TWI387053B - 用於積體電路切割裝置之夾盤的供給機構 - Google Patents

用於積體電路切割裝置之夾盤的供給機構 Download PDF

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Publication number
TWI387053B
TWI387053B TW094128727A TW94128727A TWI387053B TW I387053 B TWI387053 B TW I387053B TW 094128727 A TW094128727 A TW 094128727A TW 94128727 A TW94128727 A TW 94128727A TW I387053 B TWI387053 B TW I387053B
Authority
TW
Taiwan
Prior art keywords
chuck
substrate
unit
cutting
chuck table
Prior art date
Application number
TW094128727A
Other languages
English (en)
Chinese (zh)
Inventor
楊海春
Original Assignee
洛可系統私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200405166A external-priority patent/SG120197A1/en
Priority claimed from SG200501802A external-priority patent/SG125997A1/en
Priority claimed from SG200505056A external-priority patent/SG129327A1/en
Application filed by 洛可系統私人有限公司 filed Critical 洛可系統私人有限公司
Application granted granted Critical
Publication of TWI387053B publication Critical patent/TWI387053B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094128727A 2004-08-23 2005-08-23 用於積體電路切割裝置之夾盤的供給機構 TWI387053B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
SG200501802A SG125997A1 (en) 2005-03-22 2005-03-22 Improved chuck table for an integrated circuit dicing device
SG200505056A SG129327A1 (en) 2005-07-15 2005-07-15 Improved method and apparatus for an integrated circuit dicing device

Publications (1)

Publication Number Publication Date
TWI387053B true TWI387053B (zh) 2013-02-21

Family

ID=35967934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128727A TWI387053B (zh) 2004-08-23 2005-08-23 用於積體電路切割裝置之夾盤的供給機構

Country Status (8)

Country Link
US (2) US7829383B2 (https=)
EP (1) EP1789998B1 (https=)
JP (1) JP5140428B2 (https=)
KR (1) KR101299322B1 (https=)
CN (1) CN101969038B (https=)
MY (1) MY146842A (https=)
TW (1) TWI387053B (https=)
WO (1) WO2006022597A2 (https=)

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US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
JP2009200089A (ja) * 2008-02-19 2009-09-03 Towa Corp 基板の切断方法及び装置
SG156539A1 (en) * 2008-04-14 2009-11-26 Rokko Ventures Pte Ltd A system and process for dicing integrated circuits
NL2001790C2 (nl) * 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
SG172499A1 (en) 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5657935B2 (ja) * 2010-07-08 2015-01-21 株式会社ディスコ 切削装置
KR101594965B1 (ko) * 2010-09-10 2016-02-18 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
KR101373393B1 (ko) * 2012-07-31 2014-03-13 세메스 주식회사 회전식 기판 이송 레일
KR101411157B1 (ko) * 2012-07-31 2014-06-23 세메스 주식회사 기판 처리 장치
ITTV20130048A1 (it) 2013-04-10 2014-10-11 Dario Toncelli Macchina per il taglio di materiale in lastra
US10907247B2 (en) 2014-08-13 2021-02-02 Rokko Systems Pte Ltd Apparatus and method for processing sputtered IC units
CN106206392B (zh) * 2015-05-07 2021-04-30 梭特科技股份有限公司 晶粒定位布置设备以及晶粒定位布置方法
TWI577624B (zh) 2016-09-30 2017-04-11 均豪精密工業股份有限公司 翹曲板材搬送物流系統
CN107195580B (zh) * 2017-05-23 2023-05-05 商洛学院 一种可在不同衬底块同步生长的两用mocvd衬底架托盘结构
JP7339858B2 (ja) * 2019-11-08 2023-09-06 株式会社ディスコ 加工装置及び板状ワークの搬入出方法
US11107716B1 (en) * 2020-02-06 2021-08-31 Pyxis Cf Pte. Ltd. Automation line for processing a molded panel
KR102274543B1 (ko) * 2020-03-20 2021-07-07 ㈜토니텍 쏘 앤 플레이스먼트 시스템
CN112739003B (zh) * 2020-11-09 2022-04-26 昆山丘钛光电科技有限公司 一种将fpc连板进行分板的方法及装置
JP7723475B2 (ja) * 2020-12-02 2025-08-14 株式会社ディスコ 切削装置
TWI820522B (zh) * 2020-12-15 2023-11-01 新加坡商洛克系统私人有限公司 Ｉｃ單元切割與分類之方法及系統
JP7678083B2 (ja) * 2021-03-18 2025-05-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

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US20030159528A1 (en) * 2002-02-25 2003-08-28 Samsung Electronics Apparatus and method for wafer backside inspection
US20030203538A1 (en) * 2001-08-24 2003-10-30 Peng Neo Chee Method and apparatus for cutting semiconductor wafers
WO2004053967A1 (ja) * 2002-12-10 2004-06-24 Fujitsu Limited 半導体装置、配線基板の形成方法及び基板処理装置

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US4407262A (en) * 1980-03-10 1983-10-04 Les Fabriques D'assortiments Reunies S.A. Wafer dicing apparatus
US20030203538A1 (en) * 2001-08-24 2003-10-30 Peng Neo Chee Method and apparatus for cutting semiconductor wafers
US20030159528A1 (en) * 2002-02-25 2003-08-28 Samsung Electronics Apparatus and method for wafer backside inspection
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Also Published As

Publication number Publication date
US20080213975A1 (en) 2008-09-04
JP2008511164A (ja) 2008-04-10
EP1789998A4 (en) 2011-09-14
WO2006022597A3 (en) 2006-08-31
MY146842A (en) 2012-09-28
WO2006022597A2 (en) 2006-03-02
US7939374B2 (en) 2011-05-10
KR101299322B1 (ko) 2013-08-26
KR20070048737A (ko) 2007-05-09
US7829383B2 (en) 2010-11-09
CN101969038B (zh) 2012-02-15
US20110021003A1 (en) 2011-01-27
JP5140428B2 (ja) 2013-02-06
EP1789998B1 (en) 2014-04-09
EP1789998A2 (en) 2007-05-30
CN101969038A (zh) 2011-02-09

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