JP2007511102A - 電子デバイス中に使用される表面にゲッター材料を接着する方法 - Google Patents

電子デバイス中に使用される表面にゲッター材料を接着する方法 Download PDF

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Publication number
JP2007511102A
JP2007511102A JP2006539837A JP2006539837A JP2007511102A JP 2007511102 A JP2007511102 A JP 2007511102A JP 2006539837 A JP2006539837 A JP 2006539837A JP 2006539837 A JP2006539837 A JP 2006539837A JP 2007511102 A JP2007511102 A JP 2007511102A
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JP
Japan
Prior art keywords
getter
composition
electronic device
glass frit
densification
Prior art date
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Pending
Application number
JP2006539837A
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English (en)
Japanese (ja)
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JP2007511102A5 (enExample
Inventor
ダニエル トレメル ジェイムズ
デューイ ヒューバート マシュー
カルデリーノ テリ
チョウ ヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
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EI Du Pont de Nemours and Co
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Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2007511102A publication Critical patent/JP2007511102A/ja
Publication of JP2007511102A5 publication Critical patent/JP2007511102A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B01J20/16—Alumino-silicates
    • B01J20/18—Synthetic zeolitic molecular sieves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B01J20/16—Alumino-silicates
    • B01J20/18—Synthetic zeolitic molecular sieves
    • B01J20/183—Physical conditioning without chemical treatment, e.g. drying, granulating, coating, irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
    • B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
    • B01J20/28033—Membrane, sheet, cloth, pad, lamellar or mat
    • B01J20/28035—Membrane, sheet, cloth, pad, lamellar or mat with more than one layer, e.g. laminates, separated sheets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Drying Of Gases (AREA)
  • Casings For Electric Apparatus (AREA)
JP2006539837A 2003-11-12 2004-11-10 電子デバイス中に使用される表面にゲッター材料を接着する方法 Pending JP2007511102A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
PCT/US2004/037596 WO2005050736A1 (en) 2003-11-12 2004-11-10 A method for adhering getter material to a surface for use in electronic devices

Publications (2)

Publication Number Publication Date
JP2007511102A true JP2007511102A (ja) 2007-04-26
JP2007511102A5 JP2007511102A5 (enExample) 2008-01-10

Family

ID=34619331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006539837A Pending JP2007511102A (ja) 2003-11-12 2004-11-10 電子デバイス中に使用される表面にゲッター材料を接着する方法

Country Status (6)

Country Link
US (1) US20050238803A1 (enExample)
JP (1) JP2007511102A (enExample)
KR (1) KR20060123286A (enExample)
CN (2) CN1871718A (enExample)
TW (1) TW200525002A (enExample)
WO (1) WO2005050736A1 (enExample)

Cited By (11)

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JP2007538392A (ja) * 2004-05-18 2007-12-27 ジュート−ヒェミー　アクチェンゲゼルシャフト 吸収剤を含んだフィルム状化合物
JP2010541265A (ja) * 2007-10-04 2010-12-24 サエス ゲッターズ ソチエタ ペル アツィオニ 複合材ゲッター系を含むポリマー３層体を用いた光起電性パネルの製造方法
JP2012529149A (ja) * 2009-06-01 2012-11-15 住友化学株式会社 電子デバイス用の改良電極のための組成物
JP5128670B2 (ja) * 2008-08-27 2013-01-23 セイコーインスツル株式会社 圧電振動子、発振器、電子機器及び電波時計、並びに圧電振動子の製造方法
WO2014136359A1 (ja) * 2013-03-07 2014-09-12 ローム株式会社 有機薄膜太陽電池およびその製造方法、および電子機器
JP2014175380A (ja) * 2013-03-07 2014-09-22 Rohm Co Ltd 有機薄膜太陽電池およびその製造方法
JP2014192188A (ja) * 2013-03-26 2014-10-06 Rohm Co Ltd 有機薄膜太陽電池およびその製造方法、および電子機器
JP2014192343A (ja) * 2013-03-27 2014-10-06 Kyocera Corp 電子装置および電子装置の製造方法
JP2014192196A (ja) * 2013-03-26 2014-10-06 Rohm Co Ltd 有機薄膜太陽電池およびその製造方法、および電子機器
WO2019188424A1 (ja) 2018-03-30 2019-10-03 パナソニックＩｐマネジメント株式会社 ゲッタ材、ゲッタ材の製造方法、ゲッタ材含有組成物の製造方法、及びガラスパネルユニットの製造方法
WO2023157686A1 (ja) * 2022-02-16 2023-08-24 日本板硝子株式会社 複層ガラスパネル

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US7438829B2 (en) * 2003-11-13 2008-10-21 E.I. Du Pont De Nemours And Company Thick film getter paste compositions for use in moisture control
DE102005005579A1 (de) * 2005-02-07 2006-08-24 Schott Ag OLED-Verkapselung mit Wasserdampf- und sauerstoffabsorbierenden Zwischenschichten
CN104118164B (zh) * 2005-02-17 2018-09-07 泽斯吸气剂公司 柔性多层吸气器
US20070013305A1 (en) * 2005-07-18 2007-01-18 Wang Carl B Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
ITMI20051500A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente permeabile
ITMI20051502A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti uno o piu' depositi di materiale getter ed uno strato di materiale per il trasporto di h02o
DE102005050561A1 (de) * 2005-10-17 2007-04-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Element zur flächigen Beleuchtung
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
KR100645705B1 (ko) * 2006-01-27 2006-11-15 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8453393B2 (en) * 2006-08-25 2013-06-04 Raytheon Company Encapsulated and vented particulate thermal insulation
JP4844322B2 (ja) * 2006-09-26 2011-12-28 パナソニック電工株式会社 真空封止デバイスの製造方法
KR100922349B1 (ko) * 2007-08-28 2009-10-21 삼성모바일디스플레이주식회사 유기 발광 표시 장치
KR101464305B1 (ko) * 2007-09-11 2014-11-21 주식회사 동진쎄미켐 게터 페이스트 조성물
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WO2010023728A1 (ja) 2008-08-27 2010-03-04 セイコーインスツル株式会社 圧電振動子の製造方法、圧電振動子、発振器、電子機器および電波時計
KR101180234B1 (ko) * 2009-04-03 2012-09-05 (주)엘지하우시스 디자인층을 구비한 건물 일체형 태양전지 모듈
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TWI443784B (zh) 2010-07-29 2014-07-01 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
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CN106810982B (zh) * 2017-01-18 2021-08-03 安徽益东惠电子科技有限公司 一种用于吸收气密性封装器件有害气体的吸气剂浆料、其制备方法及其所得涂层
GB2561580A (en) * 2017-04-19 2018-10-24 M Solv Ltd Method of forming a seal, method of manufacturing a sealed unit, a sealed unit, and apparatus for forming a seal
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US11394183B2 (en) 2017-12-22 2022-07-19 Milwaukee Electric Tool Corporation Knife accessory for hot stick
DE102018208168A1 (de) * 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
CN109331615A (zh) * 2018-09-26 2019-02-15 昂纳信息技术（深圳）有限公司 一种吸气剂的固定方法以及一种吸气结构
KR102605376B1 (ko) 2018-12-31 2023-11-23 삼성디스플레이 주식회사 표시 장치
CN114267809B (zh) * 2021-12-15 2023-11-03 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
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