JP2008047916A - 電子要素の実装に使用する装置、システムおよび方法 - Google Patents
電子要素の実装に使用する装置、システムおよび方法 Download PDFInfo
- Publication number
- JP2008047916A JP2008047916A JP2007211901A JP2007211901A JP2008047916A JP 2008047916 A JP2008047916 A JP 2008047916A JP 2007211901 A JP2007211901 A JP 2007211901A JP 2007211901 A JP2007211901 A JP 2007211901A JP 2008047916 A JP2008047916 A JP 2008047916A
- Authority
- JP
- Japan
- Prior art keywords
- casing
- recess
- ring
- leads
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract description 23
- 239000000463 material Substances 0.000 claims description 47
- 239000004954 Polyphthalamide Substances 0.000 claims description 9
- 229920006375 polyphtalamide Polymers 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000000945 filler Substances 0.000 description 18
- 238000007373 indentation Methods 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
- H01L2224/48097—Kinked the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】ある実施例は、ケーシングの中に形成され、ケーシングの中へ延在する凹部を備えるケーシングと、ケーシングに固定され、凹部の表面の一部を形成する凹部の回りに延在するインサートであって、凹部に沿って露出された反射面を備えるインサートと、凹部を介して部分的に露出される複数のリードとを備える表面実装デバイスを提供する。
【選択図】図1
Description
Claims (11)
- ケーシングであって、該ケーシング内に形成され、該ケーシング内に延在する凹部を含むケーシングと、
前記ケーシングに固定され、前記凹部の表面の一部を画定する前記凹部の回りに延在するインサートであって、該凹部に沿って露出される反射面を含むインサートと、
前記凹部の中に部分的に露出される複数のリードと、含む表面実装デバイス。 - 前記インサートは、前記凹部の表面の一部の周方向に延在し、前記凹部の表面の一部を画定するリングを含む請求項1に記載の表面実装デバイス。
- 前記リングは、前記凹部の高さ未満である高さを有する請求項2に記載の表面実装デバイス。
- 前記ケーシングは、黒色ポリフタルアミド材から少なくとも部分的に構成される請求項2に記載の表面実装デバイス。
- 前記インサートは、前記ケーシングの表面の近傍に位置付けれた第1縁部と、前記ケーシングの前記表面から末端にある第2縁部とを有し、
前記インサートは、4つの隣接する部分を含み、前記第1縁部から前記第2縁部へと先細になる請求項2に記載の表面実装デバイス。 - 前記4つの部分のそれぞれは、それぞれの部分が2つの隣り合う部分と交差するように、前記第1縁部の近傍の第2半径より大きい、前記第2縁部の近傍の第1半径をそれぞれが有する円の概ね一部分である請求項5に記載の表面実装デバイス。
- 前記インサートは、前記反射面から離れるように、前記ケーシングの中へ概ね延在するタブを含む請求項2に記載の表面実装デバイス。
- 前記インサートは、前記ケーシングの外面の近傍に位置付けられる第1縁部と、前記ケーシングの前記外面から末端にある第2縁部と、前記反射面から離れるように、前記ケーシングの中へ延在する前記第1縁部の近傍の出張りと、を含む請求項1に記載の表面実装デバイス。
- 前記出張りは、前記出張りから前記ケーシングの中へ延在するタブをさらに含む請求項8に記載の表面実装デバイス。
- 前記第1の複数のリードのうちの第1リードと接続される電子デバイスをさらに含み、
前記凹部は、前記電子デバイスの少なくとも一部分を露出させる請求項2に記載の表面実装デバイス。 - 第1表面、および、該第1表面からケーシングの中へ延在する前記ケーシングの中に形成された凹部を含むケーシングと、
前記凹部からケーシングの中に延在し、前記ケーシングを出る第1の複数のリードと、
前記複数のリードのうちの少なくとも1つと接続され、前記凹部の中に少なくとも部分的に露出される電子デバイスと、
反射面を含むインサートであって、前記凹部の表面の少なくとも一部の回りに延在し、前記インサートの前記反射面が前記凹部の中に露出された状態で、前記ケーシングに固定されるインサートと、を含む表面実装デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/465,120 US8367945B2 (en) | 2006-08-16 | 2006-08-16 | Apparatus, system and method for use in mounting electronic elements |
US11/465,120 | 2006-08-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008047916A true JP2008047916A (ja) | 2008-02-28 |
JP5442189B2 JP5442189B2 (ja) | 2014-03-12 |
Family
ID=39095326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007211901A Active JP5442189B2 (ja) | 2006-08-16 | 2007-08-15 | 電子要素の実装に使用する装置、システムおよび方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8367945B2 (ja) |
JP (1) | JP5442189B2 (ja) |
CN (2) | CN101127350B (ja) |
DE (1) | DE102007038320A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101206059B1 (ko) * | 2010-01-20 | 2012-12-03 | 라이트온 테크놀러지 코포레이션 | 패키지 구조물 및 엘이디 패키지 구조물 |
JP2012238830A (ja) * | 2011-05-09 | 2012-12-06 | Lumirich Co Ltd | 発光ダイオード素子 |
JP2013524542A (ja) * | 2010-04-12 | 2013-06-17 | クリー フエジョウ オプト リミテッド | 表面実装デバイスの薄型パッケージ |
US9240395B2 (en) | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
KR20160109427A (ko) * | 2015-03-11 | 2016-09-21 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 라이트 유닛 |
US9711489B2 (en) | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
JPWO2020045604A1 (ja) * | 2018-08-31 | 2021-08-12 | パナソニックIpマネジメント株式会社 | 半導体素子搭載用パッケージ及び半導体装置 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7928462B2 (en) * | 2006-02-16 | 2011-04-19 | Lg Electronics Inc. | Light emitting device having vertical structure, package thereof and method for manufacturing the same |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7993038B2 (en) * | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
JP5416975B2 (ja) | 2008-03-11 | 2014-02-12 | ローム株式会社 | 半導体発光装置 |
WO2010022538A1 (zh) * | 2008-08-26 | 2010-03-04 | Pan Dingguo | 发光二极管多芯片贴片及装有该贴片的灯条 |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
DE102009058421A1 (de) * | 2009-12-16 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
TWI427745B (zh) * | 2010-01-20 | 2014-02-21 | Lite On Electronics Guangzhou | 封裝結構及發光二極體封裝結構 |
JP5507330B2 (ja) | 2010-04-27 | 2014-05-28 | ローム株式会社 | Ledモジュール |
KR101705700B1 (ko) * | 2010-07-01 | 2017-02-10 | 엘지이노텍 주식회사 | 발광 소자 |
WO2012108356A1 (ja) * | 2011-02-10 | 2012-08-16 | 日亜化学工業株式会社 | 発光装置、発光装置の製造方法、及びパッケージアレイ |
CN102280424A (zh) * | 2011-06-08 | 2011-12-14 | 无敌科技(西安)有限公司 | 非挥发性内存装置、集成电路装置及集成电路制造方法 |
KR101818466B1 (ko) | 2011-08-18 | 2018-01-15 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
WO2013075309A1 (en) | 2011-11-24 | 2013-05-30 | Cree Huizhou Solid State Lighting Company Limited | Water resistant led devices and led display including the same |
CN103137825B (zh) * | 2011-11-30 | 2016-06-01 | 光宝电子(广州)有限公司 | 发光二极管基板结构、发光二极管单元及其光源模块 |
TW201330332A (zh) * | 2012-01-02 | 2013-07-16 | Lextar Electronics Corp | 固態發光元件及其固態發光封裝體 |
US10504719B2 (en) * | 2012-04-25 | 2019-12-10 | Applied Materials, Inc. | Cooled reflective adapter plate for a deposition chamber |
US10439112B2 (en) | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US9239135B2 (en) * | 2012-07-25 | 2016-01-19 | Tyco Electronics Corporation | LED connector |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
DE102014110074A1 (de) * | 2014-07-17 | 2016-01-21 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement, Leiterrahmen und Verfahren zum Herstellen eines elektronischen Bauelements |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
USD740998S1 (en) * | 2014-09-11 | 2015-10-13 | Michael Olen NEVINS | Reflector |
KR102486853B1 (ko) * | 2015-03-06 | 2023-01-11 | 코닌클리케 필립스 엔.브이. | 비대칭 분포된 led 칩들을 갖는 led-기반 조명 디바이스 |
KR102332218B1 (ko) * | 2015-03-18 | 2021-11-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 및 이를 구비한 카메라 모듈 |
US10311265B2 (en) * | 2016-03-04 | 2019-06-04 | Assa Abloy Ab | Universal mounting ring |
CN110289341A (zh) * | 2019-06-12 | 2019-09-27 | 浙江英特来光电科技有限公司 | 一种与印刷线路板增加结合力的全彩smd led及其安装方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197974A (ja) * | 2001-12-24 | 2003-07-11 | Samsung Electro Mech Co Ltd | 発光ダイオードパッケージ |
JP2004214380A (ja) * | 2002-12-27 | 2004-07-29 | Polyplastics Co | リードフレーム形成用金属箔、電子部品用パッケージ、その製造方法、及び表面実装型発光部品 |
JP2005039100A (ja) * | 2003-07-16 | 2005-02-10 | Matsushita Electric Works Ltd | 高熱伝導性発光素子用回路部品及び高放熱モジュール |
JP2005079167A (ja) * | 2003-08-28 | 2005-03-24 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005191111A (ja) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005310935A (ja) * | 2004-04-20 | 2005-11-04 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
JP2006509372A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | 複合リードフレームLEDパッケージおよびその製造方法本願は、2002年12月6日付け米国仮特許出願第60/431,523号、名称「熱拡散を改良したリードフレームベースのLEDあるいは半導体パッケージ(LeadframebasedLEDorsemiconductorpackagewithimprovedheatspreading)」の米国特許商標庁への出願日の恩恵を主張する。 |
Family Cites Families (161)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3760237A (en) | 1972-06-21 | 1973-09-18 | Gen Electric | Solid state lamp assembly having conical light director |
FR2436505A1 (fr) | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | Dispositif optoelectronique a emetteur et recepteur couples |
US4511425A (en) | 1983-06-13 | 1985-04-16 | Dennison Manufacturing Company | Heated pad decorator |
ES2150409T3 (es) | 1989-05-31 | 2000-12-01 | Osram Opto Semiconductors Gmbh | Procedimiento para montar un opto-componente que se puede montar sobre una superficie. |
US5617218A (en) * | 1989-09-07 | 1997-04-01 | Advanced Television Test Center | Bi-directional television and motion picture film to magnetic tape format digital signal converter |
US5167556A (en) | 1990-07-03 | 1992-12-01 | Siemens Aktiengesellschaft | Method for manufacturing a light emitting diode display means |
US5130761A (en) | 1990-07-17 | 1992-07-14 | Kabushiki Kaisha Toshiba | Led array with reflector and printed circuit board |
US5122943A (en) | 1991-04-15 | 1992-06-16 | Miles Inc. | Encapsulated light emitting diode and method for encapsulation |
US5351106A (en) | 1991-07-01 | 1994-09-27 | Amergraph Corporation | Exposure system |
WO1994003036A1 (en) | 1992-07-24 | 1994-02-03 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US5790298A (en) | 1994-05-03 | 1998-08-04 | Gentex Corporation | Method of forming optically transparent seal and seal formed by said method |
DE4446566A1 (de) | 1994-12-24 | 1996-06-27 | Telefunken Microelectron | Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement |
DE69615792T2 (de) | 1995-05-10 | 2002-05-23 | Koninkl Philips Electronics Nv | Miniatur-halbleiteranordnung für oberflächenmontage |
DE19549818B4 (de) | 1995-09-29 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiter-Bauelement |
US5731547A (en) | 1996-02-20 | 1998-03-24 | International Business Machines Corporation | Circuitized substrate with material containment means and method of making same |
DE19621124A1 (de) | 1996-05-24 | 1997-11-27 | Siemens Ag | Optoelektronischer Wandler und dessen Herstellungsverfahren |
JPH09321343A (ja) | 1996-05-31 | 1997-12-12 | Dowa Mining Co Ltd | 光通信用の部品装置 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
DE29825062U1 (de) | 1997-07-29 | 2004-07-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US6183100B1 (en) | 1997-10-17 | 2001-02-06 | Truck-Lite Co., Inc. | Light emitting diode 360° warning lamp |
DE19755734A1 (de) | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
DE19829197C2 (de) | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
JP3334864B2 (ja) | 1998-11-19 | 2002-10-15 | 松下電器産業株式会社 | 電子装置 |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
JP4279388B2 (ja) | 1999-01-29 | 2009-06-17 | 日亜化学工業株式会社 | 光半導体装置及びその形成方法 |
US6259608B1 (en) | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
JP2001042792A (ja) | 1999-05-24 | 2001-02-16 | Sony Corp | Led表示装置 |
CA2314679A1 (en) | 1999-07-28 | 2001-01-28 | William Kelly | Improvements in and relating to ring lighting |
US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
US6296367B1 (en) * | 1999-10-15 | 2001-10-02 | Armament Systems And Procedures, Inc. | Rechargeable flashlight with step-up voltage converter and recharger therefor |
DE19963806C2 (de) | 1999-12-30 | 2002-02-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Leuchtdioden-Weißlichtquelle, Verwendung einer Kunststoff-Preßmasse zum Herstellen einer Leuchtioden-Weißlichtquelle und oberflächenmontierbare Leuchtdioden-Weißlichtquelle |
DE10002521A1 (de) | 2000-01-21 | 2001-08-09 | Infineon Technologies Ag | Elektrooptisches Datenübertragungsmodul |
KR100748815B1 (ko) | 2000-02-09 | 2007-08-13 | 니폰 라이츠 가부시키가이샤 | 광원 장치 |
US6224216B1 (en) | 2000-02-18 | 2001-05-01 | Infocus Corporation | System and method employing LED light sources for a projection display |
US6517218B2 (en) | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
EP1204151A4 (en) | 2000-04-24 | 2006-10-18 | Rohm Co Ltd | SIDE-EMITTING LUMINAIRE DIODE AND MANUFACTURING METHOD |
DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
US20020066905A1 (en) | 2000-06-20 | 2002-06-06 | Bily Wang | Wing-shaped surface mount package for light emitting diodes |
JP2002033058A (ja) | 2000-07-14 | 2002-01-31 | Sony Corp | 電界放出型表示装置用の前面板 |
US7129638B2 (en) | 2000-08-09 | 2006-10-31 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness |
DE10041328B4 (de) | 2000-08-23 | 2018-04-05 | Osram Opto Semiconductors Gmbh | Verpackungseinheit für Halbleiterchips |
EP1187226B1 (en) | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
US7064355B2 (en) | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
WO2002086972A1 (en) | 2001-04-23 | 2002-10-31 | Plasma Ireland Limited | Illuminator |
US20020163001A1 (en) | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
JP2002344029A (ja) | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | 発光ダイオードの色調調整方法 |
JP3844196B2 (ja) | 2001-06-12 | 2006-11-08 | シチズン電子株式会社 | 発光ダイオードの製造方法 |
JP2002374007A (ja) | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 発光装置 |
TW543128B (en) | 2001-07-12 | 2003-07-21 | Highlink Technology Corp | Surface mounted and flip chip type LED package |
US6686580B1 (en) | 2001-07-16 | 2004-02-03 | Amkor Technology, Inc. | Image sensor package with reflector |
CN2498694Y (zh) | 2001-08-14 | 2002-07-03 | 北京利亚德电子科技有限公司 | 一种带倾角的led像素模块 |
US6812481B2 (en) | 2001-09-03 | 2004-11-02 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
CN1265338C (zh) | 2001-11-21 | 2006-07-19 | 佳能株式会社 | 显示装置、其图像信号处理装置及驱动控制装置 |
DE10241989A1 (de) | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
JP4009097B2 (ja) | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
US6480389B1 (en) | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
JP3973082B2 (ja) | 2002-01-31 | 2007-09-05 | シチズン電子株式会社 | 両面発光ledパッケージ |
JP3853279B2 (ja) * | 2002-02-01 | 2006-12-06 | シャープ株式会社 | 半導体レーザ装置及びその製造方法、並びにそれを用いた光ピックアップ |
US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
US7242033B2 (en) | 2002-03-08 | 2007-07-10 | Rohm Co., Ltd. | Semiconductor device using LED chip |
JP3939177B2 (ja) | 2002-03-20 | 2007-07-04 | シャープ株式会社 | 発光装置の製造方法 |
CN2549313Y (zh) * | 2002-04-17 | 2003-05-07 | 杨英琪 | 大厦风扇夜光灯 |
JP3707688B2 (ja) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
WO2004001862A1 (ja) * | 2002-06-19 | 2003-12-31 | Sanken Electric Co., Ltd. | 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ |
TW546799B (en) | 2002-06-26 | 2003-08-11 | Lingsen Precision Ind Ltd | Packaged formation method of LED and product structure |
DE10229067B4 (de) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
JP2004047748A (ja) | 2002-07-12 | 2004-02-12 | Stanley Electric Co Ltd | 発光ダイオード |
US7190354B2 (en) * | 2002-07-15 | 2007-03-13 | Fuji Photo Film Co., Ltd. | Inner type touch panel, process for producing the same and display unit |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
JP4407204B2 (ja) | 2002-08-30 | 2010-02-03 | 日亜化学工業株式会社 | 発光装置 |
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
DE10243247A1 (de) | 2002-09-17 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung |
US6686609B1 (en) | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
TW200414572A (en) | 2002-11-07 | 2004-08-01 | Matsushita Electric Ind Co Ltd | LED lamp |
DE10255932A1 (de) | 2002-11-29 | 2004-06-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
CN2617039Y (zh) | 2003-02-21 | 2004-05-19 | 游尚桦 | 粘着型led引线架 |
EP1597764A1 (de) | 2003-02-28 | 2005-11-23 | Osram Opto Semiconductors GmbH | Optoelektronisches bauteil mit strukturiert metallisiertem gehäusekörper, verfahren zur herstellung eines derartigen bauteils und verfahren zur strukturierten metallisierung eines kunststoff enthaltenden körpers |
JP4504662B2 (ja) | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | Ledランプ |
EP2270887B1 (en) | 2003-04-30 | 2020-01-22 | Cree, Inc. | High powered light emitter packages with compact optics |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
US7021797B2 (en) | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
JP2004356506A (ja) | 2003-05-30 | 2004-12-16 | Stanley Electric Co Ltd | ガラス封止型発光ダイオード |
JP4120813B2 (ja) | 2003-06-12 | 2008-07-16 | セイコーエプソン株式会社 | 光学部品およびその製造方法 |
JP4645071B2 (ja) * | 2003-06-20 | 2011-03-09 | 日亜化学工業株式会社 | パッケージ成型体およびそれを用いた半導体装置 |
JP4034241B2 (ja) | 2003-06-27 | 2008-01-16 | 日本ライツ株式会社 | 光源装置および光源装置の製造方法 |
TWI312582B (en) | 2003-07-24 | 2009-07-21 | Epistar Corporatio | Led device, flip-chip led package and light reflecting structure |
JP4360858B2 (ja) | 2003-07-29 | 2009-11-11 | シチズン電子株式会社 | 表面実装型led及びそれを用いた発光装置 |
US6876008B2 (en) | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
JP2005064047A (ja) | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | 発光ダイオード |
US6995402B2 (en) | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
US20050077535A1 (en) | 2003-10-08 | 2005-04-14 | Joinscan Electronics Co., Ltd | LED and its manufacturing process |
CN2646873Y (zh) | 2003-10-16 | 2004-10-06 | 上海三思科技发展有限公司 | 表面贴装式、光轴倾斜的发光二极管 |
TWI291770B (en) | 2003-11-14 | 2007-12-21 | Hon Hai Prec Ind Co Ltd | Surface light source device and light emitting diode |
JP4231391B2 (ja) | 2003-11-19 | 2009-02-25 | パナソニック株式会社 | 半導体装置用リードフレームとそれを用いた面発光装置 |
JP2005191530A (ja) | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | 発光装置 |
US7439667B2 (en) | 2003-12-12 | 2008-10-21 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device with specific four color arrangement |
JP2005183531A (ja) * | 2003-12-17 | 2005-07-07 | Sharp Corp | 半導体発光装置 |
JP4442216B2 (ja) | 2003-12-19 | 2010-03-31 | 豊田合成株式会社 | Ledランプ装置 |
US7321161B2 (en) | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
US7675231B2 (en) | 2004-02-13 | 2010-03-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting diode display device comprising a high temperature resistant overlay |
US20050179041A1 (en) | 2004-02-18 | 2005-08-18 | Lumileds Lighting U.S., Llc | Illumination system with LEDs |
CN100454596C (zh) | 2004-04-19 | 2009-01-21 | 松下电器产业株式会社 | Led照明光源的制造方法及led照明光源 |
TWM258416U (en) | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
JP4547569B2 (ja) | 2004-08-31 | 2010-09-22 | スタンレー電気株式会社 | 表面実装型led |
WO2006059828A1 (en) | 2004-09-10 | 2006-06-08 | Seoul Semiconductor Co., Ltd. | Light emitting diode package having multiple molding resins |
JP4796293B2 (ja) | 2004-11-04 | 2011-10-19 | 株式会社 日立ディスプレイズ | 照明装置の製造方法 |
US7303315B2 (en) | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
JP2006140281A (ja) | 2004-11-11 | 2006-06-01 | Stanley Electric Co Ltd | パワーled及びその製造方法 |
GB2420221B (en) | 2004-11-12 | 2009-09-09 | Unity Opto Technology Co Ltd | Solid-state semiconductor light emitting device |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
US7119422B2 (en) | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
US8541797B2 (en) | 2004-11-18 | 2013-09-24 | Koninklijke Philips N.V. | Illuminator and method for producing such illuminator |
EP1825524A4 (en) | 2004-12-16 | 2010-06-16 | Seoul Semiconductor Co Ltd | CONNECTION GRID COMPRISING A THERMAL DISSIPATOR SUPPORT RING, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE HOUSING USING THE SAME, AND LIGHT-EMITTING DIODE HOUSING MADE THEREBY |
US7285802B2 (en) | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
CN100389503C (zh) | 2005-01-07 | 2008-05-21 | 北京大学 | 分立晶粒垂直结构的led芯片制备方法 |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
TWI255566B (en) | 2005-03-04 | 2006-05-21 | Jemitek Electronics Corp | Led |
JP4915052B2 (ja) | 2005-04-01 | 2012-04-11 | パナソニック株式会社 | Led部品およびその製造方法 |
US7994702B2 (en) | 2005-04-27 | 2011-08-09 | Prysm, Inc. | Scanning beams displays based on light-emitting screens having phosphors |
KR100757196B1 (ko) | 2005-08-01 | 2007-09-07 | 서울반도체 주식회사 | 실리콘 렌즈를 구비하는 발광소자 |
US7847302B2 (en) | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
JP4724618B2 (ja) | 2005-11-11 | 2011-07-13 | 株式会社 日立ディスプレイズ | 照明装置及びそれを用いた液晶表示装置 |
JP3992059B2 (ja) | 2005-11-21 | 2007-10-17 | 松下電工株式会社 | 発光装置の製造方法 |
JP2009087538A (ja) | 2006-01-20 | 2009-04-23 | Sharp Corp | 光源ユニット、及びそれを用いた照明装置、及びそれを用いた表示装置 |
US20070170449A1 (en) | 2006-01-24 | 2007-07-26 | Munisamy Anandan | Color sensor integrated light emitting diode for LED backlight |
USD572670S1 (en) | 2006-03-30 | 2008-07-08 | Nichia Corporation | Light emitting diode |
CN102800786B (zh) | 2006-04-24 | 2015-09-16 | 克利公司 | 发光二极管和显示元件 |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
KR100904152B1 (ko) | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지 |
TWM303325U (en) | 2006-07-13 | 2006-12-21 | Everlight Electronics Co Ltd | Light emitting diode package |
US7960819B2 (en) | 2006-07-13 | 2011-06-14 | Cree, Inc. | Leadframe-based packages for solid state emitting devices |
JP5564162B2 (ja) | 2006-09-29 | 2014-07-30 | フューチャー ライト リミテッド ライアビリティ カンパニー | 発光ダイオード装置 |
USD572210S1 (en) | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
CN101507004B (zh) | 2006-12-28 | 2011-04-20 | 日亚化学工业株式会社 | 发光装置、封装体、发光装置的制造方法、封装体的制造方法以及封装体制造用模具 |
US7800304B2 (en) * | 2007-01-12 | 2010-09-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Multi-chip packaged LED light source |
JP5106862B2 (ja) | 2007-01-15 | 2012-12-26 | 昭和電工株式会社 | 発光ダイオードパッケージ |
US7777412B2 (en) | 2007-03-22 | 2010-08-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Phosphor converted LED with improved uniformity and having lower phosphor requirements |
US7622795B2 (en) | 2007-05-15 | 2009-11-24 | Nichepac Technology Inc. | Light emitting diode package |
JP5233170B2 (ja) | 2007-05-31 | 2013-07-10 | 日亜化学工業株式会社 | 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法 |
US7923831B2 (en) | 2007-05-31 | 2011-04-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED-based light source having improved thermal dissipation |
US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
USD576574S1 (en) | 2007-07-17 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
CN100574543C (zh) | 2007-07-30 | 2009-12-23 | 深圳莱特光电有限公司 | 一种暖白光led封装过程中隔离银层的方法 |
US11114594B2 (en) | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US7968899B2 (en) | 2007-08-27 | 2011-06-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED light source having improved resistance to thermal cycling |
US7791093B2 (en) | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
CN101388161A (zh) | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
US7524087B1 (en) | 2007-11-16 | 2009-04-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Optical device |
CN101897040B (zh) | 2007-12-11 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | 具有混合顶部反射器的侧发射器件 |
US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
GB2458972B (en) | 2008-08-05 | 2010-09-01 | Photonstar Led Ltd | Thermally optimised led chip-on-board module |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US7841747B2 (en) * | 2008-12-11 | 2010-11-30 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device |
US20110049545A1 (en) | 2009-09-02 | 2011-03-03 | Koninklijke Philips Electronics N.V. | Led package with phosphor plate and reflective substrate |
-
2006
- 2006-08-16 US US11/465,120 patent/US8367945B2/en active Active
-
2007
- 2007-08-14 DE DE102007038320A patent/DE102007038320A1/de not_active Withdrawn
- 2007-08-15 JP JP2007211901A patent/JP5442189B2/ja active Active
- 2007-08-16 CN CN2007101423107A patent/CN101127350B/zh active Active
- 2007-08-16 CN CN201210046248.2A patent/CN102569273B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197974A (ja) * | 2001-12-24 | 2003-07-11 | Samsung Electro Mech Co Ltd | 発光ダイオードパッケージ |
JP2006509372A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | 複合リードフレームLEDパッケージおよびその製造方法本願は、2002年12月6日付け米国仮特許出願第60/431,523号、名称「熱拡散を改良したリードフレームベースのLEDあるいは半導体パッケージ(LeadframebasedLEDorsemiconductorpackagewithimprovedheatspreading)」の米国特許商標庁への出願日の恩恵を主張する。 |
JP2004214380A (ja) * | 2002-12-27 | 2004-07-29 | Polyplastics Co | リードフレーム形成用金属箔、電子部品用パッケージ、その製造方法、及び表面実装型発光部品 |
JP2005039100A (ja) * | 2003-07-16 | 2005-02-10 | Matsushita Electric Works Ltd | 高熱伝導性発光素子用回路部品及び高放熱モジュール |
JP2005079167A (ja) * | 2003-08-28 | 2005-03-24 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005191111A (ja) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005310935A (ja) * | 2004-04-20 | 2005-11-04 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101206059B1 (ko) * | 2010-01-20 | 2012-12-03 | 라이트온 테크놀러지 코포레이션 | 패키지 구조물 및 엘이디 패키지 구조물 |
JP2013524542A (ja) * | 2010-04-12 | 2013-06-17 | クリー フエジョウ オプト リミテッド | 表面実装デバイスの薄型パッケージ |
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
US9240395B2 (en) | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
JP2012238830A (ja) * | 2011-05-09 | 2012-12-06 | Lumirich Co Ltd | 発光ダイオード素子 |
US9711489B2 (en) | 2013-05-29 | 2017-07-18 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
KR20160109427A (ko) * | 2015-03-11 | 2016-09-21 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 라이트 유닛 |
JP2016171316A (ja) * | 2015-03-11 | 2016-09-23 | エルジー イノテック カンパニー リミテッド | 発光素子及びこれを備えたライトユニット |
KR102237155B1 (ko) | 2015-03-11 | 2021-04-07 | 엘지이노텍 주식회사 | 발광 소자 및 이를 구비한 라이트 유닛 |
JPWO2020045604A1 (ja) * | 2018-08-31 | 2021-08-12 | パナソニックIpマネジメント株式会社 | 半導体素子搭載用パッケージ及び半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101127350A (zh) | 2008-02-20 |
JP5442189B2 (ja) | 2014-03-12 |
CN101127350B (zh) | 2012-05-09 |
CN102569273A (zh) | 2012-07-11 |
CN102569273B (zh) | 2015-09-30 |
US8367945B2 (en) | 2013-02-05 |
DE102007038320A1 (de) | 2008-04-17 |
US20080041625A1 (en) | 2008-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5442189B2 (ja) | 電子要素の実装に使用する装置、システムおよび方法 | |
EP2011149B1 (en) | Surface mount device | |
US7675145B2 (en) | Apparatus, system and method for use in mounting electronic elements | |
US8669572B2 (en) | Power lamp package | |
KR100961493B1 (ko) | 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광 다이오드 패키지 제조방법 및 그것에 의해 제조된 발광 다이오드 패키지 | |
JP3165078B2 (ja) | 表面実装部品の製造方法 | |
US20080099779A1 (en) | SMD diode holding structure and package thereof | |
JP5989388B2 (ja) | パッケージ及びパッケージの製造方法 | |
JPH11163419A (ja) | 発光装置 | |
JP2002094122A (ja) | 光源装置及びその製造方法 | |
JP5834467B2 (ja) | 発光装置 | |
JP2015035592A (ja) | 発光装置 | |
JP2005175048A (ja) | 半導体発光装置 | |
JP2007005722A (ja) | 光半導体素子用外囲器およびそれを用いた光半導体装置 | |
KR100575216B1 (ko) | 발광소자용 패캐지 베이스 | |
JPH0555636A (ja) | 半導体発光装置の製造方法 | |
JP2004095576A (ja) | 光半導体装置及び光半導体モジュール及び光半導体装置の製造方法 | |
KR20170045544A (ko) | 발광 다이오드 패키지 및 그의 제조 방법 | |
JP6822442B2 (ja) | 発光装置およびその製造方法 | |
JP6847661B2 (ja) | 発光デバイス及びその形成方法 | |
KR101403247B1 (ko) | 발광다이오드 패키지 및 그 제조 방법 | |
CN109873072B (zh) | 发光装置、发光二极管封装结构及其制造方法 | |
JPH08116095A (ja) | 発光装置 | |
KR100877550B1 (ko) | 엘이디리드패널을 이용한 발광다이오드 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080605 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080605 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20101019 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101116 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101202 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20101221 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110414 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110419 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110719 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120607 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120709 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20120727 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130709 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131028 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131218 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5442189 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |