TWI361205B - Heat stable aryl polysiloxane compositions - Google Patents
Heat stable aryl polysiloxane compositions Download PDFInfo
- Publication number
- TWI361205B TWI361205B TW96136702A TW96136702A TWI361205B TW I361205 B TWI361205 B TW I361205B TW 96136702 A TW96136702 A TW 96136702A TW 96136702 A TW96136702 A TW 96136702A TW I361205 B TWI361205 B TW I361205B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- aryl
- composition
- bonded
- vinyl
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
- C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85194506P | 2006-10-16 | 2006-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200833788A TW200833788A (en) | 2008-08-16 |
| TWI361205B true TWI361205B (en) | 2012-04-01 |
Family
ID=38957700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96136702A TWI361205B (en) | 2006-10-16 | 2007-10-01 | Heat stable aryl polysiloxane compositions |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8142895B2 (https=) |
| EP (1) | EP1914262A1 (https=) |
| JP (1) | JP2008111117A (https=) |
| KR (2) | KR100943713B1 (https=) |
| CN (1) | CN101165099B (https=) |
| TW (1) | TWI361205B (https=) |
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| US8029904B2 (en) * | 2006-12-01 | 2011-10-04 | Rohm And Haas Company | Aryl (thio)ether aryl polysiloxane composition and methods for making and using same |
| EP3042909B1 (en) | 2007-04-17 | 2018-08-01 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
| US8637627B2 (en) * | 2007-12-06 | 2014-01-28 | Rohm And Haas Company | Phenoxyphenyl polysiloxane composition and method for making and using same |
| US8134684B2 (en) * | 2008-02-22 | 2012-03-13 | Sematech, Inc. | Immersion lithography using hafnium-based nanoparticles |
| JP5414337B2 (ja) * | 2009-04-17 | 2014-02-12 | 信越化学工業株式会社 | 光半導体装置の封止方法 |
| KR20120026528A (ko) * | 2009-05-06 | 2012-03-19 | 다우 코닝 코포레이션 | 비닐하이드로젠폴리실록산 접착제 조성물 |
| KR101030019B1 (ko) | 2009-12-31 | 2011-04-20 | 제일모직주식회사 | 봉지재용 투광성 수지 및 이를 포함하는 전자 소자 |
| EP2530740B1 (en) | 2010-01-25 | 2018-08-01 | LG Chem, Ltd. | Photovoltaic module |
| CN102725863B (zh) | 2010-01-25 | 2016-06-29 | Lg化学株式会社 | 用于光伏电池的薄板 |
| JP5963264B2 (ja) * | 2010-01-25 | 2016-08-03 | エルジー・ケム・リミテッド | 光電池用シート |
| EP2530741B1 (en) * | 2010-01-25 | 2018-07-25 | LG Chem, Ltd. | Photovoltaic module |
| EP2554601A4 (en) * | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
| JP5505991B2 (ja) * | 2010-04-30 | 2014-05-28 | 信越化学工業株式会社 | 高接着性シリコーン樹脂組成物及び当該組成物を使用した光半導体装置 |
| US8643200B2 (en) | 2010-05-12 | 2014-02-04 | Cheil Indistries, Inc. | Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant |
| KR20110125156A (ko) * | 2010-05-12 | 2011-11-18 | 제일모직주식회사 | 투광성 수지 조성물, 상기 투광성 수지 조성물을 사용하여 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자 |
| JP2012007136A (ja) * | 2010-05-21 | 2012-01-12 | Sekisui Chem Co Ltd | 光半導体装置用封止剤及びそれを用いた光半導体装置 |
| CN102918110B (zh) | 2010-05-28 | 2015-08-12 | 株式会社钟化 | 聚硅氧烷类组合物、固化物及光学器件 |
| US8519429B2 (en) * | 2010-06-24 | 2013-08-27 | Sekisui Chemical Co., Ltd. | Encapsulant for optical semiconductor device and optical semiconductor device using same |
| US9698320B2 (en) * | 2010-09-22 | 2017-07-04 | Kaneka Corporation | Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device |
| JP2013544949A (ja) * | 2010-12-08 | 2013-12-19 | ダウ コーニング コーポレーション | 封止材を形成するのに好適な二酸化チタンナノ粒子を含むシロキサン組成物 |
| CN103370360A (zh) * | 2010-12-08 | 2013-10-23 | 道康宁公司 | 适合形成封装物的硅氧烷组合物 |
| US20130256742A1 (en) * | 2010-12-08 | 2013-10-03 | Dow Corning Corporation | Siloxane-Compositions Including Metal-Oxide Nanoparticles Suitable For Forming Encapsulants |
| EP2722896B1 (en) * | 2011-06-17 | 2016-11-02 | LG Chem, Ltd. | Sheet for photovoltaic cell |
| WO2012173459A2 (ko) * | 2011-06-17 | 2012-12-20 | 주식회사 엘지화학 | 고굴절 조성물 |
| JP5472241B2 (ja) * | 2011-09-16 | 2014-04-16 | 信越化学工業株式会社 | 光硬化型シリコーン樹脂組成物を用いる硬化薄膜の製造方法 |
| JP6087499B2 (ja) * | 2011-10-18 | 2017-03-01 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| JP5575820B2 (ja) * | 2012-01-31 | 2014-08-20 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物、光学素子封止材および光学素子 |
| KR20150054801A (ko) * | 2012-09-14 | 2015-05-20 | 요코하마 고무 가부시키가이샤 | 경화성 수지 조성물 |
| JP2014062198A (ja) * | 2012-09-21 | 2014-04-10 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、それを用いてなる半導体封止材および光半導体装置 |
| JP2014077115A (ja) * | 2012-09-21 | 2014-05-01 | Dow Corning Toray Co Ltd | 光学材料用表面処理剤および光学材料 |
| WO2014157682A1 (ja) * | 2013-03-29 | 2014-10-02 | 出光興産株式会社 | ポリオルガノシロキサン及びポリカーボネート-ポリオルガノシロキサン共重合体 |
| KR101701142B1 (ko) | 2013-09-03 | 2017-02-01 | 다우 코닝 코포레이션 | 실리콘 봉지재용 첨가제 |
| JP2015070156A (ja) * | 2013-09-30 | 2015-04-13 | サンケン電気株式会社 | 発光装置 |
| WO2015088932A1 (en) * | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Curable silsesquioxane polymers, compositions, articles, and methods |
| US9957416B2 (en) * | 2014-09-22 | 2018-05-01 | 3M Innovative Properties Company | Curable end-capped silsesquioxane polymer comprising reactive groups |
| JP2017528577A (ja) | 2014-09-22 | 2017-09-28 | スリーエム イノベイティブ プロパティズ カンパニー | シルセスキオキサンポリマーコア、シルセスキオキサンポリマー外層、及び反応性基を含む硬化性ポリマー |
| KR102561851B1 (ko) * | 2015-03-20 | 2023-08-02 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 유기폴리실록산, 이의 제조 방법, 및 경화성 실리콘 조성물 |
| JP6707369B2 (ja) * | 2015-03-30 | 2020-06-10 | ダウ・東レ株式会社 | シリコーン材料、硬化性シリコーン組成物、および光デバイス |
| JP6561573B2 (ja) * | 2015-05-14 | 2019-08-21 | 大日本印刷株式会社 | 反射防止積層体およびその製造方法 |
| WO2017034342A1 (ko) | 2015-08-25 | 2017-03-02 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
| TWI738743B (zh) | 2016-03-23 | 2021-09-11 | 美商道康寧公司 | 金屬-聚有機矽氧烷 |
| WO2018105716A1 (ja) * | 2016-12-09 | 2018-06-14 | ダイキン工業株式会社 | ポリマー、組成物及び成形品 |
| US10793681B1 (en) * | 2017-05-05 | 2020-10-06 | Dow Silicones Corporation | Hydrosilylation curable silicone resin |
| US10186424B2 (en) * | 2017-06-14 | 2019-01-22 | Rohm And Haas Electronic Materials Llc | Silicon-based hardmask |
| KR102062107B1 (ko) | 2017-08-10 | 2020-01-03 | 서울시립대학교 산학협력단 | 내열성 기지에 발생되는 크랙의 치유 및 방염이 가능한 도포제 및 상기 도포제를 이용한 도포방법 |
| JP7128162B2 (ja) * | 2019-08-29 | 2022-08-30 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物及び光学素子 |
| JP2023532407A (ja) * | 2020-06-24 | 2023-07-28 | ダウ グローバル テクノロジーズ エルエルシー | シリコーンゴム組成物 |
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| US2915497A (en) * | 1956-11-29 | 1959-12-01 | Dow Corning | Solventless siloxane resins |
| US3020260A (en) * | 1960-08-18 | 1962-02-06 | Dow Corning | Organosiloxane potting compound |
| US3697473A (en) * | 1971-01-04 | 1972-10-10 | Dow Corning | Composition curable through si-h and si-ch equals ch2 with improved properties |
| US3957713A (en) * | 1973-04-13 | 1976-05-18 | General Electric Company | High strength organopolysiloxane compositions |
| JPS59152955A (ja) * | 1983-02-21 | 1984-08-31 | Toshiba Silicone Co Ltd | 硬化性シリコーンゴム組成物 |
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| JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
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| TW200427111A (en) * | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
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-
2007
- 2007-10-01 TW TW96136702A patent/TWI361205B/zh active
- 2007-10-05 EP EP20070253947 patent/EP1914262A1/en not_active Withdrawn
- 2007-10-11 US US11/974,063 patent/US8142895B2/en active Active
- 2007-10-15 JP JP2007267730A patent/JP2008111117A/ja active Pending
- 2007-10-15 CN CN2007101802809A patent/CN101165099B/zh active Active
- 2007-10-15 KR KR1020070103552A patent/KR100943713B1/ko active Active
-
2009
- 2009-11-16 KR KR1020090110411A patent/KR20090131274A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| TW200833788A (en) | 2008-08-16 |
| KR20090131274A (ko) | 2009-12-28 |
| KR100943713B1 (ko) | 2010-02-23 |
| US8142895B2 (en) | 2012-03-27 |
| US20080090986A1 (en) | 2008-04-17 |
| KR20080034408A (ko) | 2008-04-21 |
| JP2008111117A (ja) | 2008-05-15 |
| CN101165099A (zh) | 2008-04-23 |
| CN101165099B (zh) | 2011-06-08 |
| EP1914262A1 (en) | 2008-04-23 |
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