JP7127269B2 - 部材接続方法 - Google Patents
部材接続方法 Download PDFInfo
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- JP7127269B2 JP7127269B2 JP2017204686A JP2017204686A JP7127269B2 JP 7127269 B2 JP7127269 B2 JP 7127269B2 JP 2017204686 A JP2017204686 A JP 2017204686A JP 2017204686 A JP2017204686 A JP 2017204686A JP 7127269 B2 JP7127269 B2 JP 7127269B2
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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Description
まず、第1実施形態に係る部材接続方法により接続されてなる接続体の一例について説明する。図1は、第1実施形態に係る部材接続方法により接続されてなる接続体1の模式断面図である。
銅焼結体における銅の緻密度(体積%)=[(M1)/8.96]×100・・・(A)
本実施形態の接続用銅ペーストは、金属粒子と、分散媒と、を含むことができる。
サブマイクロ銅粒子としては、粒径が0.12μm以上0.8μm以下の銅粒子を含むものが挙げられ、たとえば、体積平均粒径が0.12μm以上0.8μm以下のサブマイクロ銅粒子を用いることができる。サブマイクロ銅粒子の体積平均粒径が0.12μm以上であれば、サブマイクロ銅粒子の合成コストの抑制、良好な分散性、表面処理剤の使用量の抑制といった効果が得られ易くなる。サブマイクロ銅粒子の体積平均粒径が0.8μm以下であれば、サブマイクロ銅粒子の焼結性が優れるという効果が得られ易くなる。よりいっそう上記効果を奏するという観点から、サブマイクロ銅粒子の体積平均粒径は、0.15μm以上0.8μm以下であってもよく、0.15μm以上0.6μm以下であってもよく、0.2μm以上0.5μm以下であってもよく、0.3μm以上0.45μm以下であってもよい。
マイクロ銅粒子としては、粒径が2μm以上50μm以下の銅粒子を含むものが挙げられ、たとえば、体積平均粒径が2μm以上50μm以下の銅粒子を用いることができる。マイクロ銅粒子の体積平均粒径が上記範囲内であれば、接続用銅ペーストを焼結した際の体積収縮を充分に低減でき、接続用銅ペーストを焼結させて製造される接続体の接続強度を確保することが容易となる。接続用銅ペーストを半導体素子の接続に用いる場合、マイクロ銅粒子の体積平均粒径が上記範囲内であれば、半導体装置が良好なダイシェア強度及び接続信頼性を示す傾向にある。より一層上記効果を奏するという観点から、マイクロ銅粒子の体積平均粒径は、3μm以上20μm以下であってもよく、3μm以上10μm以下であってもよい。
金属粒子としては、サブマイクロ銅粒子及びマイクロ銅粒子以外のその他の金属粒子を含んでいてもよく、たとえば、ニッケル、銀、金、パラジウム、白金などの粒子を含んでいてもよい。その他の金属粒子は、体積平均粒径が0.01μm以上10μm以下であってもよく、0.01μm以上5μm以下であってもよく、0.05μm以上3μm以下であってもよい。その他の金属粒子を含んでいる場合、その含有量は、充分な接続性を得るという観点から、金属粒子の全質量を基準として、20質量%未満であってもよく、10質量%以下であってもよい。その他の金属粒子は、含まれなくてもよい。その他の金属粒子の形状は、特に限定されるものではない。
分散媒は特に限定されるものではなく、揮発性のものであってもよい。揮発性の分散媒としては、たとえば、ペンタノール、ヘキサノール、ヘプタノール、オクタノール、デカノール、エチレングリコール、ジエチレングリコール、プロピレングリコール、ブチレングリコール、α-テルピネオール、イソボルニルシクロヘキサノール(MTPH)などの一価及び多価アルコール類;エチレングリコールブチルエーテル、エチレングリコールフェニルエーテル、ジエチレングリコールメチルエーテル、ジエチレングリコールエチルエーテル、ジエチレングリコールブチルエーテル、ジエチレングリコールイソブチルエーテル、ジエチレングリコールヘキシルエーテル、トリエチレングリコールメチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールジブチルエーテル、ジエチレングリコールブチルメチルエーテル、ジエチレングリコールイソプロピルメチルエーテル、トリエチレングリコールジメチルエーテル、トリエチレングリコールブチルメチルエーテル、プロピレングリコールプロピルエーテル、ジプロピレングリコールメチルエーテル、ジプロピレングリコールエチルエーテル、ジプロピレングリコールプロピルエーテル、ジプロピレングリコールブチルエーテル、ジプロピレングリコールジメチルエーテル、トリプロピレングリコールメチルエーテル、トリプロピレングリコールジメチルエーテルなどのエーテル類;エチレングリコールエチルエーテルアセテート、エチレングリコールブチルエーテルアセテート、ジエチレングリコールエチルエーテルアセテート、ジエチレングリコールブチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテート(DPMA)、乳酸エチル、乳酸ブチル、トリブチリン、ステアリン酸ブチル、スクアラン、セバシン酸ジプチル、アジピン酸ビス(2―エチルヘキシル)、γ-ブチロラクトン、炭酸プロピレンなどのエステル類;N-メチル-2-ピロリドン、N,N-ジメチルアセトアミド、N,N-ジメチルホルムアミドなどの酸アミド;シクロヘキサン、オクタン、ノナン、デカン、ウンデカンなどの脂肪族炭化水素;ベンゼン、トルエン、キシレンなどの芳香族炭化水素;炭素数1~18のアルキル基を有するメルカプタン類;炭素数5~7のシクロアルキル基を有するメルカプタン類が挙げられる。炭素数1~18のアルキル基を有するメルカプタン類としては、たとえば、エチルメルカプタン、n-プロピルメルカプタン、i-プロピルメルカプタン、n-ブチルメルカプタン、i-ブチルメルカプタン、t-ブチルメルカプタン、ペンチルメルカプタン、ヘキシルメルカプタン及びドデシルメルカプタンが挙げられる。炭素数5~7のシクロアルキル基を有するメルカプタン類としては、たとえば、シクロペンチルメルカプタン、シクロヘキシルメルカプタン及びシクロヘプチルメルカプタンが挙げられる。
接続用銅ペーストには、必要に応じて、ノニオン系界面活性剤、フッ素系界面活性剤などの濡れ向上剤;シリコーン油などの消泡剤;無機イオン交換体などのイオントラップ剤などを適宜添加してもよい。
次に、図5を参照して、第2実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Aについて説明する。図5は、第2実施形態の印刷パターン9Aを示す平面図である。第2実施形態では、図5に示されるように、塗膜形成領域10が、分割領域11のみを含み、角領域14を含んでおらず、かつ、分割領域11には、接続領域5の中心側から縁部6に向かって放射状に配列された放射領域12のみが含まれている。
次に、図6を参照して、第3実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Bについて説明する。図6は、第3実施形態の印刷パターン9Bを示す平面図である。第3実施形態では、図6に示されるように、分割領域11に、接続領域5の中心P周りに同心円状に配置された同心領域13のみが含まれている。
次に、図7を参照して、第4実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Cについて説明する。図7は、第4実施形態の印刷パターン9Cを示す平面図である。第4実施形態では、図7に示されるように、分割領域11に、格子状に配列された格子領域15のみが含まれている。格子状に配列されたとは、たとえば、接続領域5内における網目状の等間隔の仮想水平線及び仮想垂直線の交点に配置されたことを意味する。本実施形態では、接続領域5内において格子領域15は6行×6列の計36個の矩形状の領域15aを含んでいる。
次に、図8を参照して、第5実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Dについて説明する。図8は、第5実施形態の印刷パターン9Dを示す平面図である。第5実施形態では、図8に示されるように、分割領域11に、4個の三角状領域16のみが含まれている。各三角状領域16は、一つの頂点を接続領域5の中心Pに向けて、中心Pから接続領域5の縁部6に向かって広がっている。
次に、図9を参照して、第6実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Eについて説明する。図9は、第6実施形態の印刷パターン9Eを示す平面図である。第6実施形態では、図9に示されるように、分割領域11に、格子領域17のみが含まれている。格子領域17は、上記第4実施形態と同様、格子状に配列された領域である。本実施形態では、格子領域17は、10行×10列の計100個の円形状の領域17aを含んでいる。領域17aの内側は、図示するように塗膜8で埋められていてもよいし、塗膜8がなく開口されていてもよい。
次に、図10を参照して、第7実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Fについて説明する。図10は、第7実施形態の印刷パターン9Fを示す平面図である。第7実施形態では、図10に示されるように、分割領域11に、格子領域18のみが含まれている。格子領域18は、上記第4実施形態と同様、格子状に配列された領域である。本実施形態では、格子領域18は、4行×4列の計16個の十字状の領域18aを含んでいる。領域18aの内側は、図示するように塗膜8で埋められていてもよいし、塗膜8がなく開口されていてもよい。
次に、図11を参照して、第8実施形態に係る部材接続方法の印刷工程で形成される印刷パターン9Gについて説明する。図11は、第8実施形態の印刷パターン9Gを示す平面図である。第8実施形態では、図11に示されるように、塗膜形成領域10が、分割領域11と、角領域14と、を含んでいる。分割領域11は、放射領域12と、同心領域13と、角付近領域19と、を含んでいる。
Claims (4)
- 第一の部材と第二の部材とを銅焼結体により接続する部材接続方法であって、
前記第一の部材と前記第二の部材との接続領域に、印刷によって接続用の銅ペーストの塗膜を所定の印刷パターンで形成する印刷工程と、
前記第一の部材と前記第二の部材とを前記塗膜を介して積層する積層工程と、
前記塗膜の焼結によって前記第一の部材と前記第二の部材とを接続する前記銅焼結体を形成する焼結工程と、を含み、
前記印刷工程で形成される前記印刷パターンは、前記塗膜が形成される塗膜形成領域と、前記塗膜が形成されない塗膜非形成領域と、からなり、
前記塗膜形成領域は、前記接続領域の縁部において互いに離間する第一の点と第二の点とを結ぶように設けられた一又は複数の前記塗膜非形成領域によって複数の領域に分割されており、
前記塗膜形成領域における前記複数の領域は、前記接続領域の中心側から前記縁部に向かって放射状に配列された複数の放射状領域と、前記接続領域の中心周りに同心円状又は同心多角形状に配列された複数の同心状領域と、を含み、
前記複数の放射状領域のそれぞれは、前記放射状のラインに沿う複数の分割領域を有すると共に、前記複数の同心状領域のそれぞれは、前記同心円状又は前記同心多角形状のラインに沿う複数の分割領域を有し、
前記複数の放射状領域における前記複数の分割領域の少なくとも一部は、前記複数の同心状領域における前記複数の分割領域間に、当該複数の分割領域と離間した状態で配置されている、部材接続方法。 - 前記接続領域は、矩形状の領域であり、
前記塗膜形成領域は、前記接続領域の角部に対応して配置された領域を含む、請求項1に記載の部材接続方法。 - 前記塗膜形成領域における前記複数の領域は、前記接続領域の前記縁部に近い位置に配置された領域であるほど大面積となっている、請求項1又は2に記載の部材接続方法。
- 前記第一の部材及び前記第二の部材のうちの少なくとも一方が半導体素子である、請求項1~3の何れか一項に記載の部材接続方法。
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