JP2008544067A - 硬化触媒、組成物、電子機器及び関連する方法 - Google Patents

硬化触媒、組成物、電子機器及び関連する方法 Download PDF

Info

Publication number
JP2008544067A
JP2008544067A JP2008518211A JP2008518211A JP2008544067A JP 2008544067 A JP2008544067 A JP 2008544067A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008518211 A JP2008518211 A JP 2008518211A JP 2008544067 A JP2008544067 A JP 2008544067A
Authority
JP
Japan
Prior art keywords
catalyst
composition
lewis acid
anhydride
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008518211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008544067A5 (https=
Inventor
スラウォミール ルビンスタイン
ジョン ロバート キャンベル
ライアン クリストファー ミルズ
サンディープ シュリカント トナピ
アナンス プラバクマール
Original Assignee
モーメンティブ・パフォーマンス・マテリアルズ・インク
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モーメンティブ・パフォーマンス・マテリアルズ・インク filed Critical モーメンティブ・パフォーマンス・マテリアルズ・インク
Publication of JP2008544067A publication Critical patent/JP2008544067A/ja
Publication of JP2008544067A5 publication Critical patent/JP2008544067A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0237—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
    • B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
    • B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
  • Polymerization Catalysts (AREA)
  • Catalysts (AREA)
JP2008518211A 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法 Pending JP2008544067A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/167,847 US8048819B2 (en) 2005-06-23 2005-06-23 Cure catalyst, composition, electronic device and associated method
PCT/US2006/022587 WO2007001803A2 (en) 2005-06-23 2006-06-09 Cure catalyst, composition, electronic device and associated method

Publications (2)

Publication Number Publication Date
JP2008544067A true JP2008544067A (ja) 2008-12-04
JP2008544067A5 JP2008544067A5 (https=) 2013-10-24

Family

ID=37074187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008518211A Pending JP2008544067A (ja) 2005-06-23 2006-06-09 硬化触媒、組成物、電子機器及び関連する方法

Country Status (8)

Country Link
US (1) US8048819B2 (https=)
EP (2) EP2283922A3 (https=)
JP (1) JP2008544067A (https=)
KR (1) KR101391784B1 (https=)
CN (2) CN102786665A (https=)
BR (1) BRPI0612009A2 (https=)
RU (1) RU2008102366A (https=)
WO (1) WO2007001803A2 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103059267A (zh) * 2007-05-09 2013-04-24 陶氏环球技术公司 含有过量环氧树脂的环氧热固性组合物及其制备方法
AR063177A1 (es) 2007-05-23 2008-12-30 Mi Llc Uso de emulsiones epoxicas inversas para la estabilizacion de perforaciones de pozos
NO20075120L (no) * 2007-05-23 2008-11-24 Mi Llc Anvendelse av direkte epoksyemulsjoner for borehullstabilisering
CN101711262A (zh) * 2007-05-29 2010-05-19 陶氏环球技术公司 用于改进固化控制的异氰酸酯-环氧配方
JP5336485B2 (ja) * 2007-08-02 2013-11-06 ダウ グローバル テクノロジーズ エルエルシー 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー
EP2176355A1 (en) 2007-08-02 2010-04-21 Dow Global Technologies Inc. Thermoset dampener material
KR20100084561A (ko) 2007-10-26 2010-07-26 다우 글로벌 테크놀로지스 인크. 전기적 적층물에 사용하기 위한 이소시아누레이트 함유 에폭시 수지 조성물
JP2011505461A (ja) * 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド 熱硬化性エポキシ樹脂用硬化剤としてジシアンジアミドを使用するジメチルホルムアミドを含まない配合物
CN101878101A (zh) * 2007-11-29 2010-11-03 陶氏环球技术公司 可微波加热的单乙烯基芳族聚合物
JP2011509339A (ja) * 2008-01-08 2011-03-24 ダウ グローバル テクノロジーズ エルエルシー 複合材料用の高Ｔｇエポキシ系
US7629203B2 (en) * 2008-03-31 2009-12-08 Intel Corporation Thermal interface material for combined reflow
KR20160007668A (ko) 2008-04-14 2016-01-20 블루 큐브 아이피 엘엘씨 분말 피복 분야에 유용한 에폭시-이미다졸 촉매
US20110136993A1 (en) * 2008-08-28 2011-06-09 Dow Global Technologies Llc Phosphorus-containing compounds and polymeric compositions comprising same
JP5624054B2 (ja) 2008-12-16 2014-11-12 ダウ グローバル テクノロジーズ エルエルシー 電気積層板の製造に有用な均質ビスマレイミド−トリアジン−エポキシ組成物
KR20110119633A (ko) * 2009-01-06 2011-11-02 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용 금속 안정화제 및 분산 방법
JP2012518707A (ja) 2009-02-24 2012-08-16 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物及びその硬化体生成物
WO2010138346A1 (en) 2009-05-27 2010-12-02 Dow Global Technologies Inc. Polymeric glycidyl ethers reactive diluents
SG176923A1 (en) 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
US8969503B2 (en) 2009-09-22 2015-03-03 Dow Global Technologies Llc Process for preparing episulfide resins
US9074041B2 (en) 2009-09-25 2015-07-07 Blue Cube Ip Llc Curable epoxy resin compositions and composites made therefrom
EP2483353B1 (en) 2009-09-30 2013-10-30 Dow Global Technologies LLC Epoxy resin compositions
US8871892B2 (en) 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
SG181486A1 (en) 2009-12-02 2012-07-30 Dow Global Technologies Llc Coating compositions
EP2507285A2 (en) 2009-12-02 2012-10-10 Dow Global Technologies LLC Composite compositions
WO2011068644A1 (en) 2009-12-02 2011-06-09 Dow Global Technologies Inc. Epoxy resin compositions
BR112012011527A2 (pt) 2009-12-03 2019-09-24 Dow Global Technologies Llc aduto de poliamida, composição de resina epóxi curável, processo para preparar um aduto de amina e processo para preparar uma composição de resina epóxi curável
JP5902625B2 (ja) 2009-12-08 2016-04-13 ブルー キューブ アイピー エルエルシー ヒドロキシル官能性ポリエステル樹脂
BR112012013526A2 (pt) 2009-12-09 2015-09-15 Dow Global Technologies Llc composição de resina de dióxido de divinilareno hidrolisada, composição de resina de dióxido de divinilareno hidrolisada curável, processo para hidrolisar uma resina epóxi de divinilareno e processo para preparar uma composição de resina de dióxido de divinilareno hidrolisada curável
JP2013513694A (ja) 2009-12-09 2013-04-22 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂組成物
WO2011097009A2 (en) 2010-02-02 2011-08-11 Dow Global Technologies Llc Curable epoxy resin compositions
BR112012023949A2 (pt) 2010-03-24 2017-08-08 Dow Global Technologies Llc composição de resina epóxi curável
TWI557100B (zh) 2010-05-21 2016-11-11 藍色立方體有限責任公司 用於可熱固樹脂組成物之硬化劑
KR20130039760A (ko) 2010-06-25 2013-04-22 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체
EP2585520A2 (en) 2010-06-25 2013-05-01 Dow Global Technologies LLC Polymer concrete composition
US20110315916A1 (en) * 2010-06-29 2011-12-29 Dow Global Technologies Inc. Curable composition
KR20140027171A (ko) 2011-04-26 2014-03-06 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
EP2744843B1 (en) 2011-08-18 2019-04-24 Blue Cube IP LLC Curable resin compositions
BR112014003754A2 (pt) 2011-08-18 2017-03-07 Dow Global Technologies Llc composição de resina epóxil curável e processo
WO2013070478A1 (en) 2011-11-08 2013-05-16 Dow Global Technologies Llc Bimodal toughening agents for thermosettable epoxy resin compositions
WO2013081895A2 (en) 2011-12-01 2013-06-06 Dow Global Tecnologies LLC Liquid accelerator composition for hardeners
WO2013106193A1 (en) * 2011-12-29 2013-07-18 3M Innovative Properties Company Curable polysiloxane composition
KR20140119053A (ko) 2011-12-30 2014-10-08 다우 글로벌 테크놀로지스 엘엘씨 저온 경화성 에폭시 계
MX365975B (es) 2012-04-09 2019-06-21 Mi Llc Activación del calentamiento de los fluidos de un pozo utilizando nanomateriales de carbono.
EP2931781B1 (en) 2012-12-14 2020-11-04 Blue Cube IP LLC Modified epoxy resins
RU2015128263A (ru) 2012-12-14 2017-01-23 БЛЮ КЬЮБ АйПи ЭлЭлСи Отверждаемые композиции
US9677370B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Deformable plug and seal well system
JP6426163B2 (ja) 2013-07-03 2018-11-21 ローディア オペレーションズ 硬化性組成物およびエポキシ熱硬化性樹脂の製造方法
EP2829570A1 (en) 2013-07-22 2015-01-28 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
US10287389B2 (en) * 2014-02-24 2019-05-14 Sika Technology Ag Furan-based amines as curing agents for epoxy resins in low VOC applications
WO2016053641A1 (en) 2014-09-29 2016-04-07 Blue Cube Ip Llc Adduct composition
BR112017006651B1 (pt) 2014-10-10 2022-09-13 Dow Global Technologies Llc Composição surfactante funcionalizada com epóxi, composição de resina epóxi, e, composição de dispersão de epóxi à base de água
WO2016176568A1 (en) 2015-04-30 2016-11-03 Blue Cube Ip Llc Hardener composition
EP3400258A1 (en) 2016-01-04 2018-11-14 Dow Global Technologies, LLC Fiber composites with reduced surface roughness and methods for making them
US20200094517A1 (en) 2017-02-26 2020-03-26 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
US20200190390A1 (en) 2017-08-15 2020-06-18 Covestro Llc Additive to flexibilize epoxy-based resins for use in oil field applications
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
CA3047631A1 (en) 2018-06-22 2019-12-22 Ennis-Flint, Inc. Epoxy compositions and methods of use
US20190390064A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390066A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390063A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing organic ion-exchangers to improve corrosion resistance
US20190390065A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing organic ion-exchangers to improve corrosion resistance
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
WO2020247332A1 (en) 2019-06-04 2020-12-10 Dow Silicones Corporation Thermally initiated acid catalyzed reaction between silyl hydride and silyl ether and/or silanol
WO2020247329A1 (en) 2019-06-04 2020-12-10 Dow Silicones Corporation Thermally initiated acid catalyzed reaction between silyl hydride and siloxane
WO2020247333A1 (en) 2019-06-04 2020-12-10 Dow Silicones Corporation Thermally initiated acid catalyzed reaction between silyl hydride and alpha-beta unsaturated esters
CN113993620B (zh) 2019-06-04 2023-08-04 美国陶氏有机硅公司 作为用于Si-H和α-β不饱和酯之间的反应的热触发剂的桥联受阻路易斯对
EP3980426B1 (en) 2019-06-04 2023-04-19 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and si-o-si
CN113993933B (zh) 2019-06-04 2023-07-14 美国陶氏有机硅公司 作为用于Si-H和Si-OR之间的反应的热触发剂的桥联受阻路易斯对
JP7560490B2 (ja) 2019-06-04 2024-10-02 ダウ シリコーンズ コーポレーション Ｓｉ－Ｈとエポキシドとの反応のための熱誘発としての架橋型フラストレイテッドルイスペア
KR102775243B1 (ko) * 2020-04-20 2025-03-04 삼성디스플레이 주식회사 표시 장치, 접합 장치 및 이를 이용하는 표시 장치 제조 방법
US12173181B2 (en) 2020-06-04 2024-12-24 Dow Silicones Corporation Epoxy-curable silicone release coating composition and methods for its preparation and use
US12398241B2 (en) 2020-06-24 2025-08-26 Dow Global Technologies Llc Composition and method for reacting an organosilicon compound and a silyl hydride catalyzed by a fluorinated arylborane Lewis acid
EP4172242B1 (en) 2020-06-24 2024-03-20 Dow Silicones Corporation Composition and method for silyl hydride reaction catalyzed by fluorinated arylborane lewis acids
EP4172243A1 (en) 2020-06-24 2023-05-03 Dow Silicones Corporation Methods for making polyfunctional organosiloxanes and compositions containing same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970130A (en) * 1958-01-07 1961-01-31 Westinghouse Electric Corp Catalysts for glycidyl polyethers, products produced thereby and method of producing said catalysts
US3255153A (en) * 1960-11-14 1966-06-07 United States Borax Chem Curing epoxy resins with aminoborane curing agents
US3347827A (en) * 1964-10-21 1967-10-17 Callery Chemical Co Epoxide resin composition containing an amine borane accelerator
DE3716372A1 (de) 1987-05-15 1988-11-24 Wacker Chemie Gmbh Verfahren zur herstellung von organopolysiloxanen und ein neues organopolysiloxan
WO1990003990A2 (en) * 1988-10-05 1990-04-19 E.I. Du Pont De Nemours And Company Curing agents for epoxy/anhydride resins
US5280119A (en) * 1991-11-01 1994-01-18 Boron Biologicals, Inc. Heterocyclic amine-boranes, and method of inhibiting DNA topoisomerase activity and/or combatting inflammation, hyperlipidemia, and/or neoplasia using amine-borane compounds
EP0860458B1 (en) 1993-03-23 2000-07-12 Reilly Industries, Inc. Bicyclic amidine based catalysts and use in thermosettable compositions
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
ATE243700T1 (de) * 1998-02-20 2003-07-15 Dow Global Technologies Inc Expandierte anionen enthaltende katalysatoraktivatoren
US20020010291A1 (en) * 1998-12-04 2002-01-24 Vince Murphy Ionic liquids and processes for production of high molecular weight polyisoolefins
FR2800380B1 (fr) 1999-10-29 2002-01-18 Rhodia Chimie Sa Amorceur de polymerisation et/ou reticulation de polyorganosiloxanes a groupements fonctionnels reticulables, compositions correspondantes et leurs utlisations
FR2806930B1 (fr) 2000-04-04 2002-06-28 Rhodia Chimie Sa Utilisation d'un derive de bore a titre de catalyseur thermoactivable pour la polymerisation et/ou reticulation de silicone par deshydrogenocondensation
GB0009289D0 (en) * 2000-04-15 2000-05-31 Dow Corning Process for the condensation of compounds having silicon bonded hydroxy or alkoxy groups
US7176269B2 (en) * 2000-07-25 2007-02-13 Mitsui Chemicals, Inc. Curable composition and its use
US6667194B1 (en) * 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
US6458472B1 (en) * 2001-01-08 2002-10-01 Henkel Loctite Corporation Fluxing underfill compositions
FR2824835A1 (fr) 2001-05-15 2002-11-22 Rhodia Chimie Sa Composition silicone polymerisable reticulable par voie cationique, sous activation thermique et au moyen d'un amorceur de type adduit acide/base de lewis
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
KR20040075353A (ko) 2002-01-17 2004-08-27 제너럴 일렉트릭 캄파니 양이온성 개시제로서 약하게 배위된 이미다졸리딘음이온을 포함하는 오늄 염
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US7064173B2 (en) * 2002-12-30 2006-06-20 General Electric Company Silicone condensation reaction
US7241851B2 (en) * 2002-12-30 2007-07-10 Momentive Performance Materials Inc. Silicone condensation reaction
JP3952189B2 (ja) * 2003-02-06 2007-08-01 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2007538070A (ja) 2004-05-20 2007-12-27 ゼネラル・エレクトリック・カンパニイ シリコーン縮合反応
US20060011295A1 (en) * 2004-07-14 2006-01-19 Karsten Danielmeier Aspartic ester functional compounds
US20060211836A1 (en) * 2005-03-15 2006-09-21 General Electric Company Disproportionation of hydridosiloxanes and crosslinked polysiloxane network derived therefrom

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0598216A (ja) * 1991-04-29 1993-04-20 Natl Starch & Chem Investment Holding Corp アクリル接着剤配合物
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
JPH11181060A (ja) * 1997-12-19 1999-07-06 Sumitomo Bakelite Co Ltd 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
JP2003517009A (ja) * 1999-12-17 2003-05-20 ダウ グローバル テクノロジーズ インコーポレイティド アミンオルガノボラン錯体重合開始剤および重合性組成物
WO2003076485A2 (en) * 2002-03-05 2003-09-18 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099086A (ja) * 2009-10-07 2011-05-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた電子部品装置
US9695272B2 (en) 2010-06-28 2017-07-04 Blue Cube Ip Llc Divinylarene dioxide resin compositions
JP2013531721A (ja) * 2010-06-28 2013-08-08 ダウ グローバル テクノロジーズ エルエルシー 硬化性樹脂組成物
JP5579859B2 (ja) * 2010-09-15 2014-08-27 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012036164A1 (ja) * 2010-09-15 2012-03-22 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
KR20130118339A (ko) 2010-11-05 2013-10-29 가부시키가이샤 닛폰 쇼쿠바이 카티온 경화성 수지 조성물
JP5680668B2 (ja) * 2010-11-05 2015-03-04 株式会社日本触媒 カチオン硬化性樹脂組成物
JP2013230431A (ja) * 2012-04-27 2013-11-14 Nippon Shokubai Co Ltd カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
WO2021010394A1 (ja) * 2019-07-17 2021-01-21 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料
JP2021017462A (ja) * 2019-07-17 2021-02-15 株式会社ダイセル 硬化性組成物、及び線維強化複合材料
JP7306903B2 (ja) 2019-07-17 2023-07-11 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料

Also Published As

Publication number Publication date
US20060293172A1 (en) 2006-12-28
KR101391784B1 (ko) 2014-05-07
CN101257973A (zh) 2008-09-03
EP2283922A2 (en) 2011-02-16
EP2283922A3 (en) 2013-07-03
RU2008102366A (ru) 2009-07-27
KR20080034438A (ko) 2008-04-21
WO2007001803A3 (en) 2007-03-15
US8048819B2 (en) 2011-11-01
EP1926554A2 (en) 2008-06-04
BRPI0612009A2 (pt) 2010-10-13
CN101257973B (zh) 2014-07-30
CN102786665A (zh) 2012-11-21
WO2007001803A2 (en) 2007-01-04

Similar Documents

Publication Publication Date Title
JP2008544067A (ja) 硬化触媒、組成物、電子機器及び関連する方法
JP6366590B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP6366504B2 (ja) エポキシ樹脂、エポキシ樹脂組成物および硬化物
KR20110081221A (ko) 리드프리 전도성 조성물 및 그 사용 방법
JP2010001427A (ja) エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
KR100946609B1 (ko) 광반도체 봉지용 수지 조성물
JP2002097257A (ja) 液状エポキシ樹脂組成物及び半導体装置
JP2003183351A (ja) 液状エポキシ樹脂組成物及び半導体装置
JP2017071706A (ja) エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
TW201636356A (zh) 鏻化合物、含有其的環氧樹脂組成物及使用其製造的半導體裝置
CN105555827B (zh) 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置
JP7281246B1 (ja) 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物
JP7005170B2 (ja) エポキシ樹脂組成物
JP2003183480A (ja) 液状エポキシ樹脂組成物及びフリップチップ型半導体装置
CN1831075A (zh) 包含苯并噁嗪的助熔不流动底层填料组合物
KR101702704B1 (ko) 포스포늄 이온 함유 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 장치
JPS5817214B2 (ja) 酸無水物系の耐熱性硬化剤組成物
KR101706823B1 (ko) 술포늄 이온 함유 화합물, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치
JPH0299514A (ja) 半導体封止用半田耐熱性エポキシ樹脂組成物
KR101622016B1 (ko) 에폭시수지 조성물용 경화 촉매, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치
JP4521974B2 (ja) 結晶性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR101645074B1 (ko) 피리디늄계 화합물, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090528

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120217

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120224

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120328

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120404

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120425

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120528

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130305

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130605

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130612

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130703

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130710

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130805

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130812

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20130905

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140325