BR112014003757A2 - composição de resina epóxi curável sem solvente, artigo e processo - Google Patents

composição de resina epóxi curável sem solvente, artigo e processo

Info

Publication number
BR112014003757A2
BR112014003757A2 BR112014003757A BR112014003757A BR112014003757A2 BR 112014003757 A2 BR112014003757 A2 BR 112014003757A2 BR 112014003757 A BR112014003757 A BR 112014003757A BR 112014003757 A BR112014003757 A BR 112014003757A BR 112014003757 A2 BR112014003757 A2 BR 112014003757A2
Authority
BR
Brazil
Prior art keywords
article
resin composition
epoxy resin
curable epoxy
solvent free
Prior art date
Application number
BR112014003757A
Other languages
English (en)
Inventor
I Padilla-Acevedo Angela
E Verghese Kandathl
Valette Ludovic
b wilson Mark
J Mullins Michael
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BR112014003757A2 publication Critical patent/BR112014003757A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
BR112014003757A 2011-08-18 2012-07-18 composição de resina epóxi curável sem solvente, artigo e processo BR112014003757A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161524917P 2011-08-18 2011-08-18
PCT/US2012/047146 WO2013025304A2 (en) 2011-08-18 2012-07-18 Curable resin compositions

Publications (1)

Publication Number Publication Date
BR112014003757A2 true BR112014003757A2 (pt) 2017-03-01

Family

ID=46604066

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014003757A BR112014003757A2 (pt) 2011-08-18 2012-07-18 composição de resina epóxi curável sem solvente, artigo e processo

Country Status (8)

Country Link
US (1) US9056942B2 (pt)
EP (1) EP2744843B1 (pt)
JP (1) JP2014528982A (pt)
CN (1) CN103764706B (pt)
BR (1) BR112014003757A2 (pt)
RU (1) RU2014110182A (pt)
TW (1) TWI554539B (pt)
WO (1) WO2013025304A2 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9617413B2 (en) * 2012-10-01 2017-04-11 Dow Global Technologies Llc Curable epoxy resin compositions
WO2014093116A2 (en) * 2012-12-14 2014-06-19 Dow Global Technologies Llc Curable compositions
JP2015017189A (ja) * 2013-07-11 2015-01-29 日東電工株式会社 封止シート製造ユニットおよび封止シートの製造方法
JP6198480B2 (ja) * 2013-06-26 2017-09-20 株式会社服部商店 硬化剤組成物、及びそれを用いたエポキシ樹脂の硬化物
US10518512B2 (en) * 2015-03-31 2019-12-31 3M Innovative Properties Company Method of forming dual-cure nanostructure transfer film
KR20180066107A (ko) * 2015-10-13 2018-06-18 다우 글로벌 테크놀로지스 엘엘씨 고처리량 제조 공정에서 사용하기 위한 속경화 에폭시 조성물
WO2018081165A1 (en) * 2016-10-25 2018-05-03 Arizona Board Of Regents On Behalf Of Arizona State University Solvent-less ionic liquid epoxy resin
WO2018181286A1 (ja) 2017-03-30 2018-10-04 日立化成株式会社 プリプレグの製造方法、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2017149995A (ja) * 2017-06-12 2017-08-31 株式会社服部商店 硬化剤組成物、及びそれを用いたエポキシ樹脂の硬化物
KR101898394B1 (ko) * 2017-11-01 2018-09-12 도레이첨단소재 주식회사 에폭시 수지 조성물을 포함하는 토우프레그
WO2020172191A1 (en) * 2019-02-18 2020-08-27 Board Of Regents On Behalf Of Arizona State University Arizona Solvent-less ionic liquid epoxy resin
JP7489775B2 (ja) * 2019-12-27 2024-05-24 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
CN114605355A (zh) * 2022-03-28 2022-06-10 国科广化(南雄)新材料研究院有限公司 一种二乙烯基芳烃二环氧化物及其固化产物的制备与应用
JP7478871B1 (ja) * 2023-02-28 2024-05-07 太陽ホールディングス株式会社 熱硬化性樹脂組成物、硬化物およびプリント配線板

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US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
GB854679A (en) * 1958-10-11 1960-11-23 Union Carbide Corp Improvements in and relating to polymerisable epoxide compositions
US2912389A (en) * 1957-08-08 1959-11-10 Union Carbide Corp Polymers of divinylbenzene dioxide
US2924580A (en) 1957-08-08 1960-02-09 Union Carbide Corp Divinyl benzene dioxide compositions
JPS6143617A (ja) * 1984-08-07 1986-03-03 Mitsubishi Rayon Co Ltd エポキシ樹脂組成物
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
JP2728106B2 (ja) * 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
US5350826A (en) * 1991-11-29 1994-09-27 Tonen Corporation Epoxy resin composition containing a polyaminoamide and a latent curing agent for fiber impregnation
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
WO2005118604A1 (en) 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
BRPI0516702A (pt) 2004-11-10 2008-09-16 Dow Global Technologies Inc composição de verniz de resina epóxi para laminados curável, processo para preparar uma composição de verniz para laminados de resina epóxi curável, processo para preparar um laminado, laminado e pré-impregnado
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Also Published As

Publication number Publication date
EP2744843A2 (en) 2014-06-25
WO2013025304A2 (en) 2013-02-21
EP2744843B1 (en) 2019-04-24
RU2014110182A (ru) 2015-09-27
TW201323472A (zh) 2013-06-16
WO2013025304A3 (en) 2013-08-22
JP2014528982A (ja) 2014-10-30
CN103764706B (zh) 2016-12-14
TWI554539B (zh) 2016-10-21
US20140212582A1 (en) 2014-07-31
US9056942B2 (en) 2015-06-16
CN103764706A (zh) 2014-04-30

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]
B25B Requested transfer of rights rejected

Owner name: DOW GLOBAL TECHNOLOGIES LLC (US)