131501 A CN201711131501 A CN 201711131501A CN 107807479 B CN107807479 B CN 107807479B
- Authority
- CN
- China
- Prior art keywords
- binding
- region
- array substrate
- positions
- vacancy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 238000012163 sequencing technique Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
- H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
- H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711131501.3A CN107807479B (zh) | 2017-11-15 | 2017-11-15 | 阵列基板和显示面板 |
US16/150,497 US10707241B2 (en) | 2017-11-15 | 2018-10-03 | Array substrate and display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711131501.3A CN107807479B (zh) | 2017-11-15 | 2017-11-15 | 阵列基板和显示面板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107807479A CN107807479A (zh) | 2018-03-16 |
CN107807479B true CN107807479B (zh) | 2021-01-22 |
Family
ID=61580244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711131501.3A Active CN107807479B (zh) | 2017-11-15 | 2017-11-15 | 阵列基板和显示面板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10707241B2 (zh) |
CN (1) | CN107807479B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102547235B1 (ko) * | 2018-04-20 | 2023-06-23 | 삼성디스플레이 주식회사 | 표시 장치 |
CN209882200U (zh) * | 2018-11-09 | 2019-12-31 | 重庆先进光电显示技术研究院 | 印刷电路板及其显示器连接结构 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070048376A (ko) * | 2005-11-04 | 2007-05-09 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 |
CN101000413A (zh) * | 2006-01-13 | 2007-07-18 | 三星电子株式会社 | 液晶显示器及其形成方法和薄膜晶体管基板 |
CN101521984A (zh) * | 2008-02-29 | 2009-09-02 | 中兴通讯股份有限公司 | 降低金手指配合推力的方法和印刷电路板 |
KR20110005573A (ko) * | 2009-07-10 | 2011-01-18 | 엘지디스플레이 주식회사 | 액정 표시장치 |
CN203151861U (zh) * | 2013-01-07 | 2013-08-21 | 天之域电子工业(厦门)有限公司 | 一种柔性电路板结构 |
CN204335152U (zh) * | 2014-11-27 | 2015-05-13 | 武汉天马微电子有限公司 | 一种柔性印刷电路板及显示装置 |
CN104661430A (zh) * | 2015-03-17 | 2015-05-27 | 京东方科技集团股份有限公司 | 一种对位标识、电路板和显示装置 |
US9575386B2 (en) * | 2013-01-25 | 2017-02-21 | Samsung Display Co., Ltd. | Thin film transistor substrate, method of manufacturing the same and display device having the same |
CN206353887U (zh) * | 2016-12-16 | 2017-07-25 | 昆山意力电路世界有限公司 | 一种柔性高密度隔段式高对准金手指线路板 |
CN107015407A (zh) * | 2015-12-03 | 2017-08-04 | 三星显示有限公司 | 具有虚设端子的显示装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI300543B (en) * | 2004-06-01 | 2008-09-01 | Au Optronics Corp | Liquid crystal display panel having a cell test structure and method for making the same |
TWI302290B (en) * | 2005-08-17 | 2008-10-21 | Au Optronics Corp | Structure for circuit assembly |
CN100463166C (zh) * | 2005-11-18 | 2009-02-18 | 鸿富锦精密工业(深圳)有限公司 | 一种芯片 |
JP5291917B2 (ja) * | 2007-11-09 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
TWI442360B (zh) * | 2010-10-28 | 2014-06-21 | Au Optronics Corp | 顯示器及其接合阻抗的檢測系統以及檢測方法 |
US9750140B2 (en) * | 2014-03-14 | 2017-08-29 | Innolux Corporation | Display device |
US9570365B2 (en) * | 2014-03-14 | 2017-02-14 | Innolux Corporation | Display device and test pad thereof |
-
2017
- 2017-11-15 CN CN201711131501.3A patent/CN107807479B/zh active Active
-
2018
- 2018-10-03 US US16/150,497 patent/US10707241B2/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070048376A (ko) * | 2005-11-04 | 2007-05-09 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 |
CN101000413A (zh) * | 2006-01-13 | 2007-07-18 | 三星电子株式会社 | 液晶显示器及其形成方法和薄膜晶体管基板 |
CN101521984A (zh) * | 2008-02-29 | 2009-09-02 | 中兴通讯股份有限公司 | 降低金手指配合推力的方法和印刷电路板 |
KR20110005573A (ko) * | 2009-07-10 | 2011-01-18 | 엘지디스플레이 주식회사 | 액정 표시장치 |
CN203151861U (zh) * | 2013-01-07 | 2013-08-21 | 天之域电子工业(厦门)有限公司 | 一种柔性电路板结构 |
US9575386B2 (en) * | 2013-01-25 | 2017-02-21 | Samsung Display Co., Ltd. | Thin film transistor substrate, method of manufacturing the same and display device having the same |
CN204335152U (zh) * | 2014-11-27 | 2015-05-13 | 武汉天马微电子有限公司 | 一种柔性印刷电路板及显示装置 |
CN104661430A (zh) * | 2015-03-17 | 2015-05-27 | 京东方科技集团股份有限公司 | 一种对位标识、电路板和显示装置 |
CN107015407A (zh) * | 2015-12-03 | 2017-08-04 | 三星显示有限公司 | 具有虚设端子的显示装置 |
CN206353887U (zh) * | 2016-12-16 | 2017-07-25 | 昆山意力电路世界有限公司 | 一种柔性高密度隔段式高对准金手指线路板 |
Also Published As
Publication number | Publication date |
---|---|
US10707241B2 (en) | 2020-07-07 |
CN107807479A (zh) | 2018-03-16 |
US20190148408A1 (en) | 2019-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4260250B2 (ja) | 静電気保護回路を有する液晶表示装置及びこの回路を利用した表示検査方法 | |
US20210225216A1 (en) | Touch Display Panel, Test Method Thereof and Display Device | |
US9189117B2 (en) | Touch display device | |
DE102010042473B4 (de) | Flüssigkristall-Anzeigevorrichtung mit integrierter berührungsempfindlicher Tafel | |
US20230080422A1 (en) | Display panel with narrow lower border and electronic device | |
CN107807479B (zh) | 阵列基板和显示面板 | |
CN105607316A (zh) | 一种阵列基板母板和显示面板母板 | |
CN100426498C (zh) | 用于封装驱动集成电路的显示器件的基板 | |
US10620741B2 (en) | Integrated touch control display panel and integrated touch control display device comprising the same | |
CN1584719A (zh) | 液晶显示器 | |
US20190042047A1 (en) | Pixel array substrate | |
JP6257192B2 (ja) | アレイ基板およびその検査方法ならびに液晶表示装置 | |
CN111650793B (zh) | 显示面板及其阵列基板 | |
KR102443832B1 (ko) | 유기발광표시패널 및 이를 포함하는 유기발광표시장치 | |
CN103760728B (zh) | 一种阵列基板及其显示装置 | |
CN113345353A (zh) | 包括裂纹检测器的显示驱动电路和包括显示驱动电路的显示设备 | |
CN1940658A (zh) | 液晶显示器及其制造方法 | |
CN105158981B (zh) | 液晶显示面板和液晶显示装置 | |
CN103149713B (zh) | 阵列面板检测电路结构 | |
CN113721093B (zh) | 显示面板母板、显示面板母板的检测方法及系统 | |
EP3242156B1 (en) | Colour film substrate, display device and detection method therefor | |
CN103676243A (zh) | 一种阵列基板组件及其测量方法和显示装置 | |
CN104484068B (zh) | 一种具有触摸功能的嵌入式显示屏、终端及触摸检测方法 | |
CN105117073B (zh) | 一种触控显示面板和触控显示装置 | |
CN109102768B (zh) | 一种阵列基板母板及其检测方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230117 Address after: Room 518, No. 29, Taizhong Road, Wangtai Street Office, Huangdao District, Qingdao, Shandong 266425 Patentee after: Qingdao BOE Optoelectronic Technology Co.,Ltd. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Address before: 065500 north side of No.3 Road, west side of No.6 Road, development zone, Gu'an County, Langfang City, Hebei Province Patentee before: BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY Co.,Ltd. Patentee before: BOE TECHNOLOGY GROUP Co.,Ltd. |