KR101299322B1 - 집적 회로 다이싱 장치의 척용 공급 메카니즘 - Google Patents

집적 회로 다이싱 장치의 척용 공급 메카니즘 Download PDF

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Publication number
KR101299322B1
KR101299322B1 KR1020077004327A KR20077004327A KR101299322B1 KR 101299322 B1 KR101299322 B1 KR 101299322B1 KR 1020077004327 A KR1020077004327 A KR 1020077004327A KR 20077004327 A KR20077004327 A KR 20077004327A KR 101299322 B1 KR101299322 B1 KR 101299322B1
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KR
South Korea
Prior art keywords
substrate
unit
chuck
chuck table
net
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020077004327A
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English (en)
Korean (ko)
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KR20070048737A (ko
Inventor
양해춘
Original Assignee
록코 시스템즈 피티이 리미티드
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Filing date
Publication date
Priority claimed from SG200405166A external-priority patent/SG120197A1/en
Priority claimed from SG200501802A external-priority patent/SG125997A1/en
Priority claimed from SG200505056A external-priority patent/SG129327A1/en
Application filed by 록코 시스템즈 피티이 리미티드 filed Critical 록코 시스템즈 피티이 리미티드
Publication of KR20070048737A publication Critical patent/KR20070048737A/ko
Application granted granted Critical
Publication of KR101299322B1 publication Critical patent/KR101299322B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077004327A 2004-08-23 2005-08-23 집적 회로 다이싱 장치의 척용 공급 메카니즘 Expired - Lifetime KR101299322B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
SG200405166-0 2004-08-23
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
SG200501802-3 2005-03-22
SG200501802A SG125997A1 (en) 2005-03-22 2005-03-22 Improved chuck table for an integrated circuit dicing device
SG200505056A SG129327A1 (en) 2005-07-15 2005-07-15 Improved method and apparatus for an integrated circuit dicing device
SG200505056-2 2005-07-15
PCT/SG2005/000288 WO2006022597A2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device

Publications (2)

Publication Number Publication Date
KR20070048737A KR20070048737A (ko) 2007-05-09
KR101299322B1 true KR101299322B1 (ko) 2013-08-26

Family

ID=35967934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077004327A Expired - Lifetime KR101299322B1 (ko) 2004-08-23 2005-08-23 집적 회로 다이싱 장치의 척용 공급 메카니즘

Country Status (8)

Country Link
US (2) US7829383B2 (https=)
EP (1) EP1789998B1 (https=)
JP (1) JP5140428B2 (https=)
KR (1) KR101299322B1 (https=)
CN (1) CN101969038B (https=)
MY (1) MY146842A (https=)
TW (1) TWI387053B (https=)
WO (1) WO2006022597A2 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG136833A1 (en) * 2006-05-02 2007-11-29 Rokko Systems Pte Ltd An improved net table
US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
SG142198A1 (en) * 2006-11-03 2008-05-28 Rokko Systems Pte Ltd A unit lifter assembly
SG143079A1 (en) * 2006-11-14 2008-06-27 Rokko Systems Pte Ltd Net block assembly
US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
JP2009200089A (ja) * 2008-02-19 2009-09-03 Towa Corp 基板の切断方法及び装置
SG156539A1 (en) * 2008-04-14 2009-11-26 Rokko Ventures Pte Ltd A system and process for dicing integrated circuits
NL2001790C2 (nl) * 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
SG172499A1 (en) 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5657935B2 (ja) * 2010-07-08 2015-01-21 株式会社ディスコ 切削装置
KR101594965B1 (ko) * 2010-09-10 2016-02-18 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
KR101373393B1 (ko) * 2012-07-31 2014-03-13 세메스 주식회사 회전식 기판 이송 레일
KR101411157B1 (ko) * 2012-07-31 2014-06-23 세메스 주식회사 기판 처리 장치
ITTV20130048A1 (it) 2013-04-10 2014-10-11 Dario Toncelli Macchina per il taglio di materiale in lastra
US10907247B2 (en) 2014-08-13 2021-02-02 Rokko Systems Pte Ltd Apparatus and method for processing sputtered IC units
CN106206392B (zh) * 2015-05-07 2021-04-30 梭特科技股份有限公司 晶粒定位布置设备以及晶粒定位布置方法
TWI577624B (zh) 2016-09-30 2017-04-11 均豪精密工業股份有限公司 翹曲板材搬送物流系統
CN107195580B (zh) * 2017-05-23 2023-05-05 商洛学院 一种可在不同衬底块同步生长的两用mocvd衬底架托盘结构
JP7339858B2 (ja) * 2019-11-08 2023-09-06 株式会社ディスコ 加工装置及び板状ワークの搬入出方法
US11107716B1 (en) * 2020-02-06 2021-08-31 Pyxis Cf Pte. Ltd. Automation line for processing a molded panel
KR102274543B1 (ko) * 2020-03-20 2021-07-07 ㈜토니텍 쏘 앤 플레이스먼트 시스템
CN112739003B (zh) * 2020-11-09 2022-04-26 昆山丘钛光电科技有限公司 一种将fpc连板进行分板的方法及装置
JP7723475B2 (ja) * 2020-12-02 2025-08-14 株式会社ディスコ 切削装置
TWI820522B (zh) * 2020-12-15 2023-11-01 新加坡商洛克系统私人有限公司 Ｉｃ單元切割與分類之方法及系統
JP7678083B2 (ja) * 2021-03-18 2025-05-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111650A (ja) * 1997-08-04 1999-04-23 Hitachi Ltd 半導体装置の製造方法、半導体装置およびその製造方法に用いる治具
JP2002110590A (ja) * 2000-09-15 2002-04-12 Kaito Ri チップサイズパッケージのシンギュロライジング装置及び方法
WO2004053967A1 (ja) * 2002-12-10 2004-06-24 Fujitsu Limited 半導体装置、配線基板の形成方法及び基板処理装置
JP2004304194A (ja) * 2003-03-31 2004-10-28 Hanmi Semiconductor 半導体パッケージ作製工程用ソーイング装置及びその制御方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.
EP0186201B1 (en) * 1984-12-27 1992-12-30 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
JPH0563057A (ja) * 1991-08-30 1993-03-12 Nec Kansai Ltd 半導体製造装置
JPH0783809B2 (ja) 1992-07-02 1995-09-13 株式会社ヤマダコーポレーション フィルタエレメント用クリーナ
JPH07240453A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
JPH07240452A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
JP2000232080A (ja) * 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
WO2000061577A1 (de) 1999-04-09 2000-10-19 Basf Aktiengesellschaft Prodrugs von thrombininhibitoren
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
SG92702A1 (en) 2000-05-08 2002-11-19 Avalon Technology Pte Ltd Singulation and sorting system for electronic devices
KR100385876B1 (ko) 2000-12-20 2003-06-02 한미반도체 주식회사 반도체 패키지장치 절단용 핸들러 시스템
JP4696321B2 (ja) * 2001-03-21 2011-06-08 株式会社東京精密 ダイシング装置
US6826986B2 (en) 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
JP4309084B2 (ja) * 2001-11-26 2009-08-05 アピックヤマダ株式会社 ダイシング装置
JP3765265B2 (ja) 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
KR100445457B1 (ko) * 2002-02-25 2004-08-21 삼성전자주식회사 웨이퍼 후면 검사 장치 및 검사 방법
KR100483653B1 (ko) 2002-11-19 2005-04-19 세크론 주식회사 소잉소터시스템
US7485962B2 (en) * 2002-12-10 2009-02-03 Fujitsu Limited Semiconductor device, wiring substrate forming method, and substrate processing apparatus
JP4315788B2 (ja) 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
KR20050063359A (ko) 2003-12-22 2005-06-28 한미반도체 주식회사 반도체 패키지 이송 메카니즘 및 이송방법
EP1743368A4 (en) 2004-05-07 2009-01-28 Hanmi Semiconductor Co Ltd SAWING AND HANDLING SYSTEM FOR THE MANUFACTURE OF A SEMICONDUCTOR HOUSING
KR100749917B1 (ko) 2004-12-07 2007-08-16 한미반도체 주식회사 반도체 패키지 제조공정용 절단 및 핸들러시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111650A (ja) * 1997-08-04 1999-04-23 Hitachi Ltd 半導体装置の製造方法、半導体装置およびその製造方法に用いる治具
JP2002110590A (ja) * 2000-09-15 2002-04-12 Kaito Ri チップサイズパッケージのシンギュロライジング装置及び方法
WO2004053967A1 (ja) * 2002-12-10 2004-06-24 Fujitsu Limited 半導体装置、配線基板の形成方法及び基板処理装置
JP2004304194A (ja) * 2003-03-31 2004-10-28 Hanmi Semiconductor 半導体パッケージ作製工程用ソーイング装置及びその制御方法

Also Published As

Publication number Publication date
US20080213975A1 (en) 2008-09-04
JP2008511164A (ja) 2008-04-10
EP1789998A4 (en) 2011-09-14
WO2006022597A3 (en) 2006-08-31
TWI387053B (zh) 2013-02-21
MY146842A (en) 2012-09-28
WO2006022597A2 (en) 2006-03-02
US7939374B2 (en) 2011-05-10
KR20070048737A (ko) 2007-05-09
US7829383B2 (en) 2010-11-09
CN101969038B (zh) 2012-02-15
US20110021003A1 (en) 2011-01-27
JP5140428B2 (ja) 2013-02-06
EP1789998B1 (en) 2014-04-09
EP1789998A2 (en) 2007-05-30
CN101969038A (zh) 2011-02-09

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