JP2008511164A5 - - Google Patents
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- Publication number
- JP2008511164A5 JP2008511164A5 JP2007529785A JP2007529785A JP2008511164A5 JP 2008511164 A5 JP2008511164 A5 JP 2008511164A5 JP 2007529785 A JP2007529785 A JP 2007529785A JP 2007529785 A JP2007529785 A JP 2007529785A JP 2008511164 A5 JP2008511164 A5 JP 2008511164A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chuck
- chuck table
- unit
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200405166-0 | 2004-08-23 | ||
| SG200405166A SG120197A1 (en) | 2004-08-23 | 2004-08-23 | Supply mechanism for the chuck of an integrated circuit dicing device |
| SG200501802-3 | 2005-03-22 | ||
| SG200501802A SG125997A1 (en) | 2005-03-22 | 2005-03-22 | Improved chuck table for an integrated circuit dicing device |
| SG200505056A SG129327A1 (en) | 2005-07-15 | 2005-07-15 | Improved method and apparatus for an integrated circuit dicing device |
| SG200505056-2 | 2005-07-15 | ||
| PCT/SG2005/000288 WO2006022597A2 (en) | 2004-08-23 | 2005-08-23 | Supply mechanism for the chuck of an integrated circuit dicing device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008511164A JP2008511164A (ja) | 2008-04-10 |
| JP2008511164A5 true JP2008511164A5 (https=) | 2008-09-25 |
| JP5140428B2 JP5140428B2 (ja) | 2013-02-06 |
Family
ID=35967934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007529785A Expired - Lifetime JP5140428B2 (ja) | 2004-08-23 | 2005-08-23 | 集積回路ダイシング装置のチャック用供給機構 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7829383B2 (https=) |
| EP (1) | EP1789998B1 (https=) |
| JP (1) | JP5140428B2 (https=) |
| KR (1) | KR101299322B1 (https=) |
| CN (1) | CN101969038B (https=) |
| MY (1) | MY146842A (https=) |
| TW (1) | TWI387053B (https=) |
| WO (1) | WO2006022597A2 (https=) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG136833A1 (en) * | 2006-05-02 | 2007-11-29 | Rokko Systems Pte Ltd | An improved net table |
| US8011058B2 (en) * | 2006-10-31 | 2011-09-06 | Asm Assembly Automation Ltd | Singulation handler system for electronic packages |
| SG142198A1 (en) * | 2006-11-03 | 2008-05-28 | Rokko Systems Pte Ltd | A unit lifter assembly |
| SG143079A1 (en) * | 2006-11-14 | 2008-06-27 | Rokko Systems Pte Ltd | Net block assembly |
| US8167523B2 (en) * | 2007-07-12 | 2012-05-01 | Asm Assembly Automation Ltd | Singulation handler comprising vision system |
| JP2009200089A (ja) * | 2008-02-19 | 2009-09-03 | Towa Corp | 基板の切断方法及び装置 |
| SG156539A1 (en) * | 2008-04-14 | 2009-11-26 | Rokko Ventures Pte Ltd | A system and process for dicing integrated circuits |
| NL2001790C2 (nl) * | 2008-07-11 | 2010-01-12 | Fico Bv | Inrichting en werkwijze voor het zagen van elektronische componenten. |
| SG172499A1 (en) | 2009-12-23 | 2011-07-28 | Rokko Systems Pte Ltd | Assembly and method for ic unit engagement |
| JP5657935B2 (ja) * | 2010-07-08 | 2015-01-21 | 株式会社ディスコ | 切削装置 |
| KR101594965B1 (ko) * | 2010-09-10 | 2016-02-18 | 한미반도체 주식회사 | 반도체 패키지 싱귤레이션 장치 |
| KR20120108229A (ko) * | 2011-03-23 | 2012-10-05 | 삼성디스플레이 주식회사 | 레이저 가공용 워크 테이블 |
| KR101373393B1 (ko) * | 2012-07-31 | 2014-03-13 | 세메스 주식회사 | 회전식 기판 이송 레일 |
| KR101411157B1 (ko) * | 2012-07-31 | 2014-06-23 | 세메스 주식회사 | 기판 처리 장치 |
| ITTV20130048A1 (it) | 2013-04-10 | 2014-10-11 | Dario Toncelli | Macchina per il taglio di materiale in lastra |
| US10907247B2 (en) | 2014-08-13 | 2021-02-02 | Rokko Systems Pte Ltd | Apparatus and method for processing sputtered IC units |
| CN106206392B (zh) * | 2015-05-07 | 2021-04-30 | 梭特科技股份有限公司 | 晶粒定位布置设备以及晶粒定位布置方法 |
| TWI577624B (zh) | 2016-09-30 | 2017-04-11 | 均豪精密工業股份有限公司 | 翹曲板材搬送物流系統 |
| CN107195580B (zh) * | 2017-05-23 | 2023-05-05 | 商洛学院 | 一种可在不同衬底块同步生长的两用mocvd衬底架托盘结构 |
| JP7339858B2 (ja) * | 2019-11-08 | 2023-09-06 | 株式会社ディスコ | 加工装置及び板状ワークの搬入出方法 |
| US11107716B1 (en) * | 2020-02-06 | 2021-08-31 | Pyxis Cf Pte. Ltd. | Automation line for processing a molded panel |
| KR102274543B1 (ko) * | 2020-03-20 | 2021-07-07 | ㈜토니텍 | 쏘 앤 플레이스먼트 시스템 |
| CN112739003B (zh) * | 2020-11-09 | 2022-04-26 | 昆山丘钛光电科技有限公司 | 一种将fpc连板进行分板的方法及装置 |
| JP7723475B2 (ja) * | 2020-12-02 | 2025-08-14 | 株式会社ディスコ | 切削装置 |
| TWI820522B (zh) * | 2020-12-15 | 2023-11-01 | 新加坡商洛克系统私人有限公司 | Ic單元切割與分類之方法及系統 |
| JP7678083B2 (ja) * | 2021-03-18 | 2025-05-15 | Towa株式会社 | 加工装置、及び加工品の製造方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH635769A5 (fr) * | 1980-03-10 | 1983-04-29 | Far Fab Assortiments Reunies | Installation pour le sciage de plaques et dispositif de manutention pour une telle installation. |
| EP0186201B1 (en) * | 1984-12-27 | 1992-12-30 | Disco Abrasive Systems, Ltd. | Semiconductor wafer dicing machine |
| JPH0563057A (ja) * | 1991-08-30 | 1993-03-12 | Nec Kansai Ltd | 半導体製造装置 |
| JPH0783809B2 (ja) | 1992-07-02 | 1995-09-13 | 株式会社ヤマダコーポレーション | フィルタエレメント用クリーナ |
| JPH07240453A (ja) * | 1994-02-28 | 1995-09-12 | Seiko Seiki Co Ltd | 半導体ウエハ加工装置 |
| JPH07240452A (ja) * | 1994-02-28 | 1995-09-12 | Seiko Seiki Co Ltd | 半導体ウエハ加工装置 |
| US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
| JPH11111650A (ja) * | 1997-08-04 | 1999-04-23 | Hitachi Ltd | 半導体装置の製造方法、半導体装置およびその製造方法に用いる治具 |
| JP2000232080A (ja) * | 1999-02-10 | 2000-08-22 | Disco Abrasive Syst Ltd | 被加工物の分割システム及びペレットの移し替え装置 |
| WO2000061577A1 (de) | 1999-04-09 | 2000-10-19 | Basf Aktiengesellschaft | Prodrugs von thrombininhibitoren |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
| JP2001196328A (ja) * | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
| SG92702A1 (en) | 2000-05-08 | 2002-11-19 | Avalon Technology Pte Ltd | Singulation and sorting system for electronic devices |
| KR20020021556A (ko) * | 2000-09-15 | 2002-03-21 | 이해동 | 칩 사이즈 팩키지의 싱귤레이션 장치 및 방법 |
| KR100385876B1 (ko) | 2000-12-20 | 2003-06-02 | 한미반도체 주식회사 | 반도체 패키지장치 절단용 핸들러 시스템 |
| JP4696321B2 (ja) * | 2001-03-21 | 2011-06-08 | 株式会社東京精密 | ダイシング装置 |
| US6826986B2 (en) | 2001-05-05 | 2004-12-07 | Ah Beng Lim | Bi-directional singulation system and method |
| SG118084A1 (en) * | 2001-08-24 | 2006-01-27 | Micron Technology Inc | Method and apparatus for cutting semiconductor wafers |
| JP4309084B2 (ja) * | 2001-11-26 | 2009-08-05 | アピックヤマダ株式会社 | ダイシング装置 |
| JP3765265B2 (ja) | 2001-11-28 | 2006-04-12 | 株式会社東京精密 | ダイシング装置 |
| KR100445457B1 (ko) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | 웨이퍼 후면 검사 장치 및 검사 방법 |
| KR100483653B1 (ko) | 2002-11-19 | 2005-04-19 | 세크론 주식회사 | 소잉소터시스템 |
| US7485962B2 (en) * | 2002-12-10 | 2009-02-03 | Fujitsu Limited | Semiconductor device, wiring substrate forming method, and substrate processing apparatus |
| JP4489016B2 (ja) * | 2002-12-10 | 2010-06-23 | 富士通株式会社 | 配線基板の形成方法、配線薄膜の形成方法及び基板処理装置 |
| KR100479417B1 (ko) | 2003-03-31 | 2005-03-25 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 쏘잉 장치 및 그 제어방법 |
| JP4315788B2 (ja) | 2003-11-26 | 2009-08-19 | アピックヤマダ株式会社 | 半導体装置の製造方法及び製造装置 |
| KR20050063359A (ko) | 2003-12-22 | 2005-06-28 | 한미반도체 주식회사 | 반도체 패키지 이송 메카니즘 및 이송방법 |
| EP1743368A4 (en) | 2004-05-07 | 2009-01-28 | Hanmi Semiconductor Co Ltd | SAWING AND HANDLING SYSTEM FOR THE MANUFACTURE OF A SEMICONDUCTOR HOUSING |
| KR100749917B1 (ko) | 2004-12-07 | 2007-08-16 | 한미반도체 주식회사 | 반도체 패키지 제조공정용 절단 및 핸들러시스템 |
-
2005
- 2005-08-23 CN CN2010101501235A patent/CN101969038B/zh not_active Expired - Lifetime
- 2005-08-23 MY MYPI20053939A patent/MY146842A/en unknown
- 2005-08-23 KR KR1020077004327A patent/KR101299322B1/ko not_active Expired - Lifetime
- 2005-08-23 EP EP05771606.0A patent/EP1789998B1/en not_active Expired - Lifetime
- 2005-08-23 WO PCT/SG2005/000288 patent/WO2006022597A2/en not_active Ceased
- 2005-08-23 US US11/660,940 patent/US7829383B2/en active Active
- 2005-08-23 TW TW094128727A patent/TWI387053B/zh not_active IP Right Cessation
- 2005-08-23 JP JP2007529785A patent/JP5140428B2/ja not_active Expired - Lifetime
-
2010
- 2010-09-30 US US12/895,342 patent/US7939374B2/en not_active Expired - Lifetime
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