JP2008311371A - 接合方法及び接合体 - Google Patents
接合方法及び接合体 Download PDFInfo
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- JP2008311371A JP2008311371A JP2007156818A JP2007156818A JP2008311371A JP 2008311371 A JP2008311371 A JP 2008311371A JP 2007156818 A JP2007156818 A JP 2007156818A JP 2007156818 A JP2007156818 A JP 2007156818A JP 2008311371 A JP2008311371 A JP 2008311371A
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- bonding
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Abstract
【解決手段】第1部材における金属からなる第1接合部と、第2部材における金属からなる第2接合部との間に、金属ナノ粒子を有機溶媒中に分散してなる金属ペーストを介在させ、該金属ペーストを少なくとも加熱して金属ナノ粒子を焼結し、内部に空孔を有する接合部材として第1接合部と第2接合部を接合する接合方法であって、金属ペーストの構成条件及び金属ナノ粒子の焼結条件の少なくとも1つを調整することで、第1接合部と第2接合部との間に、空孔の占める割合である空孔率が互いに異なる複数種類の接合層を、隣接する接合層で空孔率が互いに異なるように積層形成して接合部材とする。
【選択図】図2
Description
することができる。
(第1実施形態)
図1は、本発明の第1実施形態に係る接合体の概略構成を示す断面図である。図1に示すように、接合体100は、2つの部材110、120を、接合部材130を用いて接合してなるものである。2つの部材110、120としては、金属からなる接合部材130との接合部111、121をそれぞれ有するものであれば採用することができる。
図3は、第2実施形態に係る接合体の概略構成を示す断面図である。図4は、図3に示す接合体の形成方法(接合方法)の一例を示す工程別の断面図であり、(a)は第2接合層の形成時、(b)は第2接合層の形成後、(c)は第1接合層の形成時、(d)は第1接合層の形成後を示している。なお、上述した構成要素と同一の構成要素には、同一の符号を付与するものとする。
図5は、第3実施形態に係る接合体の概略構成を示す断面図である。なお、上述した構成要素と同一の構成要素には、同一の符号を付与するものとする。
図7は、第4実施形態に係る接合体の概略構成を示す図であり、(a)は断面図、(b)は接合部材の平面図である。図8は、図7に示す接合体の形成方法(接合方法)の一例を示す工程別の断面図であり、(a)は加熱時、(b)は加熱後を示している。なお、上述した構成要素と同一の構成要素には、同一の符号を付与するものとする。
100・・・接合体
110・・・第1部材
111・・・接合部(第1接合部)
120・・・第2部材
121・・・接合部(第2接合部)
130・・・接合部材
131・・・第1接合層
132・・・第2接合層
135・・・第3接合層
134、134・・・金属ペースト層
Claims (18)
- 第1部材における金属からなる第1接合部と、第2部材における金属からなる第2接合部との間に、金属ナノ粒子を有機溶媒中に分散してなる金属ペーストを介在させ、
前記金属ペーストを少なくとも加熱して前記金属ナノ粒子を焼結し、内部に空孔を有する接合部材として前記第1接合部と前記第2接合部を接合する接合方法であって、
前記金属ペーストの構成条件及び前記金属ナノ粒子の焼結条件の少なくとも1つを調整することで、前記第1接合部と前記第2接合部との間に、前記空孔の占める割合である空孔率が互いに異なる複数種類の接合層を、隣接する前記接合層で空孔率が互いに異なるように積層形成して前記接合部材とすることを特徴とする接合方法。 - 前記金属ペーストの配置及び前記金属ナノ粒子の焼結を、前記金属ペーストの構成条件及び前記金属ナノ粒子の焼結条件の少なくとも1つを変えて複数回実行し、
前記第1部材と前記第2部材の積層方向において、前記焼結回数に応じて、前記接合層を多層に形成することを特徴とする請求項1に記載の接合方法。 - 前記第1接合部及び前記第2接合部の少なくとも一方に隣接して前記接合層を形成し、
形成された前記接合層に隣接して、前記接合層よりも空孔率の小さい接合層を積層形成することを特徴とする請求項2に記載の接合方法。 - 前記第1接合部及び前記第2接合部の少なくとも一方に隣接して前記接合層を形成し、
形成された前記接合層に隣接して、前記接合層よりも空孔率の大きい接合層を積層形成することを特徴とする請求項2に記載の接合方法。 - 前記積層方向に垂直な方向において、空孔率の最も大きい接合層が、前記接合部材における第1接合部及び第2接合部との接触面を除く外周面の一部となるように、複数種類の前記接合層を形成し、
前記積層方向において、並設された複数種類の前記接合層に隣接して、複数種類の前記接合層とは空孔率の異なるベタ状の接合層を形成することを特徴とする請求項2〜4いずれか1項に記載の接合方法。 - 前記金属ペーストの構成条件及び前記金属ナノ粒子の焼結条件の少なくとも1つを部分的に変えることにより、前記第1部材と前記第2部材の積層方向に垂直な方向において、空孔率の最も大きい接合層が、前記接合部材における第1接合部及び第2接合部との接触面を除く外周面の一部となるように、複数種類の前記接合層を同時に形成することを特徴とする請求項1〜4いずれか1項に記載の接合方法。
- 前記金属ナノ粒子の焼結条件として、前記金属ペーストの加熱温度及び加熱時間の少なくとも一方を含むことを特徴とする請求項1〜6いずれか1項に記載の接合方法。
- 前記金属ナノ粒子の焼結条件として、外部から前記金属ペーストに印加する圧力を含むことを特徴とする請求項1〜7いずれか1項に記載の接合方法。
- 前記金属ナノ粒子の焼結条件として、外部から前記金属ペーストに印加する超音波振動のエネルギーの大きさを含むことを特徴とする請求項1〜8いずれか1項に記載の接合方法。
- 前記金属ペーストの構成条件として、前記金属ナノ粒子の平均粒径を含むことを特徴とする請求項1〜9いずれか1項に記載の接合方法。
- 前記金属ペーストの構成条件として、前記金属ナノ粒子と前記有機溶媒との混合比を含むことを特徴とする請求項1〜10いずれか1項に記載の接合方法。
- 前記金属ペーストの構成条件として、前記金属ナノ粒子よりも大きい金属部材の混入量を含むことを特徴とする請求項1〜11いずれか1項に記載の接合方法。
- 第1部材における金属からなる第1接合部と、
第2部材における金属からなる第2接合部とが、
金属ナノ粒子の焼結体であり、内部に空孔を有する接合部材を介して接合された接合体であって、
前記接合部材は、前記空孔の占める割合である空孔率が異なる複数種類の接合層を、隣接する前記接合層で空孔率が互いに異なるよう多層に配置して構成されていることを特徴とする接合体。 - 前記接合部材において、前記接合層が、少なくとも前記第1部材と前記第2部材の積層方向に多層に積層されていることを特徴とする請求項13に記載の接合体。
- 前記接合部材は、前記第1接合部及び前記第2接合部の一方に隣接する接合層と、前記第1接合部及び前記第2接合部の他方及び前記接合層に隣接する前記接合層よりも空孔率の大きい接合層の2層構造とされていることを特徴とする請求項14に記載の接合体。
- 前記接合部材は、前記接合層が、前記第1接合部と前記第2接合部の一方から他方に向けて、空孔率が小さい順、又は、空孔率が大きい順に多層に積層されて構成されていることを特徴とする請求項14又は請求項15に記載の接合体。
- 前記接合部材は、前記第1接合部に隣接する接合層と、前記第2接合部に隣接する接合層との間に、2つの前記接合層よりも空孔率の大きい接合層が介在された3層構造とされていることを特徴とする請求項14に記載の接合体。
- 前記接合部材において、前記接合層が、前記第1部材と前記第2部材の積層方向に垂直な方向に並設され、
並設された前記接合層のうち、空孔率の最も大きい接合層が、前記接合部材における第1接合部及び第2接合部との接触面を除く外周面の一部とされていることを特徴とする請求項13又は請求項14に記載の接合体。
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