JP2008111117A - 熱安定性アリールポリシロキサン組成物 - Google Patents

熱安定性アリールポリシロキサン組成物 Download PDF

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Publication number
JP2008111117A
JP2008111117A JP2007267730A JP2007267730A JP2008111117A JP 2008111117 A JP2008111117 A JP 2008111117A JP 2007267730 A JP2007267730 A JP 2007267730A JP 2007267730 A JP2007267730 A JP 2007267730A JP 2008111117 A JP2008111117 A JP 2008111117A
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JP
Japan
Prior art keywords
silicon
aryl
sio
bonded
composition
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Pending
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JP2007267730A
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Japanese (ja)
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JP2008111117A5 (https=
Inventor
Garo Khanarian
ガロ・ハーナリアン
David Wayne Mosley
デービッド・ウェイン・モズレー
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Rohm and Haas Co
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Rohm and Haas Co
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Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Publication of JP2008111117A publication Critical patent/JP2008111117A/ja
Publication of JP2008111117A5 publication Critical patent/JP2008111117A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007267730A 2006-10-16 2007-10-15 熱安定性アリールポリシロキサン組成物 Pending JP2008111117A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85194506P 2006-10-16 2006-10-16

Publications (2)

Publication Number Publication Date
JP2008111117A true JP2008111117A (ja) 2008-05-15
JP2008111117A5 JP2008111117A5 (https=) 2011-07-14

Family

ID=38957700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007267730A Pending JP2008111117A (ja) 2006-10-16 2007-10-15 熱安定性アリールポリシロキサン組成物

Country Status (6)

Country Link
US (1) US8142895B2 (https=)
EP (1) EP1914262A1 (https=)
JP (1) JP2008111117A (https=)
KR (2) KR100943713B1 (https=)
CN (1) CN101165099B (https=)
TW (1) TWI361205B (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008138207A (ja) * 2006-12-01 2008-06-19 Rohm & Haas Co アリール（チオ）エーテルアリールポリシロキサン組成物およびその製造方法および使用方法
JP2010248413A (ja) * 2009-04-17 2010-11-04 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン樹脂組成物及び光半導体装置
WO2011125463A1 (ja) * 2010-03-31 2011-10-13 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
JP2012007136A (ja) * 2010-05-21 2012-01-12 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2013087088A (ja) * 2011-10-18 2013-05-13 Shin-Etsu Chemical Co Ltd 有機ケイ素化合物
JP2013518406A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 光電池モジュール
JP2013518405A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 光電池モジュール
WO2014041994A1 (ja) * 2012-09-14 2014-03-20 横浜ゴム株式会社 硬化性樹脂組成物
JP2019002000A (ja) * 2017-06-14 2019-01-10 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ケイ素ベースのハードマスク

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EP3042909B1 (en) 2007-04-17 2018-08-01 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
US8637627B2 (en) * 2007-12-06 2014-01-28 Rohm And Haas Company Phenoxyphenyl polysiloxane composition and method for making and using same
US8134684B2 (en) * 2008-02-22 2012-03-13 Sematech, Inc. Immersion lithography using hafnium-based nanoparticles
KR20120026528A (ko) * 2009-05-06 2012-03-19 다우 코닝 코포레이션 비닐하이드로젠폴리실록산 접착제 조성물
KR101030019B1 (ko) 2009-12-31 2011-04-20 제일모직주식회사 봉지재용 투광성 수지 및 이를 포함하는 전자 소자
CN102725863B (zh) 2010-01-25 2016-06-29 Lg化学株式会社 用于光伏电池的薄板
JP5963264B2 (ja) * 2010-01-25 2016-08-03 エルジー・ケム・リミテッド 光電池用シート
JP5505991B2 (ja) * 2010-04-30 2014-05-28 信越化学工業株式会社 高接着性シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
US8643200B2 (en) 2010-05-12 2014-02-04 Cheil Indistries, Inc. Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant
KR20110125156A (ko) * 2010-05-12 2011-11-18 제일모직주식회사 투광성 수지 조성물, 상기 투광성 수지 조성물을 사용하여 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
CN102918110B (zh) 2010-05-28 2015-08-12 株式会社钟化 聚硅氧烷类组合物、固化物及光学器件
US8519429B2 (en) * 2010-06-24 2013-08-27 Sekisui Chemical Co., Ltd. Encapsulant for optical semiconductor device and optical semiconductor device using same
US9698320B2 (en) * 2010-09-22 2017-07-04 Kaneka Corporation Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device
JP2013544949A (ja) * 2010-12-08 2013-12-19 ダウ コーニング コーポレーション 封止材を形成するのに好適な二酸化チタンナノ粒子を含むシロキサン組成物
CN103370360A (zh) * 2010-12-08 2013-10-23 道康宁公司 适合形成封装物的硅氧烷组合物
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WO2012173459A2 (ko) * 2011-06-17 2012-12-20 주식회사 엘지화학 고굴절 조성물
JP5472241B2 (ja) * 2011-09-16 2014-04-16 信越化学工業株式会社 光硬化型シリコーン樹脂組成物を用いる硬化薄膜の製造方法
JP5575820B2 (ja) * 2012-01-31 2014-08-20 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子
JP2014062198A (ja) * 2012-09-21 2014-04-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、それを用いてなる半導体封止材および光半導体装置
JP2014077115A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 光学材料用表面処理剤および光学材料
WO2014157682A1 (ja) * 2013-03-29 2014-10-02 出光興産株式会社 ポリオルガノシロキサン及びポリカーボネート－ポリオルガノシロキサン共重合体
KR101701142B1 (ko) 2013-09-03 2017-02-01 다우 코닝 코포레이션 실리콘 봉지재용 첨가제
JP2015070156A (ja) * 2013-09-30 2015-04-13 サンケン電気株式会社 発光装置
WO2015088932A1 (en) * 2013-12-09 2015-06-18 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
US9957416B2 (en) * 2014-09-22 2018-05-01 3M Innovative Properties Company Curable end-capped silsesquioxane polymer comprising reactive groups
JP2017528577A (ja) 2014-09-22 2017-09-28 スリーエム イノベイティブ プロパティズ カンパニー シルセスキオキサンポリマーコア、シルセスキオキサンポリマー外層、及び反応性基を含む硬化性ポリマー
KR102561851B1 (ko) * 2015-03-20 2023-08-02 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 유기폴리실록산, 이의 제조 방법, 및 경화성 실리콘 조성물
JP6707369B2 (ja) * 2015-03-30 2020-06-10 ダウ・東レ株式会社 シリコーン材料、硬化性シリコーン組成物、および光デバイス
JP6561573B2 (ja) * 2015-05-14 2019-08-21 大日本印刷株式会社 反射防止積層体およびその製造方法
WO2017034342A1 (ko) 2015-08-25 2017-03-02 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
TWI738743B (zh) 2016-03-23 2021-09-11 美商道康寧公司 金屬-聚有機矽氧烷
WO2018105716A1 (ja) * 2016-12-09 2018-06-14 ダイキン工業株式会社 ポリマー、組成物及び成形品
US10793681B1 (en) * 2017-05-05 2020-10-06 Dow Silicones Corporation Hydrosilylation curable silicone resin
KR102062107B1 (ko) 2017-08-10 2020-01-03 서울시립대학교 산학협력단 내열성 기지에 발생되는 크랙의 치유 및 방염이 가능한 도포제 및 상기 도포제를 이용한 도포방법
JP7128162B2 (ja) * 2019-08-29 2022-08-30 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
JP2023532407A (ja) * 2020-06-24 2023-07-28 ダウ グローバル テクノロジーズ エルエルシー シリコーンゴム組成物

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Cited By (15)

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Publication number Priority date Publication date Assignee Title
JP2008138207A (ja) * 2006-12-01 2008-06-19 Rohm & Haas Co アリール（チオ）エーテルアリールポリシロキサン組成物およびその製造方法および使用方法
JP2010248413A (ja) * 2009-04-17 2010-11-04 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン樹脂組成物及び光半導体装置
JP2013518405A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 光電池モジュール
JP2013518406A (ja) * 2010-01-25 2013-05-20 エルジー・ケム・リミテッド 光電池モジュール
WO2011125463A1 (ja) * 2010-03-31 2011-10-13 積水化学工業株式会社 光半導体装置用封止剤及び光半導体装置
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US8142895B2 (en) 2012-03-27
US20080090986A1 (en) 2008-04-17
TWI361205B (en) 2012-04-01
KR20080034408A (ko) 2008-04-21
CN101165099A (zh) 2008-04-23
CN101165099B (zh) 2011-06-08
EP1914262A1 (en) 2008-04-23

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