CN1871718A - 用于电子器件的封装组件 - Google Patents

用于电子器件的封装组件 Download PDF

Info

Publication number
CN1871718A
CN1871718A CNA2004800307796A CN200480030779A CN1871718A CN 1871718 A CN1871718 A CN 1871718A CN A2004800307796 A CNA2004800307796 A CN A2004800307796A CN 200480030779 A CN200480030779 A CN 200480030779A CN 1871718 A CN1871718 A CN 1871718A
Authority
CN
China
Prior art keywords
electronic device
barrier
substrate
barrier structure
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800307796A
Other languages
English (en)
Chinese (zh)
Inventor
J·D·特雷梅尔
M·D·休伯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1871718A publication Critical patent/CN1871718A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B01J20/16—Alumino-silicates
    • B01J20/18—Synthetic zeolitic molecular sieves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B01J20/16—Alumino-silicates
    • B01J20/18—Synthetic zeolitic molecular sieves
    • B01J20/183—Physical conditioning without chemical treatment, e.g. drying, granulating, coating, irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
    • B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
    • B01J20/28033—Membrane, sheet, cloth, pad, lamellar or mat
    • B01J20/28035—Membrane, sheet, cloth, pad, lamellar or mat with more than one layer, e.g. laminates, separated sheets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/06—Controlling, e.g. regulating, parameters of gas supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Drying Of Gases (AREA)
  • Casings For Electric Apparatus (AREA)
CNA2004800307796A 2003-11-12 2004-11-10 用于电子器件的封装组件 Pending CN1871718A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51913903P 2003-11-12 2003-11-12
US60/519,139 2003-11-12
US60/619,222 2004-10-15

Publications (1)

Publication Number Publication Date
CN1871718A true CN1871718A (zh) 2006-11-29

Family

ID=34619331

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2004800307796A Pending CN1871718A (zh) 2003-11-12 2004-11-10 用于电子器件的封装组件
CN2004800375026A Expired - Fee Related CN1894790B (zh) 2003-11-12 2004-11-10 将吸气剂材料粘结到在电子器件中使用的表面的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2004800375026A Expired - Fee Related CN1894790B (zh) 2003-11-12 2004-11-10 将吸气剂材料粘结到在电子器件中使用的表面的方法

Country Status (6)

Country Link
US (1) US20050238803A1 (enExample)
JP (1) JP2007511102A (enExample)
KR (1) KR20060123286A (enExample)
CN (2) CN1871718A (enExample)
TW (1) TW200525002A (enExample)
WO (1) WO2005050736A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102695941A (zh) * 2009-11-12 2012-09-26 萨基姆防务安全公司 陀螺仪传感器
CN102978585A (zh) * 2011-09-05 2013-03-20 Sfa工程股份有限公司 用于平板显示器的化学气相沉积装置
CN103079818A (zh) * 2010-07-02 2013-05-01 3M创新有限公司 阻挡组件
CN103988312A (zh) * 2011-10-13 2014-08-13 Lg伊诺特有限公司 太阳能电池及使用其的太阳能电池模块
CN104591526B (zh) * 2009-07-17 2017-07-28 康宁股份有限公司 用于密封玻璃封装体的熔接盖板
CN107254206A (zh) * 2012-01-19 2017-10-17 纳米技术有限公司 用于发光应用的模制纳米粒子磷光体
CN110574182A (zh) * 2017-04-19 2019-12-13 万佳雷射有限公司 密封的形成方法，密封单元的制造方法，密封单元以及形成密封的装置

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7438829B2 (en) * 2003-11-13 2008-10-21 E.I. Du Pont De Nemours And Company Thick film getter paste compositions for use in moisture control
DE102004024676A1 (de) * 2004-05-18 2005-12-15 Süd-Chemie AG Filmförmige sorbenshaltige Zusammensetzungen
DE102005005579A1 (de) * 2005-02-07 2006-08-24 Schott Ag OLED-Verkapselung mit Wasserdampf- und sauerstoffabsorbierenden Zwischenschichten
KR101017608B1 (ko) * 2005-02-17 2011-02-28 세스 게터스 에스.피.에이 플렉시블 다층 게터
US20070013305A1 (en) * 2005-07-18 2007-01-18 Wang Carl B Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
ITMI20051500A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente permeabile
ITMI20051502A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti uno o piu' depositi di materiale getter ed uno strato di materiale per il trasporto di h02o
DE102005050561A1 (de) * 2005-10-17 2007-04-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Element zur flächigen Beleuchtung
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
KR100645705B1 (ko) * 2006-01-27 2006-11-15 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8453393B2 (en) * 2006-08-25 2013-06-04 Raytheon Company Encapsulated and vented particulate thermal insulation
JP4844322B2 (ja) * 2006-09-26 2011-12-28 パナソニック電工株式会社 真空封止デバイスの製造方法
KR100922349B1 (ko) * 2007-08-28 2009-10-21 삼성모바일디스플레이주식회사 유기 발광 표시 장치
KR101464305B1 (ko) * 2007-09-11 2014-11-21 주식회사 동진쎄미켐 게터 페이스트 조성물
ITMI20071903A1 (it) * 2007-10-04 2009-04-05 Getters Spa Metodo per la produzione di pannelli solari mediante l'impiego di un tristrato polimerico comprendente un sistema getter composito
US7947536B2 (en) * 2007-11-29 2011-05-24 E. I. Du Pont De Nemours And Company Process for forming encapsulated electronic devices
JP5128670B2 (ja) * 2008-08-27 2013-01-23 セイコーインスツル株式会社 圧電振動子、発振器、電子機器及び電波時計、並びに圧電振動子の製造方法
WO2010023728A1 (ja) 2008-08-27 2010-03-04 セイコーインスツル株式会社 圧電振動子の製造方法、圧電振動子、発振器、電子機器および電波時計
KR101180234B1 (ko) * 2009-04-03 2012-09-05 (주)엘지하우시스 디자인층을 구비한 건물 일체형 태양전지 모듈
WO2010118198A1 (en) * 2009-04-09 2010-10-14 E. I. Du Pont De Nemours And Company Glass compositions used in conductors for photovoltaic cells
US20100258165A1 (en) * 2009-04-09 2010-10-14 E.I. Du Pont De Nemours And Company Glass compositions used in conductors for photovoltaic cells
US9099679B2 (en) * 2009-06-01 2015-08-04 Sumitomo Chemical Company Limited Encapsulation process and structure for electronic devices
EP2267818B1 (en) 2009-06-22 2017-03-22 Novaled GmbH Organic lighting device
WO2011125414A1 (ja) * 2010-04-01 2011-10-13 株式会社村田製作所 電子部品及びその製造方法
TWI443784B (zh) 2010-07-29 2014-07-01 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
DE102010038986A1 (de) * 2010-08-05 2012-02-09 Endress + Hauser Gmbh + Co. Kg Kompositwerkstoff, Formkörper, elektronisches Gerät mit Formkörper, und Verfahren zur Herstellung für einen Formkörper
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
KR20120065136A (ko) * 2010-12-10 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치와 이의 제조 방법 및 이의 제조 설비
DE102011056742B4 (de) * 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht in einem Kraftfahrzeug
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
DE102012224310A1 (de) * 2012-12-21 2014-06-26 Tesa Se Gettermaterial enthaltendes Klebeband
WO2014136359A1 (ja) 2013-03-07 2014-09-12 ローム株式会社 有機薄膜太陽電池およびその製造方法、および電子機器
JP2014175380A (ja) * 2013-03-07 2014-09-22 Rohm Co Ltd 有機薄膜太陽電池およびその製造方法
JP2014192188A (ja) * 2013-03-26 2014-10-06 Rohm Co Ltd 有機薄膜太陽電池およびその製造方法、および電子機器
JP6082294B2 (ja) * 2013-03-26 2017-02-15 ローム株式会社 有機薄膜太陽電池およびその製造方法、および電子機器
CN104064674A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件
JP6185269B2 (ja) * 2013-03-27 2017-08-23 京セラ株式会社 電子装置および電子装置の製造方法
SG11201601675RA (en) * 2013-09-06 2016-04-28 Entegris Inc Substrate containment with enhanced solid getter
JP6040140B2 (ja) * 2013-12-06 2016-12-07 双葉電子工業株式会社 有機エレクトロルミネッセンスデバイス
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
KR20160116155A (ko) * 2015-03-26 2016-10-07 삼성디스플레이 주식회사 유기 발광 표시 장치
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
CN107614085B (zh) * 2015-05-26 2021-01-19 唐纳森公司 用于外壳的可定制湿度的吸附性组件
CN106257702A (zh) * 2015-06-20 2016-12-28 东莞日阵薄膜光伏技术有限公司 防止湿气、氧对钙钛矿吸收层侵蚀及延长电池寿命的方法
CN105047690B (zh) * 2015-08-27 2020-12-04 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置
CN106810982B (zh) * 2017-01-18 2021-08-03 安徽益东惠电子科技有限公司 一种用于吸收气密性封装器件有害气体的吸气剂浆料、其制备方法及其所得涂层
KR102373995B1 (ko) 2017-10-30 2022-03-11 엘지디스플레이 주식회사 터치 스크린 일체형 표시 장치
US11394183B2 (en) 2017-12-22 2022-07-19 Milwaukee Electric Tool Corporation Knife accessory for hot stick
WO2019188424A1 (ja) 2018-03-30 2019-10-03 パナソニックＩｐマネジメント株式会社 ゲッタ材、ゲッタ材の製造方法、ゲッタ材含有組成物の製造方法、及びガラスパネルユニットの製造方法
DE102018208168A1 (de) * 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
CN109331615A (zh) * 2018-09-26 2019-02-15 昂纳信息技术（深圳）有限公司 一种吸气剂的固定方法以及一种吸气结构
KR102605376B1 (ko) 2018-12-31 2023-11-23 삼성디스플레이 주식회사 표시 장치
CN114267809B (zh) * 2021-12-15 2023-11-03 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
JP2023119361A (ja) * 2022-02-16 2023-08-28 日本板硝子株式会社 複層ガラスパネル
DE102023200287A1 (de) * 2023-01-16 2024-08-01 Mahle International Gmbh Ventil für eine Brennkraftmaschine und Herstellungsverfahren

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005774A1 (en) * 2001-05-24 2003-01-16 Orion Electric Co., Ltd. Container for encapsulating oled and manufacturing method thereof
JP2004227792A (ja) * 2003-01-20 2004-08-12 Renesas Technology Corp 有機エレクトロルミネッセンス表示装置

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1626682A (en) * 1921-05-18 1927-05-03 Westinghouse Lamp Co Getter and method of applying the same
US1655248A (en) * 1924-08-16 1928-01-03 Panay Horizontal Show Jar Comp Moisture-regulating device
US2295694A (en) * 1941-06-19 1942-09-15 Westinghouse Electric & Mfg Co Water vapor getter
US3338034A (en) * 1963-11-12 1967-08-29 Union Carbide Corp Adsorbent-coated thermal panels
US3896042A (en) * 1974-02-15 1975-07-22 Us Energy Low temperature, low pressure hydrogen gettering
JPS5117668A (en) * 1974-08-05 1976-02-12 Matsushita Electric Industrial Co Ltd Handotaipatsukeeji
US4244722A (en) * 1977-12-09 1981-01-13 Noboru Tsuya Method for manufacturing thin and flexible ribbon of dielectric material having high dielectric constant
US4424144A (en) * 1981-11-16 1984-01-03 W. R. Grace & Co. Preparation of binderless 3A adsorbents
US5675212A (en) * 1992-04-10 1997-10-07 Candescent Technologies Corporation Spacer structures for use in flat panel displays and methods for forming same
US5051654A (en) * 1988-12-16 1991-09-24 Loctite Luminescent Systems, Inc. Electroluminescent lamp and method of manufacture
JP2984317B2 (ja) * 1990-05-02 1999-11-29 株式会社トクヤマ ゼオライト組成物の製造方法
US5304419A (en) * 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
GB9101456D0 (en) * 1991-01-23 1991-03-06 Exxon Chemical Patents Inc Process for producing substantially binder-free zeolite
US5244707A (en) * 1992-01-10 1993-09-14 Shores A Andrew Enclosure for electronic devices
US5434472A (en) * 1992-04-15 1995-07-18 United States Philips Corporation High-pressure sodium discharge lamp with getter
US5401706A (en) * 1993-01-06 1995-03-28 Semco Incorporated Desiccant-coated substrate and method of manufacture
EP0623944B1 (en) * 1993-05-05 1997-07-02 AT&T Corp. Flat panel display apparatus, and method of making same
US5300130A (en) * 1993-07-26 1994-04-05 Saint Gobain/Norton Industrial Ceramics Corp. Polishing material
WO1996008122A1 (fr) * 1994-09-08 1996-03-14 Idemitsu Kosan Co., Ltd. Procede d'enrobage d'un element electroluminescent organique et d'un autre element electroluminescent organique
US5696785A (en) * 1994-10-11 1997-12-09 Corning Incorporated Impurity getters in laser enclosures
JP3423511B2 (ja) * 1994-12-14 2003-07-07 キヤノン株式会社 画像形成装置及びゲッタ材の活性化方法
CA2162095A1 (en) * 1994-12-27 1996-06-28 Jeffery Alan Demeritt Getter housing for electronic packages
US5612256A (en) * 1995-02-10 1997-03-18 Micron Display Technology, Inc. Multi-layer electrical interconnection structures and fabrication methods
US5763998A (en) * 1995-09-14 1998-06-09 Chorus Corporation Field emission display arrangement with improved vacuum control
US5697825A (en) * 1995-09-29 1997-12-16 Micron Display Technology, Inc. Method for evacuating and sealing field emission displays
DE19603746A1 (de) * 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem
JPH09148066A (ja) * 1995-11-24 1997-06-06 Pioneer Electron Corp 有機ｅｌ素子
JP2834064B2 (ja) * 1996-03-29 1998-12-09 鹿児島日本電気株式会社 蛍光表示パネル
JPH1074583A (ja) * 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
US6426484B1 (en) * 1996-09-10 2002-07-30 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
SG125044A1 (en) * 1996-10-14 2006-09-29 Mitsubishi Gas Chemical Co Oxygen absorption composition
US5964630A (en) * 1996-12-23 1999-10-12 Candescent Technologies Corporation Method of increasing resistance of flat-panel device to bending, and associated getter-containing flat-panel device
US5931713A (en) * 1997-03-19 1999-08-03 Micron Technology, Inc. Display device with grille having getter material
US6069443A (en) * 1997-06-23 2000-05-30 Fed Corporation Passive matrix OLED display
US5920080A (en) * 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US6004527A (en) * 1997-09-29 1999-12-21 Abb Lummus Global Inc. Method for making molecular sieves and novel molecular sieve compositions
IT1295366B1 (it) * 1997-10-20 1999-05-12 Getters Spa Sistema getter per pannelli piatti al plasma impiegati come schermi
US6168490B1 (en) * 1997-12-19 2001-01-02 Sarnoff Corporation Back panel for a plasma display device
US6113450A (en) * 1998-05-14 2000-09-05 Candescent Technologies Corporation Seal material frit frame for flat panel displays
US6081071A (en) * 1998-05-18 2000-06-27 Motorola, Inc. Electroluminescent apparatus and methods of manufacturing and encapsulating
JP3478753B2 (ja) * 1999-02-24 2003-12-15 キヤノン株式会社 画像形成装置
JP3518855B2 (ja) * 1999-02-26 2004-04-12 キヤノン株式会社 ゲッター、ゲッターを有する気密容器および画像形成装置、ゲッターの製造方法
DE60036508T2 (de) * 1999-06-18 2008-06-26 Nippon Shokubai Co., Ltd. Formling aus binderfreien Zeolith , Verfahren zu seiner Herstellung und seine Verwendung
US6422824B1 (en) * 1999-09-15 2002-07-23 Industrial Technology Research Institute Getting assembly for vacuum display panels
FR2798923B1 (fr) * 1999-09-29 2001-12-14 Inst Francais Du Petrole Procede de preparation d'une zeolithe de type structural mtt utilisant des precurseurs specifiques du structurant
DE19959957A1 (de) * 1999-12-13 2001-06-21 Sued Chemie Ag Plättchenförmige Preßkörper
US20030015687A1 (en) * 2001-01-08 2003-01-23 Sud-Chemie Ag Plate-shaped pressed bodies
US20020190661A1 (en) * 2000-01-27 2002-12-19 General Electric Company AC powered oled device
US6391809B1 (en) * 1999-12-30 2002-05-21 Corning Incorporated Copper alumino-silicate glasses
EP1252642A1 (en) * 2000-01-21 2002-10-30 Ceravision Technology Limited Visual display
US6608283B2 (en) * 2000-02-08 2003-08-19 Emagin Corporation Apparatus and method for solder-sealing an active matrix organic light emitting diode
CN1165065C (zh) * 2000-03-23 2004-09-01 株式会社东芝 平面显示装置及其衬垫组件和它们的制法与制造用模具
JP4526682B2 (ja) * 2000-03-28 2010-08-18 日東電工株式会社 エレクトロルミネッセンス素子
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
US6333460B1 (en) * 2000-04-14 2001-12-25 International Business Machines Corporation Structural support for direct lid attach
US6605483B2 (en) * 2000-04-27 2003-08-12 Add-Vision, Inc. Screen printing light-emitting polymer patterned devices
JP3491888B2 (ja) * 2000-04-27 2004-01-26 株式会社 ルミナスジャパン 脱落のない固着性液状ゲッター
JP3936151B2 (ja) * 2000-05-08 2007-06-27 双葉電子工業株式会社 有機ｅｌ素子
US6819042B2 (en) * 2000-05-17 2004-11-16 Dynic Corporation Organic EL device and method for its manufacture
JP2001332708A (ja) * 2000-05-19 2001-11-30 Nec Corp 不揮発性半導体記憶装置及びその製造方法
US6465953B1 (en) * 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
DE10065946A1 (de) * 2000-12-12 2002-06-13 Sued Chemie Ag Plättchenförmige Presskörper
US6703780B2 (en) * 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6554672B2 (en) * 2001-03-12 2003-04-29 Micron Technology, Inc. Flat panel display, method of high vacuum sealing
CN1306538C (zh) * 2001-04-23 2007-03-21 株式会社东芝 图像显示器件及其制造方法和制造装置
US6740145B2 (en) * 2001-08-08 2004-05-25 Eastman Kodak Company Desiccants and desiccant packages for highly moisture-sensitive electronic devices
US6888307B2 (en) * 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
JP2003086123A (ja) * 2001-09-14 2003-03-20 Canon Inc 画像表示装置
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
TW517356B (en) * 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
US7049757B2 (en) * 2002-08-05 2006-05-23 General Electric Company Series connected OLED structure and fabrication method
US6891326B2 (en) * 2002-11-15 2005-05-10 Universal Display Corporation Structure and method of fabricating organic devices
KR100529071B1 (ko) * 2002-11-26 2005-11-15 삼성에스디아이 주식회사 소음을 저감시킨 봉착 구조를 갖는 플라즈마 디스플레이 패널
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003005774A1 (en) * 2001-05-24 2003-01-16 Orion Electric Co., Ltd. Container for encapsulating oled and manufacturing method thereof
JP2004227792A (ja) * 2003-01-20 2004-08-12 Renesas Technology Corp 有機エレクトロルミネッセンス表示装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104591526B (zh) * 2009-07-17 2017-07-28 康宁股份有限公司 用于密封玻璃封装体的熔接盖板
CN102695941A (zh) * 2009-11-12 2012-09-26 萨基姆防务安全公司 陀螺仪传感器
CN102695941B (zh) * 2009-11-12 2015-11-25 萨基姆防务安全公司 陀螺仪传感器
CN103079818A (zh) * 2010-07-02 2013-05-01 3M创新有限公司 阻挡组件
CN102978585A (zh) * 2011-09-05 2013-03-20 Sfa工程股份有限公司 用于平板显示器的化学气相沉积装置
CN103988312A (zh) * 2011-10-13 2014-08-13 Lg伊诺特有限公司 太阳能电池及使用其的太阳能电池模块
US9362430B2 (en) 2011-10-13 2016-06-07 Lg Innotek Co., Ltd. Solar cell and solar cell module using the same
CN103988312B (zh) * 2011-10-13 2016-08-24 Lg伊诺特有限公司 太阳能电池及使用其的太阳能电池模块
CN107254206A (zh) * 2012-01-19 2017-10-17 纳米技术有限公司 用于发光应用的模制纳米粒子磷光体
CN107254206B (zh) * 2012-01-19 2021-04-27 纳米技术有限公司 用于发光应用的模制纳米粒子磷光体
CN110574182A (zh) * 2017-04-19 2019-12-13 万佳雷射有限公司 密封的形成方法，密封单元的制造方法，密封单元以及形成密封的装置

Also Published As

Publication number Publication date
KR20060123286A (ko) 2006-12-01
JP2007511102A (ja) 2007-04-26
WO2005050736A1 (en) 2005-06-02
CN1894790B (zh) 2011-06-22
TW200525002A (en) 2005-08-01
US20050238803A1 (en) 2005-10-27
CN1894790A (zh) 2007-01-10
HK1095428A1 (en) 2007-05-04

Similar Documents

Publication Publication Date Title
CN1871718A (zh) 用于电子器件的封装组件
US20100270919A1 (en) Flat plate encapsulation assembly for electronic devices
JP4980718B2 (ja) 電子デバイス用の封入アセンブリ
EP2225184B1 (en) Frit-containing pastes for producing sintered frit patterns on glass sheets
JP5178204B2 (ja) フリットで密封されたガラスパッケージおよびその製造方法
KR101464321B1 (ko) 저융점 프릿 페이스트 조성물 및 이를 이용한 전기소자의밀봉방법
TWI391359B (zh) 不含銻玻璃及不含銻玻璃料及利用玻璃料密閉性密封玻璃封裝
CN103717544B (zh) 用于制造转换元件的方法以及转换元件
CN1798708A (zh) 密封的玻璃外壳及制造方法
CN1656612A (zh) 用于高频的玻璃材料
CN108376673B (zh) 合成石英玻璃盖前体、合成石英玻璃盖及其制备方法
HK1094277A (en) Encapsulation assembly for electronic devices
JP2007031565A (ja) 硬化性シリコーン樹脂組成物、それを用いた気密容器または電子部品の製造方法
JPWO2009031684A1 (ja) ガラス被覆発光素子及びガラス被覆発光装置
JP2009130105A (ja) ガラス被覆発光素子の製造方法、ガラス被覆発光装置及びその製造方法
KR20110064760A (ko) 전기소자 밀봉용 유리 프릿 페이스트 조성물 및 상기 유리 프릿 페이스트 조성물을 사용하는 전기소자의 밀봉 방법
KR20110064074A (ko) 신규한 유리 프릿, 전기소자 밀봉용 유리 프릿 페이스트 조성물, 및 상기 유리 프릿 페이스트 조성물을 사용하는 전기소자의 밀봉 방법
MXPA06005270A (es) Montaje de encapsulacion para dispositivos electronicos
KR20110065951A (ko) 신규한 유리 프릿, 전기소자 밀봉용 유리 프릿 페이스트 조성물, 및 상기 유리 프릿 페이스트 조성물을 사용하는 전기소자의 밀봉 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1094277

Country of ref document: HK

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1094277

Country of ref document: HK

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20061129