JP2007510306A5 - - Google Patents

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Publication number
JP2007510306A5
JP2007510306A5 JP2006537969A JP2006537969A JP2007510306A5 JP 2007510306 A5 JP2007510306 A5 JP 2007510306A5 JP 2006537969 A JP2006537969 A JP 2006537969A JP 2006537969 A JP2006537969 A JP 2006537969A JP 2007510306 A5 JP2007510306 A5 JP 2007510306A5
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JP
Japan
Prior art keywords
top surface
substrate
composition
opening
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006537969A
Other languages
English (en)
Japanese (ja)
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JP2007510306A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/025044 external-priority patent/WO2005045903A2/en
Publication of JP2007510306A publication Critical patent/JP2007510306A/ja
Publication of JP2007510306A5 publication Critical patent/JP2007510306A5/ja
Pending legal-status Critical Current

Links

JP2006537969A 2003-10-28 2004-08-03 平坦な上面を有するパッドの製造方法 Pending JP2007510306A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51510903P 2003-10-28 2003-10-28
PCT/US2004/025044 WO2005045903A2 (en) 2003-10-28 2004-08-03 Method for making a flat-top pad

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012231885A Division JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Publications (2)

Publication Number Publication Date
JP2007510306A JP2007510306A (ja) 2007-04-19
JP2007510306A5 true JP2007510306A5 (enExample) 2010-09-02

Family

ID=34572805

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006537969A Pending JP2007510306A (ja) 2003-10-28 2004-08-03 平坦な上面を有するパッドの製造方法
JP2012231885A Pending JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012231885A Pending JP2013051428A (ja) 2003-10-28 2012-10-19 基板に組成物の平坦な上面を有する堆積物を塗布することを包含する方法

Country Status (6)

Country Link
US (1) US7485202B2 (enExample)
EP (1) EP1680811A2 (enExample)
JP (2) JP2007510306A (enExample)
KR (1) KR101246638B1 (enExample)
TW (1) TW200523115A (enExample)
WO (1) WO2005045903A2 (enExample)

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EP1954114A1 (en) * 2006-09-30 2008-08-06 Umicore AG & Co. KG Use of an adhesive composition for die-attaching high power semiconductors
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
TWI456707B (zh) * 2008-01-28 2014-10-11 瑞薩電子股份有限公司 半導體裝置及其製造方法
DE102008024704A1 (de) * 2008-04-17 2009-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
JP2012104790A (ja) * 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
JP5348147B2 (ja) * 2011-01-11 2013-11-20 信越化学工業株式会社 仮接着材組成物、及び薄型ウエハの製造方法
WO2012128875A1 (en) * 2011-03-22 2012-09-27 Dow Corning Corporation Thermal management within an led assembly
KR101381119B1 (ko) * 2012-12-28 2014-04-04 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
US9269647B2 (en) * 2014-05-29 2016-02-23 Samsung Electronics Co., Ltd. Semiconductor package having heat dissipating member
JP6620703B2 (ja) * 2016-08-16 2019-12-18 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法
WO2019130956A1 (ja) 2017-12-29 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 発光モジュール、表示装置、および、それらの製造方法
EP4369393A1 (de) * 2022-11-10 2024-05-15 Siemens Aktiengesellschaft Halbleiteranordnung mit einem schaltbaren halbleiterelement und verfahren zur herstellung derselben

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