JP2008544067A - 硬化触媒、組成物、電子機器及び関連する方法 - Google Patents

硬化触媒、組成物、電子機器及び関連する方法 Download PDF

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Publication number
JP2008544067A
JP2008544067A JP2008518211A JP2008518211A JP2008544067A JP 2008544067 A JP2008544067 A JP 2008544067A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008544067 A JP2008544067 A JP 2008544067A
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catalyst
composition
lewis acid
anhydride
resin
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JP2008544067A5 (https=
Inventor
スラウォミール ルビンスタイン
ジョン ロバート キャンベル
ライアン クリストファー ミルズ
サンディープ シュリカント トナピ
アナンス プラバクマール
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モーメンティブ・パフォーマンス・マテリアルズ・インク
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0237—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
    • B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
    • B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
  • Catalysts (AREA)
  • Polymerization Catalysts (AREA)
JP2008518211A 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法 Pending JP2008544067A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/167,847 US8048819B2 (en) 2005-06-23 2005-06-23 Cure catalyst, composition, electronic device and associated method
PCT/US2006/022587 WO2007001803A2 (en) 2005-06-23 2006-06-09 Cure catalyst, composition, electronic device and associated method

Publications (2)

Publication Number Publication Date
JP2008544067A true JP2008544067A (ja) 2008-12-04
JP2008544067A5 JP2008544067A5 (https=) 2013-10-24

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JP2008518211A Pending JP2008544067A (ja) 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法

Country Status (8)

Country Link
US (1) US8048819B2 (https=)
EP (2) EP1926554A2 (https=)
JP (1) JP2008544067A (https=)
KR (1) KR101391784B1 (https=)
CN (2) CN101257973B (https=)
BR (1) BRPI0612009A2 (https=)
RU (1) RU2008102366A (https=)
WO (1) WO2007001803A2 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
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JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100017712A (ko) * 2007-05-09 2010-02-16 다우 글로벌 테크놀로지스 인크. 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법
NO20075120L (no) * 2007-05-23 2008-11-24 Mi Llc Anvendelse av direkte epoksyemulsjoner for borehullstabilisering
CA2606537C (en) * 2007-05-23 2010-12-21 M-I Llc Use of invert epoxy emulsions for wellbore stabilization
CN101711262A (zh) * 2007-05-29 2010-05-19 陶氏环球技术公司 用于改进固化控制的异氰酸酯-环氧配方
BRPI0813210A2 (pt) 2007-08-02 2014-12-23 Dow Global Technologies Inc "processo para amortecer vibrações num artigo, compósito tendo propriedades de amortecimento melhoradas em temperaturas elevadas e composição termofixa tendo propriedades de amortecimento melhoradas em temperaturas elevadas"
KR20150063590A (ko) * 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
US20100240816A1 (en) * 2007-10-26 2010-09-23 Dow Global Technologies Inc. Epoxy resin composition containing isocyanurates for use in electrical laminates
BRPI0819013A2 (pt) * 2007-11-29 2015-05-05 Dow Global Technologies Inc Método para processar sob fusão um polimero de um composto aromático monovinílico e método para fabricar um artigo
KR101150311B1 (ko) * 2007-11-29 2012-06-11 다우 글로벌 테크놀로지스 엘엘씨 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형
EP2229416B1 (en) * 2008-01-08 2018-04-04 Dow Global Technologies LLC High tg epoxy systems for composite application
US7629203B2 (en) * 2008-03-31 2009-12-08 Intel Corporation Thermal interface material for combined reflow
EP2268697B1 (en) 2008-04-14 2014-01-29 Dow Global Technologies LLC Epoxy-imidazole catalysts useful for powder coating applications
KR20110059726A (ko) * 2008-08-28 2011-06-03 다우 글로벌 테크놀로지스 엘엘씨 인-함유 화합물 및 이를 포함하는 중합체 조성물
EP2389406A1 (en) 2008-12-16 2011-11-30 Dow Global Technologies LLC Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
SG172875A1 (en) * 2009-01-06 2011-08-29 Dow Global Technologies Llc Metal stabilizers for epoxy resins and dispersion process
CA2750703A1 (en) 2009-02-24 2010-09-02 Gary A. Hunter Curable epoxy resin compositions and cured products therefrom
US20120046425A1 (en) 2009-05-27 2012-02-23 Schroetz Markus Polymeric glycidyl ethers reactive diluents
US20120083564A1 (en) 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
EP2480586B1 (en) 2009-09-22 2014-11-12 Dow Global Technologies LLC Process for preparing episulfide resins
KR20120094163A (ko) 2009-09-25 2012-08-23 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체
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US8871892B2 (en) 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
CN102648227B (zh) 2009-12-02 2015-08-26 陶氏环球技术有限责任公司 环氧树脂组合物
EP2507285A2 (en) 2009-12-02 2012-10-10 Dow Global Technologies LLC Composite compositions
EP2507325B1 (en) 2009-12-02 2014-05-21 Dow Global Technologies LLC Coating compositions
US20120245306A1 (en) 2009-12-03 2012-09-27 Marks Maurice J Adducts based on divinylarene oxides
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WO2011071961A2 (en) 2009-12-09 2011-06-16 Dow Global Technologies Llc Divinylarene dioxide presins
KR20120114295A (ko) 2009-12-09 2012-10-16 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물
WO2011097009A2 (en) 2010-02-02 2011-08-11 Dow Global Technologies Llc Curable epoxy resin compositions
KR20130062915A (ko) 2010-03-24 2013-06-13 다우 글로벌 테크놀로지스 엘엘씨 강인화제로서 폴리(프로필렌 옥사이드) 폴리올을 포함하는 에폭시 수지 조성물
US8865917B2 (en) 2010-05-21 2014-10-21 Dow Global Technologies Llc Hardeners for thermosettable resin compositions
EP2585512A2 (en) 2010-06-25 2013-05-01 Dow Global Technologies LLC Curable epoxy resin compositions and composites made therefrom
WO2011163154A2 (en) 2010-06-25 2011-12-29 Dow Global Technologies Llc Polymer concrete composition
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KR20140027171A (ko) 2011-04-26 2014-03-06 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
BR112014003757A2 (pt) 2011-08-18 2017-03-01 Dow Global Technologies Llc composição de resina epóxi curável sem solvente, artigo e processo
BR112014003754A2 (pt) 2011-08-18 2017-03-07 Dow Global Technologies Llc composição de resina epóxil curável e processo
WO2013070478A1 (en) 2011-11-08 2013-05-16 Dow Global Technologies Llc Bimodal toughening agents for thermosettable epoxy resin compositions
EP2785762A2 (en) 2011-12-01 2014-10-08 Dow Global Technologies LLC Liquid accelerator composition for hardeners
CN104470983A (zh) * 2011-12-29 2015-03-25 3M创新有限公司 可固化聚硅氧烷组合物
CA2861797A1 (en) 2011-12-30 2013-07-04 Dow Global Technologies Llc Low temperature curable epoxy system
MX365975B (es) 2012-04-09 2019-06-21 Mi Llc Activación del calentamiento de los fluidos de un pozo utilizando nanomateriales de carbono.
US20150329738A1 (en) 2012-12-14 2015-11-19 Blue Cube Ip Llc Modified epoxy resins
WO2014093116A2 (en) 2012-12-14 2014-06-19 Dow Global Technologies Llc Curable compositions
US9677370B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Deformable plug and seal well system
EP2829570A1 (en) 2013-07-22 2015-01-28 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
US10077332B2 (en) * 2013-07-03 2018-09-18 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
WO2015124792A1 (en) * 2014-02-24 2015-08-27 Sika Technology Ag Furan-based amines as curing agents for epoxy resins in low voc applications
WO2016053641A1 (en) 2014-09-29 2016-04-07 Blue Cube Ip Llc Adduct composition
KR102391148B1 (ko) 2014-10-10 2022-04-26 다우 글로벌 테크놀로지스 엘엘씨 계면활성제 조성물
TW201641531A (zh) 2015-04-30 2016-12-01 藍色立方體有限責任公司 硬化劑組成物
US20190001593A1 (en) 2016-01-04 2019-01-03 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
US20200094517A1 (en) 2017-02-26 2020-03-26 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
WO2019036189A1 (en) 2017-08-15 2019-02-21 Covestro Llc ADDITIVE FOR ENOUGHING EPOXY-BASED RESINS FOR USE IN OIL FIELD APPLICATIONS
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
US20190390064A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390065A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing organic ion-exchangers to improve corrosion resistance
MX2019007512A (es) 2018-06-22 2020-07-29 Ennis Flint Inc Composiciones de epoxi y metodos de uso.
US20190390066A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390063A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing organic ion-exchangers to improve corrosion resistance
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
KR20220016899A (ko) 2019-06-04 2022-02-10 다우 실리콘즈 코포레이션 실릴 수소화물과 실록산의 열적으로 개시된 산 촉매화된 반응
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JP7748400B2 (ja) 2020-06-24 2025-10-02 ダウ シリコーンズ コーポレーション フッ素化アリールボランルイス酸によって触媒される有機ケイ素化合物とシリルヒドリドとの反応のための組成物及び方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970130A (en) 1958-01-07 1961-01-31 Westinghouse Electric Corp Catalysts for glycidyl polyethers, products produced thereby and method of producing said catalysts
US3255153A (en) * 1960-11-14 1966-06-07 United States Borax Chem Curing epoxy resins with aminoborane curing agents
US3347827A (en) 1964-10-21 1967-10-17 Callery Chemical Co Epoxide resin composition containing an amine borane accelerator
DE3716372A1 (de) 1987-05-15 1988-11-24 Wacker Chemie Gmbh Verfahren zur herstellung von organopolysiloxanen und ein neues organopolysiloxan
AU4342289A (en) * 1988-10-05 1990-05-01 E.I. Du Pont De Nemours And Company Curing agents for epoxy/anhydride resins
US5280119A (en) * 1991-11-01 1994-01-18 Boron Biologicals, Inc. Heterocyclic amine-boranes, and method of inhibiting DNA topoisomerase activity and/or combatting inflammation, hyperlipidemia, and/or neoplasia using amine-borane compounds
DE69425288T2 (de) * 1993-03-23 2001-01-04 Reilly Industries, Inc. Katalysatore auf Basis von bizyclischen Amidinen und ihre Verwendung in heisshärtbaren Zusammensetzungen
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
AU749065B2 (en) * 1998-02-20 2002-06-20 Dow Chemical Company, The Catalyst activators comprising expanded anions
US20020010291A1 (en) * 1998-12-04 2002-01-24 Vince Murphy Ionic liquids and processes for production of high molecular weight polyisoolefins
FR2800380B1 (fr) 1999-10-29 2002-01-18 Rhodia Chimie Sa Amorceur de polymerisation et/ou reticulation de polyorganosiloxanes a groupements fonctionnels reticulables, compositions correspondantes et leurs utlisations
FR2806930B1 (fr) 2000-04-04 2002-06-28 Rhodia Chimie Sa Utilisation d'un derive de bore a titre de catalyseur thermoactivable pour la polymerisation et/ou reticulation de silicone par deshydrogenocondensation
GB0009289D0 (en) 2000-04-15 2000-05-31 Dow Corning Process for the condensation of compounds having silicon bonded hydroxy or alkoxy groups
US7176269B2 (en) * 2000-07-25 2007-02-13 Mitsui Chemicals, Inc. Curable composition and its use
US6667194B1 (en) 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
US6458472B1 (en) * 2001-01-08 2002-10-01 Henkel Loctite Corporation Fluxing underfill compositions
FR2824835A1 (fr) 2001-05-15 2002-11-22 Rhodia Chimie Sa Composition silicone polymerisable reticulable par voie cationique, sous activation thermique et au moyen d'un amorceur de type adduit acide/base de lewis
US6617401B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
WO2003062208A1 (en) 2002-01-17 2003-07-31 General Electric Company Onium salts with weakly coordinating imidazolidine anion as cationic initiators
US20050048700A1 (en) 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US20040102529A1 (en) 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US7064173B2 (en) 2002-12-30 2006-06-20 General Electric Company Silicone condensation reaction
US7241851B2 (en) 2002-12-30 2007-07-10 Momentive Performance Materials Inc. Silicone condensation reaction
JP3952189B2 (ja) 2003-02-06 2007-08-01 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2007538070A (ja) 2004-05-20 2007-12-27 ゼネラル・エレクトリック・カンパニイ シリコーン縮合反応
US20060011295A1 (en) * 2004-07-14 2006-01-19 Karsten Danielmeier Aspartic ester functional compounds
US20060211836A1 (en) 2005-03-15 2006-09-21 General Electric Company Disproportionation of hydridosiloxanes and crosslinked polysiloxane network derived therefrom

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
US9695272B2 (en) 2010-06-28 2017-07-04 Blue Cube Ip Llc Divinylarene dioxide resin compositions
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP5579859B2 (ja) * 2010-09-15 2014-08-27 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
KR20130118339A (ko) 2010-11-05 2013-10-29 가부시키가이샤 닛폰 쇼쿠바이 카티온 경화성 수지 조성물
JP5680668B2 (ja) * 2010-11-05 2015-03-04 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料
JP2021017462A (ja) * 2019-07-17 2021-02-15 株式会社ダイセル 硬化性組成物、及び線維強化複合材料
JP7306903B2 (ja) 2019-07-17 2023-07-11 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

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US20060293172A1 (en) 2006-12-28
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CN102786665A (zh) 2012-11-21
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EP2283922A3 (en) 2013-07-03

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