JP2005108259A5 - - Google Patents
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- Publication number
- JP2005108259A5 JP2005108259A5 JP2004365582A JP2004365582A JP2005108259A5 JP 2005108259 A5 JP2005108259 A5 JP 2005108259A5 JP 2004365582 A JP2004365582 A JP 2004365582A JP 2004365582 A JP2004365582 A JP 2004365582A JP 2005108259 A5 JP2005108259 A5 JP 2005108259A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- data carrier
- conductor pattern
- component module
- spiral conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 32
- 239000000463 material Substances 0.000 description 31
- 239000011889 copper foil Substances 0.000 description 29
- 238000005530 etching Methods 0.000 description 20
- 238000004382 potting Methods 0.000 description 14
- 229920002799 BoPET Polymers 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 5
- 238000007645 offset printing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010924 continuous production Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910021577 Iron(II) chloride Inorganic materials 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004365582A JP3827014B2 (ja) | 2004-12-17 | 2004-12-17 | 電磁波読み取り可能なデータキャリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004365582A JP3827014B2 (ja) | 2004-12-17 | 2004-12-17 | 電磁波読み取り可能なデータキャリア |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11034308A Division JP2000231614A (ja) | 1999-02-12 | 1999-02-12 | 電磁波読み取り可能なデータキャリア |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005108259A JP2005108259A (ja) | 2005-04-21 |
| JP2005108259A5 true JP2005108259A5 (enExample) | 2006-03-16 |
| JP3827014B2 JP3827014B2 (ja) | 2006-09-27 |
Family
ID=34545361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004365582A Expired - Lifetime JP3827014B2 (ja) | 2004-12-17 | 2004-12-17 | 電磁波読み取り可能なデータキャリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3827014B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9053402B2 (en) | 2007-05-14 | 2015-06-09 | Tateyama Kagaku Industry Co., Ltd. | Wireless IC tag and method for manufacturing wireless IC tag |
-
2004
- 2004-12-17 JP JP2004365582A patent/JP3827014B2/ja not_active Expired - Lifetime
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