JP3584404B2 - 半導体チップの実装方法 - Google Patents

半導体チップの実装方法 Download PDF

Info

Publication number
JP3584404B2
JP3584404B2 JP2003009971A JP2003009971A JP3584404B2 JP 3584404 B2 JP3584404 B2 JP 3584404B2 JP 2003009971 A JP2003009971 A JP 2003009971A JP 2003009971 A JP2003009971 A JP 2003009971A JP 3584404 B2 JP3584404 B2 JP 3584404B2
Authority
JP
Japan
Prior art keywords
thermoplastic resin
bump
electrode region
wiring board
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003009971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003203946A5 (enExample
JP2003203946A (ja
Inventor
若浩 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2003009971A priority Critical patent/JP3584404B2/ja
Publication of JP2003203946A publication Critical patent/JP2003203946A/ja
Application granted granted Critical
Publication of JP3584404B2 publication Critical patent/JP3584404B2/ja
Publication of JP2003203946A5 publication Critical patent/JP2003203946A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Landscapes

  • Wire Bonding (AREA)
JP2003009971A 2003-01-17 2003-01-17 半導体チップの実装方法 Expired - Lifetime JP3584404B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003009971A JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003009971A JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP33340999A Division JP3451373B2 (ja) 1999-11-24 1999-11-24 電磁波読み取り可能なデータキャリアの製造方法

Publications (3)

Publication Number Publication Date
JP2003203946A JP2003203946A (ja) 2003-07-18
JP3584404B2 true JP3584404B2 (ja) 2004-11-04
JP2003203946A5 JP2003203946A5 (enExample) 2005-02-17

Family

ID=27656086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003009971A Expired - Lifetime JP3584404B2 (ja) 2003-01-17 2003-01-17 半導体チップの実装方法

Country Status (1)

Country Link
JP (1) JP3584404B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012032840A1 (ja) 2010-09-07 2012-03-15 オムロン株式会社 電子部品の表面実装方法及び電子部品が実装された基板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438558B2 (ja) * 2003-11-12 2010-03-24 株式会社日立製作所 Ｒｆｉｄタグの製造方法
JP4251104B2 (ja) 2004-03-31 2009-04-08 株式会社日立製作所 Ｒｆｉｄタグの製造方法
TWI891288B (zh) 2023-03-24 2025-07-21 日商芝浦機械電子裝置股份有限公司 安裝工具及安裝裝置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012032840A1 (ja) 2010-09-07 2012-03-15 オムロン株式会社 電子部品の表面実装方法及び電子部品が実装された基板

Also Published As

Publication number Publication date
JP2003203946A (ja) 2003-07-18

Similar Documents

Publication Publication Date Title
JP3451373B2 (ja) 電磁波読み取り可能なデータキャリアの製造方法
US7276436B2 (en) Manufacturing method for electronic component module and electromagnetically readable data carrier
JP3928682B2 (ja) 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
JP2004516538A (ja) スマートラベルウェブおよびその製造方法
WO2001006558A1 (en) Package of semiconductor device and method of manufacture thereof
JP2005111928A (ja) 電子回路装置およびその製造方法並びに電子回路装置の製造装置
JP2005275802A (ja) 電波読み取り可能なデータキャリアの製造方法および該製造方法に用いる基板並びに電子部品モジュール
JP3584404B2 (ja) 半導体チップの実装方法
JP4179736B2 (ja) 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法
JP2007042087A (ja) Ｒｆｉｄタグ及びその製造方法
JP2000151057A (ja) 電子部品実装構造体およびその製造方法並びに無線ｉｃカードおよびその製造方法
JP2000231614A (ja) 電磁波読み取り可能なデータキャリア
JP2008235840A (ja) 半導体装置の製造方法、半導体製造装置および半導体モジュール
MX2008012339A (es) Metodos para sujetar un montaje de circuito integrado de un chip invertido a un sustrato.
JP5024190B2 (ja) Ｉｃモジュール製造方法
JPH11134467A (ja) 電子部品保持フィルム及びその製造方法
JP2008235839A (ja) 半導体装置およびその製造方法
JP2004062634A (ja) 非接触通信媒体の接合方法および非接触通信媒体
JP3827014B2 (ja) 電磁波読み取り可能なデータキャリア
JP3561478B2 (ja) フレキシブルｉｃモジュールの製造方法
JP2009258943A (ja) ストラップ、タグインレット及びｒｆｉｄタグ
JP2014115938A (ja) 半導体装置およびその製造方法
JP2005108259A5 (enExample)
JPH11274238A (ja) 電子部品の実装構造および電子部品の実装方法
JP2001185583A (ja) 半導体実装製品の製造方法および半導体実装製品

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040310

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040310

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20040310

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20040416

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040423

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040615

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040709

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040722

R150 Certificate of patent or registration of utility model

Ref document number: 3584404

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080813

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080813

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090813

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100813

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100813

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110813

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110813

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120813

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130813

Year of fee payment: 9

EXPY Cancellation because of completion of term