CN2646873Y - 表面贴装式、光轴倾斜的发光二极管 - Google Patents

表面贴装式、光轴倾斜的发光二极管 Download PDF

Info

Publication number
CN2646873Y
CN2646873Y CNU2003201089575U CN200320108957U CN2646873Y CN 2646873 Y CN2646873 Y CN 2646873Y CN U2003201089575 U CNU2003201089575 U CN U2003201089575U CN 200320108957 U CN200320108957 U CN 200320108957U CN 2646873 Y CN2646873 Y CN 2646873Y
Authority
CN
China
Prior art keywords
light axis
lens
light
pin
tube core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2003201089575U
Other languages
English (en)
Inventor
王鹰华
章千
欧文利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Sansi Technology Co Ltd
Original Assignee
Shanghai Sansi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Sansi Technology Co Ltd filed Critical Shanghai Sansi Technology Co Ltd
Priority to CNU2003201089575U priority Critical patent/CN2646873Y/zh
Application granted granted Critical
Publication of CN2646873Y publication Critical patent/CN2646873Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种表面贴装式、光轴倾斜的发光二极管，包括阴极管脚、阳极管脚、反光杯、管芯、透镜在内的结构，其特征是：表面贴装式结构，管芯、反光杯、透镜形成的光轴与焊盘面法线成α角，α角在1～30°范围内。实施该技术后的明显优点在于由于光轴倾斜，使得在某些特定的应用领域视线与光轴趋于一致，充分发挥发光二极管的发光效益，改善明亮环境下发光二极管显示标志的视认性。

Description

表面贴装式、光轴倾斜的发光二极管
一.技术领域
本实用新型涉及一种发光二极管，特别涉及的是一种表面贴装式结构、光轴倾斜的发光二极管。
二.背景技术
显示屏采用表面贴装式发光二极管的日益扩大已成为发展趋势，目前表面贴装式发光二极管的光轴都垂直于焊盘面，从发光二极管光强特性可知，视线与发光二极管光轴一致，具有视觉的最佳亮点，人们所看到的显示屏，当视线与发光二极管光轴不一致时，并非最亮状态，就是说，在某些应用环境存在着发光二极管光轴与视线不一致，存在着视觉效果不佳的明显缺陷。
三.发明内容
本实用新型的目的在于克服发光二极管光轴与观察者视线不一致，而造成视觉效果不佳的缺陷，对现有的表面贴装式发光二极管加以改进，使被使用于显示屏的发光二极管光轴与观察者视线趋于一致，达到最佳视觉效果。其技术是这样实现的：包括阴极管脚、阳极管脚、反光杯、管芯、透镜在内的结构，其特征是：表面贴装式结构，管芯、反光杯、透镜形成的光轴与焊盘面法线成α角，α角在1～30°范围内。实施该技术后的明显优点在于由于光轴倾斜，使得在某些特定的应用领域视线与光轴趋于一致，充分发挥发光二极管的发光效益，改善明亮环境下发光二极管显示标志的视认性。
四.附图说明
图1为本实用新型陶瓷基座式发光二极管的主视图；
其中，1-基座、2-阴极管脚、3-反光杯、4-管芯、5-透镜、6-焊盘面法线方向、7-发光二极管光轴、8-金丝、9-阳极管脚；
图1-1为本实用新型陶瓷基座式发光二极管的侧视图；
图2为本实用新型子弹头式发光二极管的主视图；
其中，1-阴极管脚、2-管芯、3-透镜、4-焊盘面法线方向、5-发光二极管光轴、6-金丝、7-反光杯、8-阳极管脚。
五.具体实施方法
以下结合附图1和附图2，对本实用新型两种形式的红色发光二极管分别作进一步的描述：
见图1，基座(1)一般为陶瓷材料，与现有的陶瓷基座贴片发光二极管不同是：基座(1)的焊盘面和顶面不是平行的，而是呈现有一个夹角α，阴极管脚(2)和阳极管脚(9)包覆在基座(1)上，管芯(4)的阴极通过银胶与阴极管脚(2)相连，管芯(4)的阳极通过金丝(8)与阳极管脚(9)相连，反光杯(3)设置在基座(1)的顶面，透镜(5)嵌在反光杯(3)中。
见图1，将陶瓷基座(1)加工成如图1所示的梯形形状(即焊盘面和顶面不是平行的，而是呈现有一个夹角α)；在市售的管芯(4)的阴极涂上银胶与阴极管脚(2)相连，然后烧结成一体；管芯(4)的阳极采用金丝(8)作为连接件，通过球焊方式连接到阳极管脚(9)；阴极管脚(2)和阳极管脚(9)按表面贴装方式包覆在基座(1)外；反光杯(3)粘结在基座(1)的顶部并使管芯(4)正好位于反光杯(3)底部的中心；在特定的透镜(5)模具中灌入环氧树脂，再将上面组装好的组件浸入环氧树脂中，烘干成形后，检验、测试、分档入库。
见图2，管芯(2)的背后设有反光杯(7)，管芯(2)的阴极通过银胶与阴极管脚(1)相连，管芯(2)的阳极通过金丝(6)与阳极管脚(8)相连，管芯(2)前方为椭圆形的透镜(3)，透镜(3)的下部密封包容管芯(2)、金丝(6)、反光杯(7)，阴极管脚(1)和阳极管脚(8)，阴极管脚(1)和阳极管脚(8)按表面贴装方式设置在透镜(3)底部。
见图2，市售的管芯(2)的阴极涂上银胶固定在与阴极管脚(1)连为一体的反光杯(7)的中心。然后烧结成一体。管芯(2)的阳极采用金丝(6)作为连接件，通过球焊方式连接到阳极管脚(8)。制作一组特定的透镜(3)的模具，该透镜(3)的底部(焊盘面)的法线(4)与发光二极管的光轴(5)形成夹角α，并在特定的透镜(3)模具中灌入环氧树脂，并将支架组件【包含阴极管脚(1)、管芯(2)、金丝(6)、阳极管脚(8)、反光杯(7)】插入环氧树脂，使环氧树脂包覆管芯(2)、金丝(6)、反光杯(7)以及阴极管脚(1)和阳极管脚(8)的内连接部分，阴极管脚(1)和阳极管脚(8)按表面贴装方式设置在透镜(3)底部，烘干成形后，检验、测试、分档入库。

Claims (1)

1.一种表面贴装式、光轴倾斜的发光二极管，包括阴极管脚、阳极管脚、反光杯、管芯、透镜在内的结构，其特征是：表面贴装式结构，管芯、反光杯、透镜形成的光轴与焊盘面法线成α角，α角在1～30°范围内。
CNU2003201089575U 2003-10-16 2003-10-16 表面贴装式、光轴倾斜的发光二极管 Expired - Lifetime CN2646873Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2003201089575U CN2646873Y (zh) 2003-10-16 2003-10-16 表面贴装式、光轴倾斜的发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2003201089575U CN2646873Y (zh) 2003-10-16 2003-10-16 表面贴装式、光轴倾斜的发光二极管

Publications (1)

Publication Number Publication Date
CN2646873Y true CN2646873Y (zh) 2004-10-06

Family

ID=34305110

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2003201089575U Expired - Lifetime CN2646873Y (zh) 2003-10-16 2003-10-16 表面贴装式、光轴倾斜的发光二极管

Country Status (1)

Country Link
CN (1) CN2646873Y (zh)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011003277A1 (en) * 2009-07-06 2011-01-13 Cree Huizhou Opto Limited Light emitting diode display with tilted peak emission pattern
WO2011072457A1 (zh) * 2009-12-18 2011-06-23 东协金属科技（深圳）有限公司 Led配光装置、led灯具及led器件
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
USD662902S1 (en) 2007-12-14 2012-07-03 Cree Hong Kong Limited LED package
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
CN102054925B (zh) * 2009-10-29 2013-12-11 富准精密工业(深圳)有限公司 发光二极管模组
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9542868B2 (en) 2011-10-31 2017-01-10 Everlight Electronics Co., Ltd. Light emitting device, surface mounted device-type light emitting device, and display device
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US20210123863A1 (en) * 2019-06-07 2021-04-29 Carrier Corporation Monitoring devices with surface mount technology

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD662902S1 (en) 2007-12-14 2012-07-03 Cree Hong Kong Limited LED package
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
WO2011003277A1 (en) * 2009-07-06 2011-01-13 Cree Huizhou Opto Limited Light emitting diode display with tilted peak emission pattern
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
CN102037504A (zh) * 2009-07-06 2011-04-27 惠州科锐光电有限公司 具有倾斜峰值发射图样的发光二极管显示器
CN102054925B (zh) * 2009-10-29 2013-12-11 富准精密工业(深圳)有限公司 发光二极管模组
CN102859274A (zh) * 2009-12-18 2013-01-02 东协金属科技（深圳）有限公司 Led配光装置、led灯具及led器件
WO2011072457A1 (zh) * 2009-12-18 2011-06-23 东协金属科技（深圳）有限公司 Led配光装置、led灯具及led器件
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US9542868B2 (en) 2011-10-31 2017-01-10 Everlight Electronics Co., Ltd. Light emitting device, surface mounted device-type light emitting device, and display device
US20210123863A1 (en) * 2019-06-07 2021-04-29 Carrier Corporation Monitoring devices with surface mount technology

Similar Documents

Publication Publication Date Title
CN2646873Y (zh) 表面贴装式、光轴倾斜的发光二极管
CN1892733A (zh) 具有状态指示器的电气设备
CN2646871Y (zh) 一种表面贴装式结构、透镜为椭圆形的发光二极管
CN209592031U (zh) 基于锥形反光杯的三基色led贴片灯珠
CN1996624A (zh) 发光二极管—led及其封装方法和应用
CN102185082A (zh) 发光二极管构造及其制造方法
CN2847231Y (zh) 仪表发光指针
CN201887074U (zh) 一种led均光芯片
CN1900753A (zh) 侧面发射发光二极管光源的内透镜
CN206584946U (zh) Csp光源及其制造模具
CN201045451Y (zh) 柔性条形防水led灯
CN200990882Y (zh) Led发光花卉
CN2869789Y (zh) 一种用于摩托车、汽车上的仪表盘
CN207999786U (zh) 一种导光中空透镜以及led灯珠
CN2304222Y (zh) 仪表显示板
CN101567323B (zh) 一种显示屏用三基色发光二极管的制造方法
CN2842180Y (zh) Led匀光指示灯
CN220436319U (zh) 一种灯罩
CN208507719U (zh) 高显低光衰led灯珠
CN215868500U (zh) 一种侧发光式数码显示模块
CN1047691C (zh) 可自由变色的全集光固体光源
CN2598077Y (zh) 一种板壳是凸状透明的led点阵模块
CN209801357U (zh) 一种具有多种视觉效果的均匀发光车灯光学结构
CN216120341U (zh) 一种倒装芯片结构及电子设备
CN2544167Y (zh) 太阳能专用灯泡

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Patentee address after: 201100 Shanghai city Minhang District Shuying Road No. 1280

Patentee address before: 201612 Shanghai City, Xuhui District Road, No. 1200

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20131016

Granted publication date: 20041006