CN101257973B - 固化催化剂、组合物、电子器件和相关方法 - Google Patents

固化催化剂、组合物、电子器件和相关方法 Download PDF

Info

Publication number
CN101257973B
CN101257973B CN200680022834.6A CN200680022834A CN101257973B CN 101257973 B CN101257973 B CN 101257973B CN 200680022834 A CN200680022834 A CN 200680022834A CN 101257973 B CN101257973 B CN 101257973B
Authority
CN
China
Prior art keywords
approximately
weight
curable composition
lewis acid
degrees celsius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680022834.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN101257973A (zh
Inventor
斯瓦沃米尔·鲁宾斯泰因
约翰·罗伯特·坎贝尔
瑞安·克里斯托弗·米尔斯
桑迪普·什里坎特·托尼亚皮
阿南特·普拉巴库玛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Inc
Original Assignee
Momentive Performance Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Momentive Performance Materials Inc filed Critical Momentive Performance Materials Inc
Publication of CN101257973A publication Critical patent/CN101257973A/zh
Application granted granted Critical
Publication of CN101257973B publication Critical patent/CN101257973B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0237—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
    • B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
    • B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
  • Catalysts (AREA)
  • Polymerization Catalysts (AREA)
CN200680022834.6A 2005-06-23 2006-06-09 固化催化剂、组合物、电子器件和相关方法 Expired - Fee Related CN101257973B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/167,847 US8048819B2 (en) 2005-06-23 2005-06-23 Cure catalyst, composition, electronic device and associated method
US11/167,847 2005-06-23
PCT/US2006/022587 WO2007001803A2 (en) 2005-06-23 2006-06-09 Cure catalyst, composition, electronic device and associated method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2012102704518A Division CN102786665A (zh) 2005-06-23 2006-06-09 固化催化剂、组合物、电子器件和相关方法

Publications (2)

Publication Number Publication Date
CN101257973A CN101257973A (zh) 2008-09-03
CN101257973B true CN101257973B (zh) 2014-07-30

Family

ID=37074187

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200680022834.6A Expired - Fee Related CN101257973B (zh) 2005-06-23 2006-06-09 固化催化剂、组合物、电子器件和相关方法
CN2012102704518A Pending CN102786665A (zh) 2005-06-23 2006-06-09 固化催化剂、组合物、电子器件和相关方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2012102704518A Pending CN102786665A (zh) 2005-06-23 2006-06-09 固化催化剂、组合物、电子器件和相关方法

Country Status (8)

Country Link
US (1) US8048819B2 (https=)
EP (2) EP1926554A2 (https=)
JP (1) JP2008544067A (https=)
KR (1) KR101391784B1 (https=)
CN (2) CN101257973B (https=)
BR (1) BRPI0612009A2 (https=)
RU (1) RU2008102366A (https=)
WO (1) WO2007001803A2 (https=)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100017712A (ko) * 2007-05-09 2010-02-16 다우 글로벌 테크놀로지스 인크. 과잉 에폭시 수지를 포함하는 에폭시 열경화성 조성물 및 이의 제조 방법
NO20075120L (no) * 2007-05-23 2008-11-24 Mi Llc Anvendelse av direkte epoksyemulsjoner for borehullstabilisering
CA2606537C (en) * 2007-05-23 2010-12-21 M-I Llc Use of invert epoxy emulsions for wellbore stabilization
CN101711262A (zh) * 2007-05-29 2010-05-19 陶氏环球技术公司 用于改进固化控制的异氰酸酯-环氧配方
BRPI0813210A2 (pt) 2007-08-02 2014-12-23 Dow Global Technologies Inc "processo para amortecer vibrações num artigo, compósito tendo propriedades de amortecimento melhoradas em temperaturas elevadas e composição termofixa tendo propriedades de amortecimento melhoradas em temperaturas elevadas"
KR20150063590A (ko) * 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
US20100240816A1 (en) * 2007-10-26 2010-09-23 Dow Global Technologies Inc. Epoxy resin composition containing isocyanurates for use in electrical laminates
BRPI0819013A2 (pt) * 2007-11-29 2015-05-05 Dow Global Technologies Inc Método para processar sob fusão um polimero de um composto aromático monovinílico e método para fabricar um artigo
KR101150311B1 (ko) * 2007-11-29 2012-06-11 다우 글로벌 테크놀로지스 엘엘씨 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형
EP2229416B1 (en) * 2008-01-08 2018-04-04 Dow Global Technologies LLC High tg epoxy systems for composite application
US7629203B2 (en) * 2008-03-31 2009-12-08 Intel Corporation Thermal interface material for combined reflow
EP2268697B1 (en) 2008-04-14 2014-01-29 Dow Global Technologies LLC Epoxy-imidazole catalysts useful for powder coating applications
KR20110059726A (ko) * 2008-08-28 2011-06-03 다우 글로벌 테크놀로지스 엘엘씨 인-함유 화합물 및 이를 포함하는 중합체 조성물
EP2389406A1 (en) 2008-12-16 2011-11-30 Dow Global Technologies LLC Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
SG172875A1 (en) * 2009-01-06 2011-08-29 Dow Global Technologies Llc Metal stabilizers for epoxy resins and dispersion process
CA2750703A1 (en) 2009-02-24 2010-09-02 Gary A. Hunter Curable epoxy resin compositions and cured products therefrom
US20120046425A1 (en) 2009-05-27 2012-02-23 Schroetz Markus Polymeric glycidyl ethers reactive diluents
US20120083564A1 (en) 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
EP2480586B1 (en) 2009-09-22 2014-11-12 Dow Global Technologies LLC Process for preparing episulfide resins
KR20120094163A (ko) 2009-09-25 2012-08-23 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이로부터 제조된 복합체
JP5584301B2 (ja) 2009-09-30 2014-09-03 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂組成物
JP5527600B2 (ja) * 2009-10-07 2014-06-18 日立化成株式会社 エポキシ樹脂組成物及びそれを用いた電子部品装置
US8871892B2 (en) 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
CN102648227B (zh) 2009-12-02 2015-08-26 陶氏环球技术有限责任公司 环氧树脂组合物
EP2507285A2 (en) 2009-12-02 2012-10-10 Dow Global Technologies LLC Composite compositions
EP2507325B1 (en) 2009-12-02 2014-05-21 Dow Global Technologies LLC Coating compositions
US20120245306A1 (en) 2009-12-03 2012-09-27 Marks Maurice J Adducts based on divinylarene oxides
BR112012013135A8 (pt) 2009-12-08 2017-10-24 Dow Global Technologies Inc Composição de resina, processo para preparar um resina de poliésyer com funcionalidade hidroxila e processo para preparar uma composição de resina de poliéster com funcionalidade hidroxila curável
WO2011071961A2 (en) 2009-12-09 2011-06-16 Dow Global Technologies Llc Divinylarene dioxide presins
KR20120114295A (ko) 2009-12-09 2012-10-16 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물
WO2011097009A2 (en) 2010-02-02 2011-08-11 Dow Global Technologies Llc Curable epoxy resin compositions
KR20130062915A (ko) 2010-03-24 2013-06-13 다우 글로벌 테크놀로지스 엘엘씨 강인화제로서 폴리(프로필렌 옥사이드) 폴리올을 포함하는 에폭시 수지 조성물
US8865917B2 (en) 2010-05-21 2014-10-21 Dow Global Technologies Llc Hardeners for thermosettable resin compositions
EP2585512A2 (en) 2010-06-25 2013-05-01 Dow Global Technologies LLC Curable epoxy resin compositions and composites made therefrom
WO2011163154A2 (en) 2010-06-25 2011-12-29 Dow Global Technologies Llc Polymer concrete composition
KR20130039330A (ko) * 2010-06-28 2013-04-19 다우 글로벌 테크놀로지스 엘엘씨 경화성 수지 조성물
US20110315916A1 (en) * 2010-06-29 2011-12-29 Dow Global Technologies Inc. Curable composition
JP5579859B2 (ja) * 2010-09-15 2014-08-27 株式会社日本触媒 熱潜在性重合開始剤として用い得る組成物
WO2012060449A1 (ja) * 2010-11-05 2012-05-10 株式会社日本触媒 カチオン硬化性樹脂組成物
KR20140027171A (ko) 2011-04-26 2014-03-06 다우 글로벌 테크놀로지스 엘엘씨 경화성 조성물
BR112014003757A2 (pt) 2011-08-18 2017-03-01 Dow Global Technologies Llc composição de resina epóxi curável sem solvente, artigo e processo
BR112014003754A2 (pt) 2011-08-18 2017-03-07 Dow Global Technologies Llc composição de resina epóxil curável e processo
WO2013070478A1 (en) 2011-11-08 2013-05-16 Dow Global Technologies Llc Bimodal toughening agents for thermosettable epoxy resin compositions
EP2785762A2 (en) 2011-12-01 2014-10-08 Dow Global Technologies LLC Liquid accelerator composition for hardeners
CN104470983A (zh) * 2011-12-29 2015-03-25 3M创新有限公司 可固化聚硅氧烷组合物
CA2861797A1 (en) 2011-12-30 2013-07-04 Dow Global Technologies Llc Low temperature curable epoxy system
MX365975B (es) 2012-04-09 2019-06-21 Mi Llc Activación del calentamiento de los fluidos de un pozo utilizando nanomateriales de carbono.
JP5815463B2 (ja) * 2012-04-27 2015-11-17 株式会社日本触媒 カチオン硬化触媒の製造方法
JP2013234231A (ja) * 2012-05-07 2013-11-21 Nippon Shokubai Co Ltd カチオン硬化性樹脂組成物
US20150329738A1 (en) 2012-12-14 2015-11-19 Blue Cube Ip Llc Modified epoxy resins
WO2014093116A2 (en) 2012-12-14 2014-06-19 Dow Global Technologies Llc Curable compositions
US9677370B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Deformable plug and seal well system
EP2829570A1 (en) 2013-07-22 2015-01-28 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
US10077332B2 (en) * 2013-07-03 2018-09-18 Rhodia Operations Curable composition and process for the manufacture of an epoxy thermoset
WO2015124792A1 (en) * 2014-02-24 2015-08-27 Sika Technology Ag Furan-based amines as curing agents for epoxy resins in low voc applications
WO2016053641A1 (en) 2014-09-29 2016-04-07 Blue Cube Ip Llc Adduct composition
KR102391148B1 (ko) 2014-10-10 2022-04-26 다우 글로벌 테크놀로지스 엘엘씨 계면활성제 조성물
TW201641531A (zh) 2015-04-30 2016-12-01 藍色立方體有限責任公司 硬化劑組成物
US20190001593A1 (en) 2016-01-04 2019-01-03 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
US20200094517A1 (en) 2017-02-26 2020-03-26 Dow Global Technologies Llc Fiber composites with reduced surface roughness and methods for making them
WO2019036189A1 (en) 2017-08-15 2019-02-21 Covestro Llc ADDITIVE FOR ENOUGHING EPOXY-BASED RESINS FOR USE IN OIL FIELD APPLICATIONS
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
US20190390064A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390065A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing organic ion-exchangers to improve corrosion resistance
MX2019007512A (es) 2018-06-22 2020-07-29 Ennis Flint Inc Composiciones de epoxi y metodos de uso.
US20190390066A1 (en) 2018-06-22 2019-12-26 Covestro Llc Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance
US20190390063A1 (en) 2018-06-22 2019-12-26 Covestro Llc Solventborne compositions containing organic ion-exchangers to improve corrosion resistance
WO2020005393A1 (en) 2018-06-26 2020-01-02 Dow Global Technologies Llc Fibre-reinforced composite and process of making this composite
KR20220016899A (ko) 2019-06-04 2022-02-10 다우 실리콘즈 코포레이션 실릴 수소화물과 실록산의 열적으로 개시된 산 촉매화된 반응
JP7560487B2 (ja) 2019-06-04 2024-10-02 ダウ シリコーンズ コーポレーション Ｓｉ－ＨとＳｉ－Ｏ－Ｓｉとの反応のための熱トリガとしての架橋型フラストレイティドルイスペア
KR20220016906A (ko) 2019-06-04 2022-02-10 다우 실리콘즈 코포레이션 실릴 수소화물과 실릴 에테르 및/또는 실라놀 사이의 열적으로 개시되는 산 촉매 반응
EP3980430B1 (en) 2019-06-04 2023-04-12 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and alpha-beta unsaturated esters
CN113993933B (zh) 2019-06-04 2023-07-14 美国陶氏有机硅公司 作为用于Si-H和Si-OR之间的反应的热触发剂的桥联受阻路易斯对
WO2020247338A1 (en) 2019-06-04 2020-12-10 Dow Silicones Corporation BRIDGED FRUSTRATED LEWIS PAIRS AS THERMAL TRIGGER FOR REACTIONS BETWEEN Si-H AND EPOXIDE
WO2020247333A1 (en) * 2019-06-04 2020-12-10 Dow Silicones Corporation Thermally initiated acid catalyzed reaction between silyl hydride and alpha-beta unsaturated esters
JP7306903B2 (ja) * 2019-07-17 2023-07-11 株式会社ダイセル 硬化性組成物、及び繊維強化複合材料
KR102775243B1 (ko) * 2020-04-20 2025-03-04 삼성디스플레이 주식회사 표시 장치, 접합 장치 및 이를 이용하는 표시 장치 제조 방법
US12173181B2 (en) 2020-06-04 2024-12-24 Dow Silicones Corporation Epoxy-curable silicone release coating composition and methods for its preparation and use
WO2021262492A1 (en) 2020-06-24 2021-12-30 Dow Silicones Corporation Composition and method for silyl hydride reaction catalyzed by fluorinated arylborane lewis acids
EP4172243A1 (en) 2020-06-24 2023-05-03 Dow Silicones Corporation Methods for making polyfunctional organosiloxanes and compositions containing same
JP7748400B2 (ja) 2020-06-24 2025-10-02 ダウ シリコーンズ コーポレーション フッ素化アリールボランルイス酸によって触媒される有機ケイ素化合物とシリルヒドリドとの反応のための組成物及び方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970130A (en) * 1958-01-07 1961-01-31 Westinghouse Electric Corp Catalysts for glycidyl polyethers, products produced thereby and method of producing said catalysts
US3347827A (en) * 1964-10-21 1967-10-17 Callery Chemical Co Epoxide resin composition containing an amine borane accelerator
US5106928A (en) * 1991-04-29 1992-04-21 National Starch And Chemical Investment Holding Corporation Acrylic adhesive composition and organoboron initiator system
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds
EP0860458A2 (en) * 1993-03-23 1998-08-26 Reilly Industries, Inc. Bicyclic amidine based catalysts and use in thermosettable compositions

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3255153A (en) * 1960-11-14 1966-06-07 United States Borax Chem Curing epoxy resins with aminoborane curing agents
DE3716372A1 (de) 1987-05-15 1988-11-24 Wacker Chemie Gmbh Verfahren zur herstellung von organopolysiloxanen und ein neues organopolysiloxan
AU4342289A (en) * 1988-10-05 1990-05-01 E.I. Du Pont De Nemours And Company Curing agents for epoxy/anhydride resins
US5280119A (en) * 1991-11-01 1994-01-18 Boron Biologicals, Inc. Heterocyclic amine-boranes, and method of inhibiting DNA topoisomerase activity and/or combatting inflammation, hyperlipidemia, and/or neoplasia using amine-borane compounds
JPH0687948A (ja) * 1992-09-07 1994-03-29 Three Bond Co Ltd エポキシ樹脂組成物
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
JP3883149B2 (ja) * 1997-12-19 2007-02-21 住友ベークライト株式会社 樹脂組成物、並びにそれを用いた半導体封止材料および積層板
AU749065B2 (en) * 1998-02-20 2002-06-20 Dow Chemical Company, The Catalyst activators comprising expanded anions
US20020010291A1 (en) * 1998-12-04 2002-01-24 Vince Murphy Ionic liquids and processes for production of high molecular weight polyisoolefins
FR2800380B1 (fr) 1999-10-29 2002-01-18 Rhodia Chimie Sa Amorceur de polymerisation et/ou reticulation de polyorganosiloxanes a groupements fonctionnels reticulables, compositions correspondantes et leurs utlisations
US6806330B1 (en) * 1999-12-17 2004-10-19 Dow Global Technologies Inc. Amine organoborane complex polymerization initiators and polymerizable compositions
FR2806930B1 (fr) 2000-04-04 2002-06-28 Rhodia Chimie Sa Utilisation d'un derive de bore a titre de catalyseur thermoactivable pour la polymerisation et/ou reticulation de silicone par deshydrogenocondensation
GB0009289D0 (en) 2000-04-15 2000-05-31 Dow Corning Process for the condensation of compounds having silicon bonded hydroxy or alkoxy groups
US7176269B2 (en) * 2000-07-25 2007-02-13 Mitsui Chemicals, Inc. Curable composition and its use
US6667194B1 (en) 2000-10-04 2003-12-23 Henkel Loctite Corporation Method of bonding die chip with underfill fluxing composition
US6458472B1 (en) * 2001-01-08 2002-10-01 Henkel Loctite Corporation Fluxing underfill compositions
FR2824835A1 (fr) 2001-05-15 2002-11-22 Rhodia Chimie Sa Composition silicone polymerisable reticulable par voie cationique, sous activation thermique et au moyen d'un amorceur de type adduit acide/base de lewis
US6617401B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
WO2003062208A1 (en) 2002-01-17 2003-07-31 General Electric Company Onium salts with weakly coordinating imidazolidine anion as cationic initiators
US6762260B2 (en) * 2002-03-05 2004-07-13 Dow Global Technologies Inc. Organoborane amine complex polymerization initiators and polymerizable compositions
US20050048700A1 (en) 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US20040102529A1 (en) 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US7064173B2 (en) 2002-12-30 2006-06-20 General Electric Company Silicone condensation reaction
US7241851B2 (en) 2002-12-30 2007-07-10 Momentive Performance Materials Inc. Silicone condensation reaction
JP3952189B2 (ja) 2003-02-06 2007-08-01 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2007538070A (ja) 2004-05-20 2007-12-27 ゼネラル・エレクトリック・カンパニイ シリコーン縮合反応
US20060011295A1 (en) * 2004-07-14 2006-01-19 Karsten Danielmeier Aspartic ester functional compounds
US20060211836A1 (en) 2005-03-15 2006-09-21 General Electric Company Disproportionation of hydridosiloxanes and crosslinked polysiloxane network derived therefrom

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970130A (en) * 1958-01-07 1961-01-31 Westinghouse Electric Corp Catalysts for glycidyl polyethers, products produced thereby and method of producing said catalysts
US3347827A (en) * 1964-10-21 1967-10-17 Callery Chemical Co Epoxide resin composition containing an amine borane accelerator
US5106928A (en) * 1991-04-29 1992-04-21 National Starch And Chemical Investment Holding Corporation Acrylic adhesive composition and organoboron initiator system
EP0860458A2 (en) * 1993-03-23 1998-08-26 Reilly Industries, Inc. Bicyclic amidine based catalysts and use in thermosettable compositions
US5721183A (en) * 1995-03-10 1998-02-24 The Dow Chemical Company Catalyst system comprising amine or phosphine adducts of tris(organyl)borane compounds

Also Published As

Publication number Publication date
WO2007001803A3 (en) 2007-03-15
KR20080034438A (ko) 2008-04-21
EP1926554A2 (en) 2008-06-04
US8048819B2 (en) 2011-11-01
BRPI0612009A2 (pt) 2010-10-13
RU2008102366A (ru) 2009-07-27
CN101257973A (zh) 2008-09-03
WO2007001803A2 (en) 2007-01-04
US20060293172A1 (en) 2006-12-28
CN102786665A (zh) 2012-11-21
JP2008544067A (ja) 2008-12-04
KR101391784B1 (ko) 2014-05-07
EP2283922A2 (en) 2011-02-16
EP2283922A3 (en) 2013-07-03

Similar Documents

Publication Publication Date Title
CN101257973B (zh) 固化催化剂、组合物、电子器件和相关方法
JP4299140B2 (ja) ウエハレベル用の二重硬化ｂ−ステージ化可能なアンダーフィル
CN100342511C (zh) 晶片组装使用的填充不足的密封剂及其应用方法
CN1125488C (zh) 一种半导体封装用的液体环氧组合物及其用途
EP1818351B1 (en) Underfill encapsulant for wafer packaging and method for its application
KR20110081221A (ko) 리드프리 전도성 조성물 및 그 사용 방법
JP2014521754A (ja) 半導体封止用エポキシ樹脂組成物、それを用いた半導体装置及び半導体製造方法
CN106883805A (zh) 一种导热导电胶及其制备方法和用途
TW201137023A (en) Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
JP2008537761A (ja) 硬化システム、接着システム及び電子装置の製造方法
JP2003183351A (ja) 液状エポキシ樹脂組成物及び半導体装置
JP2012140574A (ja) マイクロカプセル型硬化剤および熱硬化性エポキシ樹脂組成物
TWI542628B (zh) 一液型環氧樹脂組成物
JP2008056891A (ja) マイクロカプセル型硬化剤およびこれを含有する硬化性樹脂組成物
CN108456501B (zh) 导电性粘接剂组合物
US8075721B2 (en) Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
KR101329695B1 (ko) 재작업이 가능한 에폭시 수지 조성물
JP2003183480A (ja) 液状エポキシ樹脂組成物及びフリップチップ型半導体装置
CN1831075A (zh) 包含苯并噁嗪的助熔不流动底层填料组合物
CN104918977A (zh) 环氧树脂、固化性树脂组合物和固化物
JP2005047974A (ja) アンダーフィル用封止剤組成物
Wang et al. Studies of latent catalyst systems for pot-life enhancement of flip chip underfills
Li Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
JP4341099B2 (ja) エポキシ樹脂組成物
JPH11145603A (ja) 電子部品仮止め用熱硬化性接着剤及びそれを用いた電子部品の固定化方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140730

Termination date: 20160609