KR100943713B1 - 내열성 아릴 폴리실록산 조성물 - Google Patents

내열성 아릴 폴리실록산 조성물 Download PDF

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KR100943713B1
KR100943713B1 KR1020070103552A KR20070103552A KR100943713B1 KR 100943713 B1 KR100943713 B1 KR 100943713B1 KR 1020070103552 A KR1020070103552 A KR 1020070103552A KR 20070103552 A KR20070103552 A KR 20070103552A KR 100943713 B1 KR100943713 B1 KR 100943713B1
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aryl
silicon
sio
bonded
cured
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KR20080034408A (ko
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가로 카나리안
데이비드 웨인 모슬레이
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롬 앤드 하아스 컴패니
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020070103552A 2006-10-16 2007-10-15 내열성 아릴 폴리실록산 조성물 Active KR100943713B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85194506P 2006-10-16 2006-10-16
US60/851,945 2006-10-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090110411A Division KR20090131274A (ko) 2006-10-16 2009-11-16 내열성 아릴 폴리실록산 조성물

Publications (2)

Publication Number Publication Date
KR20080034408A KR20080034408A (ko) 2008-04-21
KR100943713B1 true KR100943713B1 (ko) 2010-02-23

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KR1020070103552A Active KR100943713B1 (ko) 2006-10-16 2007-10-15 내열성 아릴 폴리실록산 조성물
KR1020090110411A Withdrawn KR20090131274A (ko) 2006-10-16 2009-11-16 내열성 아릴 폴리실록산 조성물

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Country Status (6)

Country Link
US (1) US8142895B2 (https=)
EP (1) EP1914262A1 (https=)
JP (1) JP2008111117A (https=)
KR (2) KR100943713B1 (https=)
CN (1) CN101165099B (https=)
TW (1) TWI361205B (https=)

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KR101387739B1 (ko) * 2010-05-12 2014-04-21 제일모직주식회사 투광성 수지 조성물, 상기 투광성 수지 조성물을 사용하여 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR20190017174A (ko) 2017-08-10 2019-02-20 서울시립대학교 산학협력단 내열성 기지에 발생되는 크랙의 치유 및 방염이 가능한 도포제 및 상기 도포제를 이용한 도포방법

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US8637627B2 (en) * 2007-12-06 2014-01-28 Rohm And Haas Company Phenoxyphenyl polysiloxane composition and method for making and using same
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KR20120026528A (ko) * 2009-05-06 2012-03-19 다우 코닝 코포레이션 비닐하이드로젠폴리실록산 접착제 조성물
KR101030019B1 (ko) 2009-12-31 2011-04-20 제일모직주식회사 봉지재용 투광성 수지 및 이를 포함하는 전자 소자
EP2530740B1 (en) 2010-01-25 2018-08-01 LG Chem, Ltd. Photovoltaic module
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Publication number Priority date Publication date Assignee Title
KR101387739B1 (ko) * 2010-05-12 2014-04-21 제일모직주식회사 투광성 수지 조성물, 상기 투광성 수지 조성물을 사용하여 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
KR20190017174A (ko) 2017-08-10 2019-02-20 서울시립대학교 산학협력단 내열성 기지에 발생되는 크랙의 치유 및 방염이 가능한 도포제 및 상기 도포제를 이용한 도포방법

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KR20090131274A (ko) 2009-12-28
US8142895B2 (en) 2012-03-27
US20080090986A1 (en) 2008-04-17
TWI361205B (en) 2012-04-01
KR20080034408A (ko) 2008-04-21
JP2008111117A (ja) 2008-05-15
CN101165099A (zh) 2008-04-23
CN101165099B (zh) 2011-06-08
EP1914262A1 (en) 2008-04-23

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