CN2617039Y - 粘着型led引线架 - Google Patents

粘着型led引线架 Download PDF

Info

Publication number
CN2617039Y
CN2617039Y CN 03201554 CN03201554U CN2617039Y CN 2617039 Y CN2617039 Y CN 2617039Y CN 03201554 CN03201554 CN 03201554 CN 03201554 U CN03201554 U CN 03201554U CN 2617039 Y CN2617039 Y CN 2617039Y
Authority
CN
China
Prior art keywords
base
binding
seat portion
lead frame
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03201554
Other languages
English (en)
Inventor
游尚桦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi photoelectric Polytron Technologies Inc
Original Assignee
游尚桦
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 游尚桦 filed Critical 游尚桦
Priority to CN 03201554 priority Critical patent/CN2617039Y/zh
Priority to EP03009573A priority patent/EP1450413A3/en
Application granted granted Critical
Publication of CN2617039Y publication Critical patent/CN2617039Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

本实用新型是一种粘着型LED引线架，其包括：一晶座，是导电实心座体，中央为较高的座部，两侧则为高度较低且厚度较薄的粘着部，座部顶面上则开具一晶穴；一阳极片，是一体设置于晶座一侧，其平行于粘着部的一平贴部，以及一动向对应于座部的接线部，且晶座与阳极片间，有厚度甚薄的相同材料的座部连结及平贴连结；以便可借座部于置入固晶或晶片并接线封装前，去除其间的座部连结，封装后再去除平贴连结而形成可粘着于电路板的两极。

Description

粘着型LED引线架
技术领域
本实用新型是一种粘着型LED引线架，尤指一种可借以粘着方式组装于电路板上的LED引线架。
背景技术
LED作为发光元件，行之已久，时至今日，诸多发光装置，如汽车灯，交通指挥棒，以及照明装置等，都使用LED，究其原因，乃在于体积小，耗电量低，因此，对产品设计，LED的使用，有其不可替代的位置。
LED的作用原理，是透过正极与负极的电流，通过固晶或晶片A，以使固晶或晶片A发光，因此，常见的态样是，将固晶或晶片A定位于一可引出接极的引线架，并予以封装，以形成具固晶或晶片A的引线架，该引线架再装设于电路板并接通电路，以形成可导通状态，所以，引线架的设计，亦为业者所研发与亟欲改良的课题。
由于目前的电子元件组装，采用表面熔着技术(Surface MeltingTechnology，简称SMT)以连结电子组件或构件，乃日趋频繁，而现有的LED引线架透过嵌插于电路板的方式，自有予以改进的必要。
实用新型内容
本实用新型的目的是提供一种LED引线架，能适合可借由粘着方式以组装于电路板，且兼具良好散热的性能。
为达到上述目的，本实用新型的技术解决方案是提供一种粘着型LED引线架，其包括：
一晶座，是导电实心座体，中央为较高的座部，两侧则为高度较低且厚度较薄的粘着部，座部顶面上则开具一晶穴；
一阳极片，是一体设置于晶座一侧，其有平行于粘着部的一平贴部，以及一动向对应于座部的接线部，且晶座与阳极片间，有厚度甚薄的相同材料的座部连结及平贴连结；以便可借座部于置入固晶或晶片并接线封装前，去除其间的座部连结，封装后再去除平贴连结而形成可粘着于电路板的两极。
所述的粘着型LED引线架，是经由押出，脱腊铸造，蚀刻，粉末冶金，压铸，挤型，锻造，冲压或重铸造成型。
所述的粘着型LED引线架，是为一体成型，材料则可为铜、铁、铝或其他导电金属。
所述的粘着型LED引线架，其中的晶座另侧，得对向一体设置包含接线部，平贴部及连结部的第二阳极片及第三阳极片。
本实用新型可以以预成型方式形成架体，而免除现有的必须冲压弯折的不便现象，并避免不良品的产生且达品质与尺寸均一的优点，尤有进者，晶座1的采用实心方式，则可有效提高导电与散热效果，进而提高发光亮度装置产品的稳定性。
附图说明
图1为本实用新型的第一实施例立体示意图；
图2为本实用新型的第二实施例立体示意图；
图3为本实用新型封装后连结于电路板示意图；
图4为本实用新型封装后的立体示意图。
具体实施方式
如图1所示，本实用新型的引线架是由一晶座1，一阳极片2及其间的连结3所组合而成。
其中，晶座1是为一实心座体并作为阴极使用，故其以导电材质制造，且此晶座1其中央高度较高的座部11，两侧则为厚度较薄且高度较低的平坦底面的粘着部12，粘着部12是为于与印刷电路板装置时可供粘着之用，座部11的厚度较厚，是有利于散热，而座部11的顶面，则开具一晶穴13，以便供容置固晶或晶片A之用。阳极片2是设于前述晶座1的一侧，其为与晶座1相同材质，且形状动向上与之对应，是以，其具有水平向可供与电路板粘着的平贴部21，以及向上垂直延伸并转折至前述晶穴13附近的接线部22，前已述及，阳极片2于实际实施时是为供正极使用。
实则，晶座1与阳极片2可为一体成型，如押出、脱腊铸造，蚀刻、粉末冶金，压铸，挤型，锻造，冲压…等方式为之，是以，为便于加工，则可于晶座1与阳极片2之间，形成厚度较薄的晶座连结3，亦即接线部22与座部11间有一座部连结31，以及粘着部12与平贴部21间的平贴连结32，以便于未加工前形成一体。
本实用新型于实施时，当将固晶或晶片A置入晶穴，并连结接线B后，先将座部连结31去除，该去除可为如割除，而后予以封装，使座部11的上方与接线部22的上方连结，形成固定状态，亦即如图3所示者，而后，再将平贴连结32去除，使阳极片2与晶座1之间，形成不接触的完全分离状态，如此，即不致有短路之虞，而封装后是如图4所示的立体。
前已述及，本实用新型于实施时是可将此引线架粘着于电路板，使其成具电路导通状态，如此，即可免除现有的必须借接脚嵌插的困扰。
而对于配置两只或两只以上固晶或晶片A的场合，则请参阅图2，其于晶座1的另侧，得以晶穴13为中心，两侧各设一第二阳极片4及一第三阳极片5，且其可为前述相同方式，与晶座1为一体设置，并有较薄厚度的底部连结，而后再依序于封装前后予以移除，如此，即形成具三只阳极于阴极的晶座1两侧的形态，而为两只或两只以上固晶或晶片A的使用。
所以，经由本实用新型的实施，其可以以预成型方式形成架体，而免除现有的必须冲压弯折的不便现象，并避免不良品的产生且达品质与尺寸均一的优点，尤有进者，晶座1的采用实心方式，则可有效提高导电与散热效果，进而提高发光亮度装置产品的稳定性。
本实用新型所揭示者，乃较佳实施例的一种，举凡局部的变更或修饰而源于本实用新型的技术思想而为熟习该项技艺的人所易于推知者，俱不脱本实用新型的专利权范畴。

Claims (3)

1.一种粘着型LED引线架，其特征在于，包括：
一晶座，是导电实心座体，中央为较高的座部，两侧则为高度较低且厚度较薄的粘着部，座部顶面上则开具一晶穴；
一阳极片，是一体设置于晶座一侧，其有平行于粘着部的一平贴部，以及一动向对应于座部的接线部，且晶座与阳极片间，有厚度甚薄的相同材料的座部连结及平贴连结；可借座部于置入固晶或晶片并接线封装前，去除其间的座部连结，封装后再去除平贴连结而形成可粘着于电路板。
2.如权利要求1所述的粘着型LED引线架，其特征在于，其为一体成型，材料则可为铜、铁、铝或其他导电金属。
3.如权利要求1所述的粘着型LED引线架，其特征在于，其中的晶座另侧，得对向一体设置包含接线部，平贴部及连结部的第二阳极片及第三阳极片。
CN 03201554 2003-02-21 2003-02-21 粘着型led引线架 Expired - Fee Related CN2617039Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 03201554 CN2617039Y (zh) 2003-02-21 2003-02-21 粘着型led引线架
EP03009573A EP1450413A3 (en) 2003-02-21 2003-04-28 Adhesive type LED lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03201554 CN2617039Y (zh) 2003-02-21 2003-02-21 粘着型led引线架

Publications (1)

Publication Number Publication Date
CN2617039Y true CN2617039Y (zh) 2004-05-19

Family

ID=32719976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03201554 Expired - Fee Related CN2617039Y (zh) 2003-02-21 2003-02-21 粘着型led引线架

Country Status (2)

Country Link
EP (1) EP1450413A3 (zh)
CN (1) CN2617039Y (zh)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452455C (zh) * 2005-01-31 2009-01-14 三星电机株式会社 Led封装框架和具有该led封装框架的led封装
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3870301B2 (ja) * 1996-06-11 2007-01-17 ヤマハ株式会社 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム
JP4215306B2 (ja) * 1998-08-27 2009-01-28 シチズン電子株式会社 半導体のパッケージおよびその製造方法
US6667541B1 (en) * 1998-10-21 2003-12-23 Matsushita Electric Industrial Co., Ltd. Terminal land frame and method for manufacturing the same
JP4102012B2 (ja) * 2000-09-21 2008-06-18 株式会社東芝 半導体装置の製造方法および半導体装置
US20020163001A1 (en) * 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452455C (zh) * 2005-01-31 2009-01-14 三星电机株式会社 Led封装框架和具有该led封装框架的led封装
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Also Published As

Publication number Publication date
EP1450413A2 (en) 2004-08-25
EP1450413A3 (en) 2009-08-05

Similar Documents

Publication Publication Date Title
CN2617039Y (zh) 粘着型led引线架
JP3097775U (ja) 接着型ｌｅｄリード・フレーム
EP1630869A3 (en) Active matrix substrate, method of manufacturing active matrix substrate, electro-optical device, and electronic apparatus
CN203812910U (zh) 一种高利用率和高光效的led阵列支架
CN203180295U (zh) 铆压接线端子工装
CN109585172A (zh) 一种耐振动铝电解电容器
CN2509675Y (zh) 具两面发光的发光二极管显示器
CN2357414Y (zh) 改进的半导体元件引线框架
CN201429033Y (zh) 一种新型led串联模组封装结构
CN202019016U (zh) 金属锂一次电池负极片
CN200983403Y (zh) 发光二极管与支架的连接装置
CN209297911U (zh) 一种耐振动铝电解电容器
CN210225895U (zh) 一种mos管的散热结构
CN2622869Y (zh) 发光二极管座体
CN111933780A (zh) 一种新型led灯珠六脚支架及其内部线路布置方法
CN2370569Y (zh) 一种二极管
CN203596351U (zh) 一种led-cob光源
CN2591779Y (zh) 无引脚半导体组件
CN201421846Y (zh) 发光二极管结构
CN213592150U (zh) 一种软包锂电池焊接工装
CN213689688U (zh) 免焊接可批量测试的薄膜电容试验夹具及装置
CN103292175A (zh) Led球泡灯
CN220540910U (zh) 一种led灯贴片支架
CN2303398Y (zh) 微型浪涌保护器
CN2575845Y (zh) 表面粘着电子组件的金属支架结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SANMEI PHOTOELECTRIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: YOU SHANGHUA

Effective date: 20070907

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20070907

Address after: Mauritius Yibineisaiboshi No. 35 Alexander house 3

Patentee after: Mitsumi photoelectric Polytron Technologies Inc

Address before: Taipei County of Taiwan Province

Patentee before: You Shanghua

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040519

Termination date: 20100221