JP2003203946A5 - - Google Patents

Download PDF

Info

Publication number
JP2003203946A5
JP2003203946A5 JP2003009971A JP2003009971A JP2003203946A5 JP 2003203946 A5 JP2003203946 A5 JP 2003203946A5 JP 2003009971 A JP2003009971 A JP 2003009971A JP 2003009971 A JP2003009971 A JP 2003009971A JP 2003203946 A5 JP2003203946 A5 JP 2003203946A5
Authority
JP
Japan
Prior art keywords
thermoplastic resin
semiconductor chip
wiring board
mounting method
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003009971A
Other languages
English (en)
Japanese (ja)
Other versions
JP3584404B2 (ja
JP2003203946A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003009971A priority Critical patent/JP3584404B2/ja
Priority claimed from JP2003009971A external-priority patent/JP3584404B2/ja
Publication of JP2003203946A publication Critical patent/JP2003203946A/ja
Application granted granted Critical
Publication of JP3584404B2 publication Critical patent/JP3584404B2/ja
Publication of JP2003203946A5 publication Critical patent/JP2003203946A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2003009971A 2003-01-17 2003-01-17 半導体チップの実装方法 Expired - Lifetime JP3584404B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003009971A JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003009971A JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP33340999A Division JP3451373B2 (ja) 1999-11-24 1999-11-24 電磁波読み取り可能なデータキャリアの製造方法

Publications (3)

Publication Number Publication Date
JP2003203946A JP2003203946A (ja) 2003-07-18
JP3584404B2 JP3584404B2 (ja) 2004-11-04
JP2003203946A5 true JP2003203946A5 (enExample) 2005-02-17

Family

ID=27656086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003009971A Expired - Lifetime JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Country Status (1)

Country Link
JP (1) JP3584404B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438558B2 (ja) * 2003-11-12 2010-03-24 株式会社日立製作所 Ｒｆｉｄタグの製造方法
JP4251104B2 (ja) 2004-03-31 2009-04-08 株式会社日立製作所 Ｒｆｉｄタグの製造方法
JP5644286B2 (ja) 2010-09-07 2014-12-24 オムロン株式会社 電子部品の表面実装方法及び電子部品が実装された基板
TWI891288B (zh) 2023-03-24 2025-07-21 日商芝浦機械電子裝置股份有限公司 安裝工具及安裝裝置

Similar Documents

Publication Publication Date Title
EP1801867A3 (en) Method of flip-chip mounting a semiconductor chip to a circuit board, circuit board for flip-chip connection and method of manufacturing the same
TWI305036B (en) Sensor-type package structure and fabrication method thereof
JP5321601B2 (ja) 半導体装置
JP2006511964A5 (enExample)
SG100674A1 (en) Semiconductor device and manufacturing method of the same
JP2001237274A5 (enExample)
TW201203500A (en) Semiconductor package and manufacturing method thereof
TWI385738B (zh) Method for Eliminating Bubble of Adhesive Adhesive Layer in Semiconductor Packaging
JP2004503939A (ja) 赤外線加熱によるはんだバンプおよびワイヤボンディング
KR101525158B1 (ko) 인쇄회로기판 조립체 및 그 제조방법
JP2003203946A5 (enExample)
JP2004524703A5 (enExample)
US7845074B2 (en) Method for manufacturing electronic parts module
CN111128760A (zh) 一种基于扇出型封装工艺的芯片封装方法及芯片封装结构
JP2010251346A5 (enExample)
JP4421118B2 (ja) 半導体装置製造方法
JP2000155820A (ja) 非接触ｉｃカードおよびその製造方法
JP2003229456A5 (enExample)
JP3196583B2 (ja) バンプ付ワークの実装方法
CN114883205B (zh) 封装方法
JPH10340977A (ja) 電子部品およびその製造方法
WO2002078079A1 (fr) Boitier de dispositif semi-conducteur et procede de fabrication correspondant
JP3703960B2 (ja) 半導体装置
JPH04302457A (ja) 混成集積回路基板の製造方法
JPH01272125A (ja) 半導体装置の製造方法