JP2002538626A5 - - Google Patents

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Publication number
JP2002538626A5
JP2002538626A5 JP2000603092A JP2000603092A JP2002538626A5 JP 2002538626 A5 JP2002538626 A5 JP 2002538626A5 JP 2000603092 A JP2000603092 A JP 2000603092A JP 2000603092 A JP2000603092 A JP 2000603092A JP 2002538626 A5 JP2002538626 A5 JP 2002538626A5
Authority
JP
Japan
Prior art keywords
organic substrate
integrated circuit
adhesive strength
attached
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000603092A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002538626A (ja
Filing date
Publication date
Priority claimed from US09/261,849 external-priority patent/US20020014688A1/en
Application filed filed Critical
Publication of JP2002538626A publication Critical patent/JP2002538626A/ja
Publication of JP2002538626A5 publication Critical patent/JP2002538626A5/ja
Pending legal-status Critical Current

Links

JP2000603092A 1999-03-03 2000-02-08 ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ Pending JP2002538626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,849 1999-03-03
US09/261,849 US20020014688A1 (en) 1999-03-03 1999-03-03 Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
PCT/US2000/003242 WO2000052756A1 (en) 1999-03-03 2000-02-08 A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials

Publications (2)

Publication Number Publication Date
JP2002538626A JP2002538626A (ja) 2002-11-12
JP2002538626A5 true JP2002538626A5 (enExample) 2007-03-29

Family

ID=22995146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000603092A Pending JP2002538626A (ja) 1999-03-03 2000-02-08 ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ

Country Status (7)

Country Link
US (2) US20020014688A1 (enExample)
JP (1) JP2002538626A (enExample)
KR (1) KR100522383B1 (enExample)
CN (1) CN1191627C (enExample)
AU (1) AU2986000A (enExample)
MX (1) MXPA01008580A (enExample)
WO (1) WO2000052756A1 (enExample)

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US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US20090279275A1 (en) * 2008-05-09 2009-11-12 Stephen Peter Ayotte Method of attaching an integrated circuit chip to a module
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US8686749B2 (en) * 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
JP2012049175A (ja) * 2010-08-24 2012-03-08 Toshiba Corp 半導体装置の製造方法
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US9559064B2 (en) 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
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US9524956B2 (en) 2014-10-31 2016-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure and method
WO2017180482A1 (en) * 2016-04-11 2017-10-19 Paradromics, Inc. Neural-interface probe and methods of packaging the same
WO2018183967A1 (en) 2017-03-30 2018-10-04 Paradromics, Inc. Patterned microwire bundles and methods of producing the same
US11502047B2 (en) 2017-09-15 2022-11-15 Cryptography Research Inc. Packaging techniques for backside mesh connectivity
US11075133B2 (en) 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
CN110660752A (zh) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 半导体装置封装体及其制造方法
US12171995B1 (en) 2021-10-07 2024-12-24 Paradromics, Inc. Methods for improved biocompatibility for human implanted medical devices

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