JP5140428B2 - 集積回路ダイシング装置のチャック用供給機構 - Google Patents

集積回路ダイシング装置のチャック用供給機構 Download PDF

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Publication number
JP5140428B2
JP5140428B2 JP2007529785A JP2007529785A JP5140428B2 JP 5140428 B2 JP5140428 B2 JP 5140428B2 JP 2007529785 A JP2007529785 A JP 2007529785A JP 2007529785 A JP2007529785 A JP 2007529785A JP 5140428 B2 JP5140428 B2 JP 5140428B2
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JP
Japan
Prior art keywords
chuck
substrate
unit
chuck table
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007529785A
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English (en)
Japanese (ja)
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JP2008511164A (ja
JP2008511164A5 (https=
Inventor
ヤン・ヘチョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rokko Systems Pte Ltd
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200405166A external-priority patent/SG120197A1/en
Priority claimed from SG200501802A external-priority patent/SG125997A1/en
Priority claimed from SG200505056A external-priority patent/SG129327A1/en
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Publication of JP2008511164A publication Critical patent/JP2008511164A/ja
Publication of JP2008511164A5 publication Critical patent/JP2008511164A5/ja
Application granted granted Critical
Publication of JP5140428B2 publication Critical patent/JP5140428B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007529785A 2004-08-23 2005-08-23 集積回路ダイシング装置のチャック用供給機構 Expired - Lifetime JP5140428B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
SG200405166-0 2004-08-23
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
SG200501802-3 2005-03-22
SG200501802A SG125997A1 (en) 2005-03-22 2005-03-22 Improved chuck table for an integrated circuit dicing device
SG200505056A SG129327A1 (en) 2005-07-15 2005-07-15 Improved method and apparatus for an integrated circuit dicing device
SG200505056-2 2005-07-15
PCT/SG2005/000288 WO2006022597A2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device

Publications (3)

Publication Number Publication Date
JP2008511164A JP2008511164A (ja) 2008-04-10
JP2008511164A5 JP2008511164A5 (https=) 2008-09-25
JP5140428B2 true JP5140428B2 (ja) 2013-02-06

Family

ID=35967934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007529785A Expired - Lifetime JP5140428B2 (ja) 2004-08-23 2005-08-23 集積回路ダイシング装置のチャック用供給機構

Country Status (8)

Country Link
US (2) US7829383B2 (https=)
EP (1) EP1789998B1 (https=)
JP (1) JP5140428B2 (https=)
KR (1) KR101299322B1 (https=)
CN (1) CN101969038B (https=)
MY (1) MY146842A (https=)
TW (1) TWI387053B (https=)
WO (1) WO2006022597A2 (https=)

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US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
JP2009200089A (ja) * 2008-02-19 2009-09-03 Towa Corp 基板の切断方法及び装置
SG156539A1 (en) * 2008-04-14 2009-11-26 Rokko Ventures Pte Ltd A system and process for dicing integrated circuits
NL2001790C2 (nl) * 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
SG172499A1 (en) 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5657935B2 (ja) * 2010-07-08 2015-01-21 株式会社ディスコ 切削装置
KR101594965B1 (ko) * 2010-09-10 2016-02-18 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
KR101373393B1 (ko) * 2012-07-31 2014-03-13 세메스 주식회사 회전식 기판 이송 레일
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ITTV20130048A1 (it) 2013-04-10 2014-10-11 Dario Toncelli Macchina per il taglio di materiale in lastra
US10907247B2 (en) 2014-08-13 2021-02-02 Rokko Systems Pte Ltd Apparatus and method for processing sputtered IC units
CN106206392B (zh) * 2015-05-07 2021-04-30 梭特科技股份有限公司 晶粒定位布置设备以及晶粒定位布置方法
TWI577624B (zh) 2016-09-30 2017-04-11 均豪精密工業股份有限公司 翹曲板材搬送物流系統
CN107195580B (zh) * 2017-05-23 2023-05-05 商洛学院 一种可在不同衬底块同步生长的两用mocvd衬底架托盘结构
JP7339858B2 (ja) * 2019-11-08 2023-09-06 株式会社ディスコ 加工装置及び板状ワークの搬入出方法
US11107716B1 (en) * 2020-02-06 2021-08-31 Pyxis Cf Pte. Ltd. Automation line for processing a molded panel
KR102274543B1 (ko) * 2020-03-20 2021-07-07 ㈜토니텍 쏘 앤 플레이스먼트 시스템
CN112739003B (zh) * 2020-11-09 2022-04-26 昆山丘钛光电科技有限公司 一种将fpc连板进行分板的方法及装置
JP7723475B2 (ja) * 2020-12-02 2025-08-14 株式会社ディスコ 切削装置
TWI820522B (zh) * 2020-12-15 2023-11-01 新加坡商洛克系统私人有限公司 Ｉｃ單元切割與分類之方法及系統
JP7678083B2 (ja) * 2021-03-18 2025-05-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

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Also Published As

Publication number Publication date
US20080213975A1 (en) 2008-09-04
JP2008511164A (ja) 2008-04-10
EP1789998A4 (en) 2011-09-14
WO2006022597A3 (en) 2006-08-31
TWI387053B (zh) 2013-02-21
MY146842A (en) 2012-09-28
WO2006022597A2 (en) 2006-03-02
US7939374B2 (en) 2011-05-10
KR101299322B1 (ko) 2013-08-26
KR20070048737A (ko) 2007-05-09
US7829383B2 (en) 2010-11-09
CN101969038B (zh) 2012-02-15
US20110021003A1 (en) 2011-01-27
EP1789998B1 (en) 2014-04-09
EP1789998A2 (en) 2007-05-30
CN101969038A (zh) 2011-02-09

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