CN2622869Y - 发光二极管座体 - Google Patents

发光二极管座体 Download PDF

Info

Publication number
CN2622869Y
CN2622869Y CN 03238538 CN03238538U CN2622869Y CN 2622869 Y CN2622869 Y CN 2622869Y CN 03238538 CN03238538 CN 03238538 CN 03238538 U CN03238538 U CN 03238538U CN 2622869 Y CN2622869 Y CN 2622869Y
Authority
CN
China
Prior art keywords
anode
cathode block
seat
pedestal
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03238538
Other languages
English (en)
Inventor
游尚桦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Photoelectric Polytron Technologies Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 03238538 priority Critical patent/CN2622869Y/zh
Priority to EP20030011310 priority patent/EP1460695A2/en
Application granted granted Critical
Publication of CN2622869Y publication Critical patent/CN2622869Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本实用新型是一种发光二极管座体，其包括：一阴极座，是为导电材质制成，底部外侧具一平直的阴极座片，且内侧一体连结一阴极座体，其侧向开具若干自顶至底的阴极座沟，顶面上则挖具一阴极座穴；一阳极座，亦为导电材质制成，底部外侧具一平直的阳极座片，内侧则一体连结一阳极座体，其侧向开具若干自顶至底的阳极座沟；以便可由阴极座穴定位晶粒，且接线两端连结晶粒及阳极座体，而阴极座片与阳极座片可粘着于电路板的电路以形成通路。

Description

发光二极管座体
技术领域
本实用新型是一种发光二极管座体，尤指一种具较佳散热且可配合电路板施工的发光二极管的座体。
背景技术
按发光二极管于电子产品中多有所见，由于其可作为显示功能，故一般的灯号均有使用发光二极管的情形，究其原因，在于体积小，耗电量低，照度足，故有其不可替代的角色扮演。
近年来，电子行业普遍采行表面粘着技术(Surface MeltingTechnology，简称SMT)，因此，发光二极管在设计上，必须因应此加工技术，此外，由于发光二极管于作动后，会产生热量，故如何将此热量导出，亦值得使用者关切，因为发光二极管的损毁，亦连带使电子组件失去指示功能，可谓“牵一发而动全身”。
实用新型内容
有监于此，申请人乃本于长年来从事发光二极管座架研发与产销的经验，潜心研究，期能发展进一道合于前述功能的发光二极管座体，经再三实验，始创作出本实用新型的“发光二极管座体”。
本实用新型的目的在于，提供一种发光二极管座体，其具有散热性好的优点。
本实用新型一种发光二极管座体，其特征在于，其包括：
一阴极座，是为导电材质制成，底部外侧具一平直的阴极座片，且内侧一体连结一阴极座体，其侧向开具若干自顶至底的阴极座沟，顶面上则挖具一阴极座穴；
一阳极座，亦为导电材质制成，底部外侧具一平直的阳极座片  内侧则一体连结一阳极座体，其侧向开具若干自顶至底的阳极座沟；
由阴极座穴定位晶粒，且接线两端连结晶粒及阳极座体，而阴极座片与阳极座片可粘着于电路板的电路以形成通路。
其中的阴极座与阳极座是为相关材质。
其中的阴极座与阳极座是为一体成型后予以切割。
其中的阴极座体与阳极座体的底部是高于阴极座片与阳极座片的底部。
其中的阴极座体的位于阴极座穴下方，是自底部开具一非贯穿的阴极座孔。
其中的阴极座体与阳极座体的对应边是为对应的直线或波浪形。
其中座体的材料亦可为铜、铁、铝或导电金属。
附图说明
为进一步揭示本实用新型的具体技术内容，以下结合附图及实施例详细说明于后，其中：
图1为本实用新型的立体示意图；
图2为本实用新型的断面图；
图3为本实用新型封装后的立体示意图。
具体实施方式
如图所示，本实用新型是可供连结于电路板A，且可供置放一晶粒(或称固晶，晶片)B及接线C的座体，其是由一阴极座1及一阳极座2所组合而成。
其中，阴极座1是为导电材质制成，其侧向底合具一段可供与电路板A为连结的平直的阴极座片11，并向上垂直一体连结一阴极座体12，该阴极座体12的底部是较前述的阴极座片11为高，且其侧向开具若干由上而下连互于整个高度的阴极座沟13，此外，为使可供固晶的容置，故顶面上挖具一阴极座穴14，为使其可为更佳的散热，故对应于阴极座穴14的下方，自底部开具一非贯穿阴极座穴14的阴极座孔15(亦示于图2)。而阴极座体12的对应于后叙阳极座2的侧边，可为平直或如本实用新型所揭示的波浪形。
阳极座2其亦为导热材质制成，且一如前述的阴极座1，其底部俱一段向外延伸的阳极座片21，而后垂直一体延伸一阳极座体22，该阳极座体22的底部是高于前述的阳极座片21，且两侧亦开具自顶至底的阳极座沟23，而阳极座体22对应于前述阴极座体12处，是为对应的形状，亦即可为相对应的直线，或波浪形。
实则，本实用新型可为以预成型方式，形成阴极座1与阳极座2，唯分界处为底部的小部份连结，当放置固晶及焊线封胶后再予以切开分离，唯此乃制法之一，故不拟赘述。
请再参阅图3所示，本实用新型于实施时晶粒B是可定位于阴极座穴14，而后，再以焊接方式将接线C两端分别固定连结于晶粒B及阳极座体22的顶面，形成导通状态。
当本实用新型座体施的于电路板A时，则可由阴极座片11与阳极座片21粘着于电路板A的电路上，以完成组装，此时，由于阴极座体12与阳极座体22下方是悬空于电路板A，故具透气效果，且经由阴极座槽13与阳极座槽23的热流效果，即可将热气导出，而达散热的目的，此外，晶粒B下方的阴极座孔15亦可发挥散热功效。
所以，经由本实用新型的实施，可便捷地施之于电路板，且具较佳的散热，实属发光二极管座体的一大改良与突破。
本实用新型所揭示者，乃较佳实施例的一种，凡是局部的变更或修饰而源于本实用新型的技术思想而为熟悉该项技艺的人所易于推知的，俱不脱本实用新型的专利权范畴。

Claims (7)

1.一种发光二极管座体，其特征在于，其包括：
一阴极座，是为导电材质制成，底部外侧具一平直的阴极座片，且内侧一体连结一阴极座体，其侧向开具若干自顶至底的阴极座沟，顶面上则挖具一阴极座穴；
一阳极座，亦为导电材质制成，底部外侧具一平直的阳极座片，内侧则一体连结一阳极座体，其侧向开具若干自顶至底的阳极座沟；
由阴极座穴定位晶粒，且接线两端连结晶粒及阳极座体，而阴极座片与阳极座片可粘着于电路板的电路以形成通路。
2.如权利要求1所述的发光二极管座体，其特征在于，其中的阴极座与阳极座是为相关材质。
3.如权利要求1所述的发光二极管座体，其特征在于，其中的阴极座与阳极座是为一体成型后予以切割。
4.如权利要求1所述的发光二极管座体，其特征在于，其中的阴极座体与阳极座体的底部是高于阴极座片与阳极座片的底部。
5.如权利要求1所述的发光二极管座体，其特征在于，其中的阴极座体的位于阴极座穴下方，是自底部开具一非贯穿的阴极座孔。
6.如权利要求1所述的发光二极管座体，其特征在于，其中的阴极座体与阳极座体的对应边是为对应的直线或波浪形。
7.如权利要求1所述的发光二极管座体，其特征在于，其中座体的材料亦可为铜、铁、铝或导电金属。
CN 03238538 2003-03-17 2003-03-17 发光二极管座体 Expired - Fee Related CN2622869Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 03238538 CN2622869Y (zh) 2003-03-17 2003-03-17 发光二极管座体
EP20030011310 EP1460695A2 (en) 2003-03-17 2003-05-19 LED heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03238538 CN2622869Y (zh) 2003-03-17 2003-03-17 发光二极管座体

Publications (1)

Publication Number Publication Date
CN2622869Y true CN2622869Y (zh) 2004-06-30

Family

ID=32778672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03238538 Expired - Fee Related CN2622869Y (zh) 2003-03-17 2003-03-17 发光二极管座体

Country Status (2)

Country Link
EP (1) EP1460695A2 (zh)
CN (1) CN2622869Y (zh)

Also Published As

Publication number Publication date
EP1460695A2 (en) 2004-09-22

Similar Documents

Publication Publication Date Title
CN102751426B (zh) 封装结构及发光二极管封装结构
CN201401765Y (zh) 发光二极管灯具用的散热模块
CN201129679Y (zh) 具有贴片式支架的led灯板结构
CN2622869Y (zh) 发光二极管座体
CN2624578Y (zh) 一种交直流两用的led灯
CN2745158Y (zh) 改进的点矩阵二极管结构
CN2796317Y (zh) 电器用的散热器
CN2509675Y (zh) 具两面发光的发光二极管显示器
CN200979135Y (zh) 一种led路灯
CN202564373U (zh) 一种拉夹式薄片led贴片结构
CN218613820U (zh) 一种smd指示灯快速装配焊接工装
CN2615869Y (zh) 发光二极管支架的改进
CN200964444Y (zh) 永久镍扣阴极板
CN206176061U (zh) 无基板组装led灯柱
CN2760392Y (zh) 发光二极管固定装置
CN200962382Y (zh) 切换开关的改进结构
CN2803536Y (zh) 一种胶囊筛
CN2899117Y (zh) 发光二极管的散热结构
CN202598238U (zh) 一种led模组新型结构
CN201983172U (zh) Led太阳能小夜灯
CN2468158Y (zh) 一种新型发光二极管构造
CN2859212Y (zh) 一种用于制造大功率led的支架
CN203549503U (zh) 可多面贴装式贴片led支架及led灯、led灯具
CN2643708Y (zh) 改进的塑料电池座式闪光饰物品
CN211952620U (zh) 基于led的高效节能变色霓虹灯

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SANMEI PHOTOELECTRIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: YOU SHANGHUA

Effective date: 20071012

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071012

Address after: Mauritius Yibineisaiboshi No. 35 Alexander house 3

Patentee after: Mitsumi photoelectric Polytron Technologies Inc

Address before: Taipei County of Taiwan Province

Patentee before: You Shanghua

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040630

Termination date: 20100317