GB2420221B - Solid-state semiconductor light emitting device - Google Patents

Solid-state semiconductor light emitting device

Info

Publication number
GB2420221B
GB2420221B GB0424976A GB0424976A GB2420221B GB 2420221 B GB2420221 B GB 2420221B GB 0424976 A GB0424976 A GB 0424976A GB 0424976 A GB0424976 A GB 0424976A GB 2420221 B GB2420221 B GB 2420221B
Authority
GB
United Kingdom
Prior art keywords
solid
light emitting
emitting device
semiconductor light
state semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0424976A
Other versions
GB2420221A (en
GB0424976D0 (en
Inventor
Yuan-Cheng Chin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Opto Technology Co Ltd
Original Assignee
Unity Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Priority to GB0424976A priority Critical patent/GB2420221B/en
Publication of GB0424976D0 publication Critical patent/GB0424976D0/en
Publication of GB2420221A publication Critical patent/GB2420221A/en
Application granted granted Critical
Publication of GB2420221B publication Critical patent/GB2420221B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
GB0424976A 2004-11-12 2004-11-12 Solid-state semiconductor light emitting device Expired - Fee Related GB2420221B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0424976A GB2420221B (en) 2004-11-12 2004-11-12 Solid-state semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0424976A GB2420221B (en) 2004-11-12 2004-11-12 Solid-state semiconductor light emitting device

Publications (3)

Publication Number Publication Date
GB0424976D0 GB0424976D0 (en) 2004-12-15
GB2420221A GB2420221A (en) 2006-05-17
GB2420221B true GB2420221B (en) 2009-09-09

Family

ID=33523601

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0424976A Expired - Fee Related GB2420221B (en) 2004-11-12 2004-11-12 Solid-state semiconductor light emitting device

Country Status (1)

Country Link
GB (1) GB2420221B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4238907B2 (en) * 2006-10-18 2009-03-18 セイコーエプソン株式会社 Inkjet recording device
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN100546058C (en) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 Power luminous diode packaging structure
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376902B1 (en) * 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
JP2003303936A (en) * 2002-04-12 2003-10-24 Matsushita Electric Ind Co Ltd Lead frame and manufacturing method thereof, and chip type led employing the lead frame
US20040075100A1 (en) * 2001-04-10 2004-04-22 Georg Bogner Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
EP1469707A2 (en) * 2003-04-14 2004-10-20 Integral Technologies, Inc. Lighting circuits manufactured from conductive loaded resin-based materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376902B1 (en) * 1997-07-29 2002-04-23 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelectronic structural element
US20040075100A1 (en) * 2001-04-10 2004-04-22 Georg Bogner Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
JP2003303936A (en) * 2002-04-12 2003-10-24 Matsushita Electric Ind Co Ltd Lead frame and manufacturing method thereof, and chip type led employing the lead frame
EP1469707A2 (en) * 2003-04-14 2004-10-20 Integral Technologies, Inc. Lighting circuits manufactured from conductive loaded resin-based materials

Also Published As

Publication number Publication date
GB2420221A (en) 2006-05-17
GB0424976D0 (en) 2004-12-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20201112